A method of inserting an electronic components in through-hole technology, THT, into a printed circuit board, PCB by an industrial robot, based on reinforcement learning, includes grabbing, by means of a tool with universal fingers mounted to the end-effector of the industrial robot, the electronic component to be inserted into the PCB; moving the tool to a starting position being in close proximity to a final position of the electronic component; acquiring at least one image showing the tool, the electronic component and the PCB; calculating, on a basis of the at least one image, at least one movement instruction for the industrial robot; adjusting position of the tool on a basis of the at least one movement instruction, and repeating the steps until the electronic component is in the final position.

A method for managing electronic components includes a manufacturer-side process including preparing bulk cases provided with RFID tags storing unique IDs and including electronic components stored therein, storing manufacturer-side information in association with the unique IDs in a manufacturer-side-information storage area on a cloud, and shipping the electronic components on a per-bulk case basis, receiving the shipped bulk cases, reading the unique IDs stored in the RFID tags, and obtaining, based on the read unique IDs, the manufacturer-side information stored in the manufacturer-side-information storage area in the cloud.

A device for estimating a cause of a mounting error includes a first determination section configured to perform a process of determining whether the error occurrence status is biased under a condition that an individual as the first factor is specified according to a difference in the second factor, on each of multiple individuals as the first factor, a second determination section configured to perform a process of determining whether the error occurrence status is biased under a condition that an individual as the second factor is specified according to a difference in the first factor, on each of multiple individuals as the second factor, and a cause estimation section configured to estimate a causative individual causing the mounting error based on determination results in the first determination section and the second determination section.

An apparatus for handling microelectronic devices comprises a pick arm having a pick surface configured for receiving a microelectronic device thereon, drives for moving the pick arm and reorienting the pick surface in the X, Y and Z planes and about a horizontal rotational axis and a vertical rotational axis, and a sensor device carried by the pick arm and configured to detect at least one of at least one magnitude of force and at least one location of force applied between the pick surface and a structure contacted by the pick surface or a structure and a microelectronic device carried on the pick surface.

A management apparatus of a production facility, including: a facility condition collecting unit collecting facility condition information regarding conditions of the production facility from the production facility; an operation instruction creating unit creating operation instruction information indicating an instruction to perform an operation relating to the production facility on the facility condition information; an instruction transmitting unit transmitting the operation instruction information to a target; an operation information receiving unit receiving operation information regarding status of response to the operation instruction information; a management state information creating unit creating management state information including the operation instruction information, the operation information, and the production facility condition information; and an additional operation instruction issuing unit receiving additional operation instruction information indicating an instruction to perform an additional operation on the management state information, and causing the operation instruction creating unit to create operation instruction information including the additional operation instruction information.

A manufacturing management device includes a determination section configured to determine the necessity of maintenance on any of the multiple production devices during production by the production line; and a conveyance management section configured to stop loading circuit boards, at a predetermined time, onto a reference device among the multiple production devices when it is determined that maintenance is necessary, the reference device being positioned upstream in the production line from a maintenance target device having a cause for maintenance.

In a production management method of a substrate in a component mounting system having plural component mounting lines configured to include plural component mounting apparatuses, reading production data of an interrupt type substrate; collecting equipment data of each of the component mounting lines; and determining at least one component mounting line to produce the interrupt type substrate based on the read production data of the interrupt type substrate and the collected equipment data of each of the component mounting lines are performed.

A production schedule creating method includes: a sequence information acquiring step of acquiring production sequence information including a production sequence for producing a plurality of models of products and preparation work sequence information including a sequence of arrangement work of arranging members corresponding to the plurality of models on arrangement means which is attached to production equipment so as to arrange the members that are used for production of the products; an arrangement means information acquiring step of acquiring arrangement means information including production arrangement means information that is information of the arrangement means attached to the production equipment and equipment detached arrangement means information that is information of an equipment detached arrangement means that is not attached to the production equipment; and a schedule optimizing step of optimizing a production schedule obtained after a time point of acquisition of the arrangement means information, based on the production sequence information, the preparation work sequence information, and the arrangement means information.

A preparation schedule creating method includes: an information acquiring step of acquiring production schedule information including a production sequence, a commenceable time point, and a production deadline time point, member information related to the members, arrangement means information related to a state of arrangement means attached to production equipment and a state of equipment detached arrangement means detached from the production equipment, work quantity information related to a work quantity of arrangement work of arranging members on the arrangement means, worker information related to the number of workers that performs the arrangement work; a usable arrangement means selecting step of selecting a usable arrangement means based on the production schedule information and the arrangement means information; and a preparation work schedule determining step of determining the selected usable arrangement means as the usable arrangement means for one model in the preparation work schedule.

The robot apparatus includes a solder pot having a nozzle from which solder flows out, a flux ejection tool for ejecting flux, and a support tool for supporting the solder pot. The robot apparatus includes a table for supporting a workpiece, and a placement member on which the operation tools and the solder pot can be placed. The controller performs a flux application control for coupling the flux ejection tool to the robot and applying flux to the workpiece, a preheating control for coupling the support tool to the robot and arranging the solder pot below the workpiece so as to heat the workpiece, and a supply control for moving the nozzle of the solder pot closer to the workpiece and supplying the solder.