A soldering device includes a main body, a soldering tip, an image capturing module, a display, a microcontroller and a database. The database is stored in the microcontroller. The database contains the images of plural objects and plural soldering tip data corresponding to the plural objects. The image capturing module captures an image of a target object to be soldered. The microcontroller compares the image of the target object with the images in the database, and shows the soldering tip data corresponding to the image of the target object on the display. According to the message shown on the display, the user selects the suitable soldering tip. The soldering device is selectively operated in an automatic replacing mode or a manual replacing mode. In the automatic replacing mode, the soldering tips can be automatically replaced. Consequently, the soldering device can accurately and quickly select the suitable soldering tip.