Patent classifications
G
G05
G05B
2219/00
G05B2219/30
G05B2219/49
G05B2219/49299
G05B2219/49299
System and Method for Aligning Bonding Pads with Bonding Locations using Moiré Patterns
A system and method for holding a chip on a chip chuck. The chip has a set of interconnect contacts. The system and method includes positioning a first grating relative to the set of interconnect contacts. The system and method includes measuring a first moir pattern of the first grating and the set of interconnect contacts. The system and method includes adjusting position of the chip chuck relative to a substrate chuck based on the first moir pattern.