Patent classifications
G05B2219/45026
ABNORMALITY DETECTION SYSTEM AND CONTROL BOARD
Provided is an abnormality detection system that includes a first controller configured to control a substrate processing apparatus and a second controller configured to control a device provided in the substrate processing apparatus according to an instruction from the first controller, thereby detecting an abnormality in the device. The second controller includes a storage unit configured to collect status signals for the device for a predetermined time and at a predetermined sampling interval in a predetermined cycle and accumulate the collected status signals for the device, and the first controller includes an abnormality determination unit configured to acquire the accumulated status signals for the device from the second controller at a time interval equal to or longer than the predetermined time, and determine presence or absence of an abnormality in the device.
Setup support device
A setup support device that improves the efficiency of setup of a component mounter by guiding supplying of feeders to a component supply device as preparation for setting of the feeders. The support setup device includes: a preparation cart on which are loaded multiple of the feeders used to perform multiple production jobs; and a feeder identifying section configured to identify multiple of the feeders to be set on a component supply device among the multiple feeders loaded on the preparation cart. The preparation cart includes a guidance section configured to issue guidance all at once for the identified multiple feeders to an operator performing the setup so as to supply the identified multiple feeders to the component supply device as preparation for setting the identified multiple feeders on the component supply device.
CALCULATION DEVICE
A calculation device for a work machine comprising a holding head including a holding tool configured to hold a lead component comprising a lead and a body and a moving device configured to move the holding head, the calculation device calculating a release position of the lead component held by the holding tool, when the work machine mounts the lead component on a board by inserting the lead of the lead component held by the holding tool into a hole formed on the board by operating the moving device.
Solder inspection apparatus and method of generating feedback information of solder inspection apparatus
A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support the printed circuit boards to be introduced into the solder inspection apparatus so as to put the printed circuit boards on standby; generating feedback information by using the input information and an inspection result of the printed circuit boards by the solder inspection apparatus; and transmitting the feedback information to the screen printer. Feedback information may be generated in consideration of the number of buffers, thereby preventing the feedback information from being excessively generated as well as ensuring the accuracy of the feedback information.
METHOD, SYSTEM AND DEVICE FOR IDENTIFYING A BIN IN AN SMT SYSTEM
A method in an automated Surface Mount Device (SMD) warehouse configured to store bins at predetermined positions within said automated Surface Mount Device (SMD) warehouse, the method comprising receiving a bin at a port of said automated Surface Mount Device (SMD) warehouse and scanning an identity tag attached to said bin to obtain a bin ID.
Method and system for populating printed circuit boards and computer program product for carrying out the method
Set-up families with associated set-ups are provided for populating printed circuit boards by means of a pick-and-place line. Printed circuit board types are associated with each set-up family and component types are associated with each set-up, such that a printed circuit board of a printed circuit board type in a set-up family is populated on the pick-and-place line by means of components of the component types associated with the set-up. Stocks of components of the component types of a set-up are provided by means of set-up tables on the pick-and-place line. A method for populating the printed circuit boards includes the steps of detecting printed circuit board types of which printed circuit boards are intended to be populated with components of associated component types, of associating detected printed circuit board types with a predetermined number of set-up families, and of optimizing the association operation with respect to a predetermined criterion.
WORK MACHINE
A work machine including a work head including a holding tool to pick up and hold a component, a rotating device to rotate the holding tool about an axis of the holding tool, a pivoting device to pivot the holding tool between a first attitude in which a distal end portion of the holding tool faces downward and a second attitude in which the distal end portion of the holding tool faces sideways; a moving device to move the work head; and a control device to control operation of the work head and the moving device, the control device including an operation control section to cause the holding tool to pivot from the first attitude to the second attitude, and to cause the holding tool to rotate from a holding angle that is a rotation angle when the component was picked up to a target angle.
MOUNTING BOARD MANUFACTURING SYSTEM AND MOUNTING BOARD MANUFACTURING METHOD
A mounting board manufacturing system includes: a component placer including a placing head and a placing head mover that moves the placing head to a target position for placing the component on the board; an inspector that inspects a placement position of the component by imaging the board; a correction value calculator that calculates a correction value for correcting the target position; a target position calculator that calculates the target position using the correction value; and a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value when the operation is resumed.
SUBSTRATE WORK SYSTEM
A board work system including: a conveying and holding device including a pair of rails configured to support a board, and a changing mechanism configured to change a distance between the pair of rails, the conveying and holding device being configured to convey the board supported by the rails and hold the board at a work position; a work device configured to perform work with respect to the board held by the conveying and holding device from an underside of the board; a moving device configured to move the work device; and a control device, the control device including an acquiring section configured to acquire a rail spacing distance that is the distance between the pair of rails, and an operation control section configured to control operation of the moving device based on the rail spacing distance acquired by the acquiring section.
Mounting board manufacturing system and mounting board manufacturing method
There is provided a mounting board manufacturing system including: a component placer including a placing head having a holding tool that holds a component and places the component on a board, and a placing head mover that moves the placing head to a target position for placing the component held by the holding tool at a component placement position of the board; an inspector that inspects a placement position of the component placed on the board by imaging the board on which the component is placed by the component placer; a correction value calculator that calculates a correction value for correcting the target position using an inspection result, and updates the correction value using a new inspection result when the new inspection result is obtained; a target position calculator that calculates the target position using the correction value; and a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value when the operation is resumed after the component placer stops the operation and the component is to be placed by the component placer.