A system for controlling one or more fans, comprising an open loop control system configured to receive a CPU power level and to maintain a fan speed at an open loop fan speed level. A closed loop control system configured to receive the CPU power level and temperature, and to modify the fan speed as a function of the CPU power level and temperature, wherein the fan speed is maintained at a level that is not lower than the open loop fan speed level.

An information handling system may include an information handling resource, an air mover configured to drive a flow of air, and heat-rejecting media thermally coupled to the information handling resource, the heat rejecting media comprising a heatsink structure, the heatsink structure comprising a plurality of heatsink features, wherein a portion of the heatsink features are coated with a desiccant material.

A management device includes: storage unit which stores a known intake air temperature of a heating element, and a heat transfer characteristic of a cooling device; heat extraction amount calculation unit which calculates a heat extraction amount of the cooling device, by use of the refrigerant information input by the input means, and a cooling capacity of the refrigerant; and air volume calculation unit which calculates an air volume of air supplied to the cooling device, by applying the heat extraction amount to air volume dependence of the heat extraction amount, being derived by use of air volume dependence of a difference temperature between a temperature of the refrigerant and a temperature of exhaust air from the heating element, and the heat transfer characteristic, the air volume dependence of the difference temperature being derived by use of the intake air temperature, the power consumption, and the refrigerant information.

An electronic device and an operating method therefor, according to various embodiments, can be configured to: determine whether heating of the electronic device is abnormal heating, on the basis of a difference value between a first temperature at a first position in the electronic device and a second temperature at a second position in the electronic device; determine whether a user recognizes abnormal heating, on the basis of the assumption that the heating of the electronic device is determined to be abnormal heating; and control the abnormal heating on the basis of determination result of whether the user has recognized abnormal heating.

A gateway device and system and method for use of the same are disclosed. In one embodiment, multiple wireless transceivers are located within an in-wall housing, which also interconnectedly includes a processor, memory, various physical ports and wireless transceivers. To improve convenience, the gateway device may establish a pairing with a proximate wireless-enabled interactive programmable device. Virtual remote control functionality for various amenities may then be provided. To improve safety, the gateway device may be incorporated into a geolocation and safety network.

Systems and methods for cooling a vehicle computing system are provided. A computing system can include a first cooling baseplate including a first planar cooling surface and a second cooling baseplate including a second planar cooling surface. The computing system can further include one or more computing devices including a processor blade positioned on the first planar cooling surface, a coprocessor blade positioned on the second planar cooling surface, and a flexible connector coupled between the processor blade and the coprocessor blade. The flexible connector can be configured to transfer at least one of data or electric power between the processor blade and the coprocessor blade. The first planar cooling surface can be configured to transfer heat from the processor blade to a cooling fluid via conduction. The second planar cooling surface can be configured to transfer heat from the coprocessor blade to the cooling fluid via conduction.

Systems and methods for cooling a vehicle computing system are provided. A computing system can include a cooling baseplate including a first planar cooling surface and a second planar cooling surface. The computing system can further include one or more computing devices including a processor blade positioned on the first planar cooling surface, a coprocessor blade positioned on the second planar cooling surface, and a flexible connector coupled between the processor blade and the coprocessor blade. The flexible connector can be configured to transfer at least one of data or electric power between the processor blade and the coprocessor blade. The first planar cooling surface can be configured to transfer heat from the processor blade to a cooling fluid via conduction. The second planar cooling surface can be configured to transfer heat from the coprocessor blade to the cooling fluid via conduction.

An information handling system may include a main chassis and a motherboard-less expansion chassis. The main chassis may include a host system motherboard and a first host interconnect card. The motherboard-less expansion chassis may include a second host interconnect card communicatively coupled to the first interconnect card via an external cable having one or more in-band signal channels and one or more sideband signal channels, a first information handling resource configured to communicate data with the host system motherboard via the one or more in-band signal channels, and a second information handling resource configured to communicate control signals with the host system motherboard via the one or more sideband signal channels.

An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed to minimize the total power consumption of the pump, acceleration servers and the host servers, based on the one or more parameters and the association between temperature and power consumption of the acceleration servers and the host servers. The RMU then controls the liquid pump based on the optimal pump speed.

An information handling system includes a storage that stores a thermal table associated with the information handling system. A processor detects that the information handling system is connected to a dock. In response to the information handling system being connected to the dock, the processor provides a dock temperature request to the dock. The processor receives a first temperature value for the dock, and receives a second temperature value for the information handling system. The processor retrieves thermal table data from the thermal table. The processor generates a first fan control signal based on the first and second temperature values and the thermal table data, and provides the first fan control signal to the dock.