A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

A control system for a fluxer, the control system comprising: a variable speed pump configured to provide pressurised flow of liquid flux from a flux supply tank; a pulse-width-modulated (PWM) valve coupled to the variable speed pump; a jet nozzle coupled to the PWM valve and configured to eject a jet of flux drops onto a substrate to form flux points, lines or areas thereon; and a controller coupled to the variable speed pump and the PWM valve; wherein the controller is configured to generate PWM signals to control the PWM valve, and pump speed signals to control the variable speed pump, to thereby selectively and individually control volume of individual flux drops, and pressure and flow of the liquid flux, to form the flux points, lines or areas on the substrate.

A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

An apparatus includes at least one grip mechanism of a rework nozzle configured to grip an electrical component that is soldered to a printed circuit board. The apparatus includes at least one spring coupled to at least one grip mechanism, where the spring is configured to move beyond a minimum threshold in response to an initiation of a melt of a solder that attaches the electrical component to the printed circuit board. The apparatus includes at least one sensor coupled to at least one spring, where the sensor is configured to detect the move of at least one spring beyond the minimum threshold. At least one sensor is configured to communicate at least one activate signal in response to detection of the move of one or more springs beyond the minimum threshold.

A laser soldering system using dynamic light spot and a method thereof are provided. A laser module is controlled to radiate toward multi-lens to form a light spot on a soldering target for soldering, and a lens distance between the multi-lens is adjusted to adjust a light spot size. The disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.

A laser soldering method using dynamic light spot is provided and includes following steps: executing a soldering to control a laser module to radiate toward multi-lens to form a light spot on a soldering target; and, adjusting a lens distance between the multi-lens based on a spot-adjustment condition to adjust a light spot size of the light spot when the spot-adjustment condition is met in the soldering. The disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.

A computing system may direct a first robotic arm to a first position based on a first set of coordinates. The computing system may cause the first robotic arm to engage with a first structure based on the first position of the first robotic arm. Further, the computing system may direct the first robotic arm to a second position based on a second set of coordinates such that the first structure is brought within a joining proximity of a second structure without a fixture retaining the first structure and without a fixture retaining the second structure, wherein the first structure is configured to be joined with the second structure when the first and second structures are within the joining proximity, the joining proximity being a proximity at which the first and second structures can be joined together.

A method of depositing material on an electronic substrate with a dispensing system includes acquiring images of adjacent features, assigning programmed search boxes to edges of the features, identifying programmed edges of the features, for each feature identifying an intersection point of the programmed edges, determining a centerline from the intersection point, determining a midpoint of the, determining an intersect command for a dispense operation between the first component and the second component, and performing the dispense operation.