A robot teaching position correcting method and system is provided. The robot is driven to move along wafer pick-and-place operation paths defined by a sequence of waypoints. Distances between the waypoint and a wafer supporter of the wafer carrier above the waypoint are detected by upper sensors provided on a top surface of the robot when the robot is positioned at the waypoint. Then, the position parameter of the waypoint is corrected accordingly, so as to ensure safe wafer handling.

A robot control method includes a teaching step, first processing step, modifying step, second processing step, and third processing step. In the modifying step, a third teaching point is changed to a second modified point, a fourth teaching point to a third modified point, and a fifth teaching point to a fourth modified point, based on a difference between a second teaching point and a first modified point. A profile modifying control to change the position of a work tool is applied, using a sensor mounted on the processing advancing direction side of the work tool, in the first processing step and the third processing step. An attitude of the work tool is changed during the second processing step.