A method may include generating, by a camera having a view of an interior portion of a computer-numerically-controlled machine, an image comprising a pattern. The image can be transformed into a set of machine instructions for controlling the computer-numerically-controlled machine to effect a change in a material. The change can correspond to at least a portion of the pattern. At least one machine instruction from the set of machine instructions can be executed to control the computer-numerically-controlled machine to effect at least a portion of the change. The execution can include operating, in accordance with the at least one machine instruction, a tool coupled with the computer-numerically-controlled machine. The tool can configured to effect the change on the material. Related systems and articles of manufacture, including computer program products, are also provided.

A high current contact is disclosed having a contact pin for insertion into the high-current socket having a plurality of contact segments that are slotted in a radial direction for contacting an inner contact surface of the high-current socket; a guide sleeve surrounding the contact pin, which, by means of an at least central front pressing against the high-current socket relative to the contact pin in an axial direction from an initial position, in which the guide sleeve blocks an independent radial spreading of the contact segments in order to avoid a contact between the contacts segments protruding axially from the guide sleeve and the inner contact surface, is movable into a contact position that is set back with respect to the contact pin and in which the guide sleeve unblocks an independent radial spreading of the contact segments protruding from the guide sleeve for contacting the inner contact surface.

This robot system includes a robot, a tool which is attached to the robot, an imaging device, and a controller which controls the robot and the tool, and the controller is configured so that a distal end portion of the robot is placed at a plurality of calibration positions, the tool is operated at each of the calibration positions, images of light irradiated to an object or a trace left on the object due to tool operation processing are captured by the imaging device, and calibration is performed based on comparison between irradiation positions of the light or positions of the traces, which are in an image captured by the imaging device, and predetermined reference positions.

An NC device 20 determines, in a case where a size of an opening forming region in a predetermined direction is smaller than a predetermined maximum value, that the opening forming region is a first opening forming region, and determines, in a case where the size of the opening forming region in the predetermined direction is larger than a predetermined minimum value, that the opening forming region is an opening forming region where a scrap interfering with a laser head 16 is formed. In a case where the size of the opening forming region in the predetermined direction is smaller than the predetermined maximum value and larger than the predetermined minimum value, the device determines that the opening forming region in an interference width added region obtaining by adding a predetermined interference width to the opening forming region is a second opening forming region, and processes the second opening forming region prior to processing of the first opening forming region.

A machining route display device includes a display section for displaying a machining route based on coordinate values of a laser machining head calculated by a laser machining head coordinate calculator and display formats set by a first display format setting section and a second display format setting section. At least one of a display color of first data and a shade of the display color of the first data is changed in accordance with the first data acquired by a first data acquiring section, and at least one of a display color of second data and a shade the display color of the second data is changed in accordance with second data acquired by a second data acquiring section.

According to the invention, a Cartesian positioning device for positioning an optics includes an optics socket for holding the optics; a y actuating element for linear movement of the optics socket in the y direction, the y actuating element having a y slider at one end; an x actuating element for linear movement of the optics socket in the x direction, the x actuating element having an x slider at one end; wherein the x actuating element and the y actuating element are arranged on a support element and adjustable along the y direction. Furthermore, a laser machining head for machining a workpiece by means of a laser beam includes such a Cartesian positioning device for positioning an optics, the optics being arranged in a beam path of the laser machining head.

Methods and systems for operating a machine, the machine includes moveable axes and an apparatus for emitting an energy beam. A method includes the steps of providing a computing device or system; providing, the computing device or system, a program for operating the axes of the machine based on a CAD file, the program having a plurality of controller instructions for operating the axes; and providing the program to a controller of the machine. The computing device or system adds apparatus instructions to the program, each apparatus instruction corresponding to an energy beam radiation configuration of energy beam radiation configurations for the apparatus. Each time the controller runs a line of the program that has an apparatus instruction, the computing device or system operates the apparatus according to the apparatus instruction; and each apparatus instruction added to the program is a comment for the controller.

A 3D laser machining system comprises: a move state simulation unit that simulates a move state of a machining head using 3D CAD data about a workpiece containing material information defining thermophysical properties and 3D CAD data about a machining head under a condition of moving the machining head relative to the workpiece while the machining head is maintained at a predetermined angle a predetermined distance along a machining line in virtual space; a thermal fluid simulation unit that conducts non-stationary thermal fluid simulation for obtaining a temperature distribution in a region covering the workpiece to be changed by the move of the machining head outputting a laser beam; and a machining condition setting unit that sets a laser machining condition containing a relative move condition for the machining head and a laser beam output condition before laser machining on the basis of results of the simulations.

The present invention relates to a method for generating control data for the secondary machining of a solid body (1), in particular wafer, which is modified by means of laser beams (10). The interior of said solid body (1) has multiple modifications (12), said modifications (12) having been produced by means of laser beams (10). The method comprises the following steps: defining a criterion of analysis for analyzing the modifications (12) produced in the interior of the solid body (1); defining a threshold value with respect to the criterion of analysis, an analytical value on one side of the threshold value triggering a secondary machining registration; analyzing the wafer by means of an analytical unit (4), said analytical unit (4) analyzing the modifications (12) with respect to the criterion of analysis and outputting analytical values regarding the analyzed modifications, said analytical values lying above or below the threshold value; outputting location data with respect to the analyzed modifications, said location data containing information regarding in which region(s) of the solid body (1) the analytical value lie above or below the threshold value; and generating control data for controlling a laser treatment device (11) for the secondary machining of the solid body (1), said control data comprising at least the location data of the modifications (12) registered for secondary machining.

A high current contact is disclosed having a contact pin for insertion into the high-current socket having a plurality of contact segments that are slotted in a radial direction for contacting an inner contact surface of the high-current socket; a guide sleeve surrounding the contact pin, which, by means of an at least central front pressing against the high-current socket relative to the contact pin in an axial direction from an initial position, in which the guide sleeve blocks an independent radial spreading of the contact segments in order to avoid a contact between the contacts segments protruding axially from the guide sleeve and the inner contact surface, is movable into a contact position that is set back with respect to the contact pin and in which the guide sleeve unblocks an independent radial spreading of the contact segments protruding from the guide sleeve for contacting the inner contact surface.