Disclosed are a method and an apparatus for compensating thermal displacement of a machine tool, the apparatus including: a compensation quantity calculating unit configured to calculate a compensation quantity by using temperature data and a predetermined compensation parameter; a smoothing filter configured to exponentially smooth the calculated compensation quantity; a scaling unit configured to scale the exponentially smoothed compensation quantity; a time-dispersion compensating unit configured to calculate a final compensation quantity by time-dispersion compensation for the scaled compensation quantity according to a time-dispersion compensating period; and a control unit configured to compensate each axis of equipment according to the final compensation quantity, and adjusts the time-dispersion compensating period of the time-dispersion compensating unit according to an error absolute value representing a difference between an input value and an output value of the time-dispersion compensating unit.

A thermal displacement correction training unit has a virtual machine tool, a virtual machine tool control unit and a virtual machine tool display unit. The virtual machine tool has a precision decline imitating unit for imitating the process precision decline caused by the heat during operation in the virtual machine tool unit, and a precision decline calculation unit for finding the amount of precision decline that represents the process precision decline in the process machine unit imitated by the process precision imitating unit. The virtual machine tool control unit has a precision correction unit for finding the correction amount by which the processing point is corrected in response to thermal displacement, and a correction amount adjustment unit for adjusting the correction amount found by the precision correction unit. The virtual machine tool display unit displays the amount of precision decline and the correction amount.

A testing method adapted for an electronic device operating an operating system at a particular temperature environment is provided. The method includes the steps of: determining whether an operating command is received; when the operating command is received, deriving a test, executing the test, and disabling a fan of the electronic device, wherein the test corresponds to one of a plurality of system states of an operating system, and includes a temperature threshold value corresponding to the system state and an entering action of the system state; and when the system state of the test corresponds to a work mode of the operating system, the test includes: continuously monitoring a temperature value of the central processing unit; and when the temperature value of the central processing unit reaches the temperature threshold value, enabling the fan and executing the entering action of the system state.

A control device of a machining tool with power consumption reduction function includes an execution unit configured to execute control of devices using parameter extracted from a parameter set storage unit, based on a selected priority mode and operation condition of the machining tool. At least one parameter set stored in the parameter storage unit is set with a parameter corresponding to the heating device having a value for making the heating device in an on state and a parameter corresponding to the cooling device having a value for making the cooling device in an on state.

A system includes memory that stores compensation information that associates process setpoint temperatures with respective adjustment values. The respective adjustment values include a first adjustment value corresponding to a first temperature compensation scheme and at least one second adjustment value corresponding to a second compensation scheme. A temperature compensation module receives a first process setpoint temperature, retrieves the compensation information from the memory based on the received first process setpoint temperature, calculates a first compensated temperature based on the received first process setpoint temperature, the first adjustment value, and the second adjustment value, and controls a temperature of a component of a substrate processing system according to the first compensated temperature.

A machining center processes a section not to be corrected of a workpiece and a crankshaft bearing hole in a different position from the section not to be corrected and which is separated from an upper deck surface of the workpiece. The machining center supplies a coolant to the hole during processing and detects a temperature of the coolant. A control apparatus estimates the temperature of the coolant when a predetermined time elapses from a start of the processing to be a temperature of the workpiece, calculates a deformation amount of the workpiece due to thermal expansion, corrects a position of the hole with respect to the upper deck surface based on the deformation amount, and starts processing of the hole after the predetermined time. The predetermined time ends when a difference between a temperature near the hole and the temperature of the coolant falls within a predetermined range.

A testing method adapted for an electronic device operating an operating system at a particular temperature environment is provided. The method includes the steps of: determining whether an operating command is received; when the operating command is received, deriving a test, executing the test, and disabling a fan of the electronic device, wherein the test corresponds to one of a plurality of system states of an operating system, and includes a temperature threshold value corresponding to the system state and an entering action of the system state; and when the system state of the test corresponds to a work mode of the operating system, the test includes: continuously monitoring a temperature value of the central processing unit; and when the temperature value of the central processing unit reaches the temperature threshold value, enabling the fan and executing the entering action of the system state.

An information processing device includes a parameter selection method determination unit that selects a hyperparameter of a thermal displacement amount prediction formula as a first hyperparameter, a parameter selection unit that sets/changes the value of the first hyperparameter and fixes remaining hyperparameter values as second hyperparameter values, a machine learning unit that generates a thermal displacement amount prediction formula for each value of the first hyperparameter based on thermal displacement teacher data, and a model evaluation unit that stores the first hyperparameter values together with evaluation values which are the difference between the thermal displacement amounts estimated by each thermal displacement amount prediction formula and measured thermal displacement amounts. The parameter selection method determination unit uses a history of the values of the first hyperparameter and the evaluation values to set the value of the first hyperparameter when the evaluation value is smallest as an optimal value.