A design method of a semiconductor manufacturing apparatus which can satisfy a specification required by a user is disclosed. The design method of the semiconductor manufacturing apparatus includes creating a program setting file; creating a program installer from the program setting file; operating a processing unit of the semiconductor manufacturing apparatus; specifying a sensor corresponding to the processing unit based on the operation of the processing unit; creating a sensor setting file storing information obtained by specifying the sensor; comparing a content of a requirement specification and a content of the sensor setting file to confirm a consistency between the content of the requirement specification and the content of the sensor setting file; and introducing a program into a memory of a controller by the program installer when the content of the requirement specification and the content of the sensor setting file are consistent with each other.

A method of generating training spectra for training of a neural network includes measuring a first plurality of training spectra from one or more sample substrates, measuring a characterizing value for each training spectra of the plurality of training spectra to generate a plurality of characterizing values with each training spectrum having an associated characterizing value, measuring a plurality of dummy spectra during processing of one or more dummy substrates, and generating a second plurality of training spectra by combining the first plurality of training spectra and the plurality of dummy spectra, there being a greater number of spectra in the second plurality of training spectra than in the first plurality of training spectra. Each training spectrum of the second plurality of training spectra having an associated characterizing value.

A polishing machine is described in which a surface treatment tool is moved across the surface of a workpiece in accordance with a predefined tool-path, in order to carry out the desired treatment process. The tool-path is non-periodic and preferably pseudo-random. Various techniques are described for generating data representing the tool-path to be followed. A technique is also described for determining optimum control parameters used to control the polishing machine for a given tool-path. The surface treatment may be a shaping technique in which material is removed from the surface, or a technique for adding material to the surface of the workpiece, or a technique for modifying the surface or a region under the surface of the workpiece.

The invention relates to a method for detecting, controlling and automatically compensating pressure in a polishing process, including: detecting a pressure between a polishing wheel and a polished workpiece by a detection shaft or a moment generated on the detection shaft, and outputting the detected pressure or moment to a controller; comparing the detected pressure or moment with a preset pressure or moment and determining whether there is a difference between them; calculating a compensation feeding amount based on the difference and outputting an adjustment signal to an adjustment shaft based on the compensation feeding amount; and moving the adjustment shaft correspondingly based on the adjustment signal so as to drive the polishing wheel or the polished workpiece to move correspondingly to adjust a relative position between the polishing wheel and the polished workpiece so that the difference keeps consistent.

A polishing machine is described in which a surface treatment tool is moved across the surface of a workpiece in accordance with a predefined tool-path, in order to carry out the desired treatment process. The tool-path is non-periodic and preferably pseudo-random. Various techniques are described for generating data representing the tool-path to be followed. A technique is also described for determining optimum control parameters used to control the polishing machine for a given tool-path. The surface treatment may be a shaping technique in which material is removed from the surface, or a technique for adding material to the surface of the workpiece, or a technique for modifying the surface or a region under the surface of the workpiece.

A polishing machine is described in which a surface treatment tool is moved across the surface of a workpiece in accordance with a predefined tool-path, in order to carry out the desired treatment process. The tool-path is non-periodic and preferably pseudo-random. Various techniques are described for generating data representing the tool-path to be followed. A technique is also described for determining optimum control parameters used to control the polishing machine for a given tool-path. The surface treatment may be a shaping technique in which material is removed from the surface, or a technique for adding material to the surface of the workpiece, or a technique for modifying the surface or a region under the surface of the workpiece.

A method and associated system for applying an optimized processing treatment to items in an industrial treatment line are described. First, settings for a value of a working parameter in the treatment line are defined. The settings are associated with value ranges of a parameter representative of an external property of items. Then, a value of the parameter representative of the external property of the item is measured. A setting for the value of the working parameter associated with a value range from the set of value ranges comprising the measured value is compared to the current setting of the working parameter. When a difference is detected between the associated setting and the current setting, the current setting is changed to the associated setting.

In a processing machine 1, an X-axis control unit 33X, in each control cycle Tc, controls the position of an X-axis table 9X in the X-direction by feedback. The Z-axis control unit 33Z, in each control cycle Tc, acquires an up-close detection value of the position of the Z-axis table 9Z in the Z-direction, computes a second deviation based on a difference between the acquired detection value and a target position, and controls a Z-axis drive source 23z so that the second deviation is reduced. The Z-axis control unit 33Z, in each control cycle Tc, acquires an up-close detection value of a first error comprised of a deviation of the X-axis table 9 in the Z-direction, and increases or reduces the second deviation based on the detection value of the first error so that at least a portion of an error in a relative position of a workpiece 103 and a tool 101 in the Z-direction originating from the first error is cancelled by movement of the Z-axis table 9Z in the Z-direction.