To perform state monitoring that takes account of the arrangement of management target devices. A management device includes: a collection unit that collects, from each of a plurality of management target devices disposed in a management target location, environmental information which is information indicating a state of an environment in which said management target device is placed; and a display control unit that partitions the management target location into a plurality of regions, determines a state of an environment for each of the plurality of regions based on the environmental information collected by the collection unit, and displays the state of the environment for each of the plurality of regions thus determined on a display unit to be associated with a picture showing an arrangement of the management target devices in the management target location.

A technique for optimizing metal extrusion process parameters includes receiving values representing properties of an extrusion press machine, and calculating an estimated surface exit temperature of a metal work product resulting from an extrusion of a metal billet using the extrusion press machine based on the machine property values, an initial temperature of the metal billet prior to the extrusion, an extrusion force applied to the metal billet during the extrusion, and an extrusion speed of the metal work product. The estimated surface exit temperature of the metal work product is compared with a target hot shortness exit temperature of the metal work product. The initial temperature of the metal billet, the extrusion speed, and the extrusion force are changed based on the comparison until the estimated surface exit temperature equals the target hot shortness exit temperature.

A technique for optimizing metal extrusion process parameters includes receiving values representing properties of an extrusion press machine, and calculating an estimated surface exit temperature of a metal work product resulting from an extrusion of a metal billet using the extrusion press machine based on the machine property values, an initial temperature of the metal billet prior to the extrusion, an extrusion force applied to the metal billet during the extrusion, and an extrusion speed of the metal work product. The estimated surface exit temperature of the metal work product is compared with a target hot shortness exit temperature of the metal work product. The initial temperature of the metal billet, the extrusion speed, and the extrusion force are changed based on the comparison until the estimated surface exit temperature equals the target hot shortness exit temperature.

When warm-up operation is started, a machine tool acquires an atmospheric temperature around the machine tool and selects a warm-up operation program on the basis of the acquired atmospheric temperature. A warm-up operation command suitable for the atmospheric temperature is given to the control unit according to the selected warm-up operation program. A movable unit of the machine tool can be thereby controlled, and optimum warm-up operation for the atmospheric temperature can be eventually performed.

A method for operating a numerically controlled production machine includes defining a permissible value range determined by the design and construction of the production machine in which, in a normal operation during production of a workpiece, values representing a mechanical or electrical load described by acceleration and/or jolting of at least one component of the numerically controlled production machine are variable, and activating, for producing the workpiece, with a control signal a conservation operation for reducing the mechanical or electrical loads, wherein in the conservation operation the values of acceleration and/or jolting of the at least one component are variable within a part value range that is limited in comparison to the permissible value range.

A temperature control method of controlling a temperature of a semiconductor wafer mounted on a mounting table includes a supply process of supplying, in a state that a supply of a power to a heater configured to heat the mounting table is stopped or the power is maintained to be constant, a heat transfer gas into a gap between the semiconductor wafer and the mounting table; a measurement process of measuring a temperature variation of the mounting table due to heat exchange between the semiconductor wafer and the mounting table through the heat transfer gas; a calculation process of calculating a correction value based on the temperature variation of the mounting table; and a control process of starting the supply of the power and controlling the power such that the temperature of the mounting table reaches a target temperature corrected with the correction value.