A computing device cooling system includes a chassis including chassis surface(s). The chassis houses component(s), chassis surface temperature sensor(s) configured to report a chassis surface temperature associated with the chassis surface(s), component temperature sensor(s) configured to report a component temperature associated with the component(s); a first fan system configured to generate a component cooling airflow that reduces the component temperature of the component(s), and a second fan system configured to generate a chassis surface cooling airflow that reduces the chassis surface temperature of the chassis surface(s). A fan control system is coupled to the chassis surface temperature sensor(s), the component temperature sensor(s), the first fan system, and the second fan system. The fan control system operates the first fan system when a component temperature exceeds a component temperature threshold, and operates the second fan system when a chassis surface temperature exceeds a chassis surface temperature threshold.

An example system can include a noise sensor communicatively coupled to a controller of a computing device to dynamically determine a sound pressure level (SPL) of an environment in which the computing device is present. The computing device can include a cooling fan and the controller comprising a processor in communication with a memory resource including instructions executable to dynamically determine a threshold speed of the cooling fan based on the determined SPL of the environment set a speed of the cooling fan based on the determined threshold speed.

Disclosed herein are systems and methods that may be implemented in real time to determine the total volumetric rate of airflow through a chassis enclosure of an information handling system platform directly from real time measured cooling fan power consumption in combination with standalone or system-level cooling fan power characteristics (e.g., expressed as cooling fan power curves) that relate cooling fan volumetric airflow rate to cooling fan power consumption at the current fan rotation speed. This determined value of total real time volumetric airflow rate may then be used, for example, by individual system level thermal control algorithms and/or data center level thermal control algorithms.

An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component and a second heat transfer element configured to be thermally coupled to the heat-generating component. A manifold is configured to receive a single fluid flow of a heat transfer medium and split the single fluid flow into a first split fluid flow provided to the first heat transfer element and a second split fluid flow provided to the second heat transfer element.

A method for managing environmental conditions of an information handling system includes obtaining an ambient temperature and an ambient humidity of an environment proximate to the information handling system. The method also includes determining a target relative humidity for the information handling system and determining a target temperature for the information handling system based on the target relative humidity, the ambient temperature, and the ambient humidity. Further, the method includes determining that the target temperature is within an acceptable range of temperatures. In addition, the method includes adjusting an amount of air recirculated through the information handling system, and adjusting the amount of air recirculated is based on the determination that the target temperature is within an acceptable range of temperatures.

A modular information technology component (MITC) includes: a floor, in which the floor comprises a first floor plate (FP) and a second FP, in which the first FP and the second FP are oriented in a first plane; and a first hydraulic pump (HP) and a second HP, in which the first HP is located underneath the first FP, in which the second HP is located underneath the second FP, in which the first HP and the second HP are deactivated, in which, when an information handling system (IHS) is loaded on the second FP, the second FP becomes oriented in a second plane, in which the second plane is lower than the first plane, and in which, when the second FP becomes oriented in the second plane, the second HP is activated to raise the second FP to the first plane.

A cooling system for an information handling system includes multiple compressors, and a processor programmed to identify a first compressor in a compressor array. The identifying is performed in response to a determination that a change in the operation of a cooling system associated with the IHS is needed to maintain a temperature set point. Further, the cooling system includes the compressor array. The processor is also programmed to making a first determination that the first compressor in the compressor array is unavailable. Then, based on the first determination, identify a second compressor in the compressor array, make a second determination that the second compressor is available, and adjust an operation of the second compressor to implement the change.

LED operation rules correlating device event, LED action, LED color, and optionally LED brightness are specified in software. As devices connect to a host computer, a correlation between device ID and USB port is detected. A port map for the storage system is used to correlate the location of a USB port where the electronic device connected to a set of LEDs on the storage system. As the states of the electronic devices connected to the storage system change, the custom-defined LED operational rules are applied on the LEDs of the storage system to cause the LEDs identified by the LED operational rules to be illuminated. Since the LED operational rules are customizable, a user can cause any combination of LED action, color, and brightness to be associated with any electronic device state.

Examples discussed herein relate to managing power allocation for devices, such as network devices, with processing chip. In some examples, based on determining that a first temperature measurement of the processing chip does not satisfy an operating temperature threshold, the network device allocates power from a power source to a first heating element of the network device to heat the processing chip & allocates power from the power source to a second heating element of the network device to heat the processing chip. Based on determining that a second temperature measurement satisfies the operating temperature threshold, the network device allocates power from the power source to a set of power over ethernet ports of the network device & the first amount of power from the power source selectively to the first heating element to heat the processing chip.

Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, one or more neural networks can be used to adjust one or more flow control valves, of a liquid cooling system for a data center, to control a variation in liquid flow rate across the data center.