An apparatus for heating a substrate includes: a stage including at least one resistance heater that heats the substrate placed thereon; a temperature detector for detecting a heating temperature of the substrate; a temperature calculator for calculating the heating temperature based on a resistance value of the at least one resistance heater; a power controller for performing a power control with respect to a first power to be supplied to the at least one resistance heater such that the heating temperature becomes close to a first preset temperature by switchably applying a phase control and a zero-cross control; and a controller for switching the power control of the power controller to the phase control or the zero-cross control.

The present application discloses, in some embodiments thereof, an apparatus, systems and methods for measuring specimens' displacement or transformation while heating. In some embodiments, the present invention discloses apparatus and methods for determining the transformation temperature or range of temperatures of specimens, such as specimens manufactured from a memory shape alloy.

The present application discloses, in some embodiments thereof, an apparatus, systems and methods for measuring specimens' displacement or transformation while heating. In some embodiments, the present invention discloses apparatus and methods for determining the transformation temperature or range of temperatures of specimens, such as specimens manufactured from a memory shape alloy.

Soldering system includes a first soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which includes a communication module designed for setting up a wireless data connection, and at least a second soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which comprises a communication module designed for setting up a wireless data connection.

Soldering system includes a first soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which includes a communication module designed for setting up a wireless data connection, and at least a second soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which comprises a communication module designed for setting up a wireless data connection.

A ducting system has a first upstream location is to be connected to a first source of air. A downstream location in the duct is to be connected to a second source of air. The upstream location has a first valve, and the downstream location has a second valve. An end location of the duct is to be connected to a sink. A control for the valves achieves a desired pressure and temperature of air at the end location. The first temperature sensor is located at a position intermediate the upstream location and the downstream location. A second temperature sensor is located at a position intermediate the downstream location and the end location. A control is programmed to determine the health of the first and second valves based upon a difference between temperatures sensed by the first and second sensors. An air use system and a method are also disclosed.

A ducting system has a first upstream location is to be connected to a first source of air. A downstream location in the duct is to be connected to a second source of air. The upstream location has a first valve, and the downstream location has a second valve. An end location of the duct is to be connected to a sink. A control for the valves achieves a desired pressure and temperature of air at the end location. The first temperature sensor is located at a position intermediate the upstream location and the downstream location. A second temperature sensor is located at a position intermediate the downstream location and the end location. A control is programmed to determine the health of the first and second valves based upon a difference between temperatures sensed by the first and second sensors. An air use system and a method are also disclosed.

A remote seal system includes a remote diaphragm having a first side configured to be exposed to a process fluid. A conduit is coupled to the remote diaphragm and includes a fill fluid in fluidic communication with a second side of the remote diaphragm. A temperature sensor is thermally coupled to the conduit and configured to sense a temperature of the fill fluid. In one alternative example, a remote sensing assembly includes a flexible elongate conduit having a first end coupled to a remote diaphragm in fluidic communication with a process fluid and a second end extending a length from the first end to a process fluid pressure transmitter. A substantially incompressible fill fluid is disposed within the flexible elongate conduit. The process fluid pressure transmitter is configured to generate an output value indicative of pressure in the process fluid based on a corresponding pressure in the fill fluid. A temperature detector is coupled to the flexible elongate conduit and is configured to provide a signal indicative of an average temperature of the fill fluid along the flexible elongate conduit. A compensation system calculates a thermal expansion value based on the average temperature and adjusts the pressure signal based on the thermal expansion value.

A remote seal system includes a remote diaphragm having a first side configured to be exposed to a process fluid. A conduit is coupled to the remote diaphragm and includes a fill fluid in fluidic communication with a second side of the remote diaphragm. A temperature sensor is thermally coupled to the conduit and configured to sense a temperature of the fill fluid. In one alternative example, a remote sensing assembly includes a flexible elongate conduit having a first end coupled to a remote diaphragm in fluidic communication with a process fluid and a second end extending a length from the first end to a process fluid pressure transmitter. A substantially incompressible fill fluid is disposed within the flexible elongate conduit. The process fluid pressure transmitter is configured to generate an output value indicative of pressure in the process fluid based on a corresponding pressure in the fill fluid. A temperature detector is coupled to the flexible elongate conduit and is configured to provide a signal indicative of an average temperature of the fill fluid along the flexible elongate conduit. A compensation system calculates a thermal expansion value based on the average temperature and adjusts the pressure signal based on the thermal expansion value.

A temperature control apparatus includes; a case including an open front surface, a top surface extending from an upper end of the front surface toward a rear side, a bottom surface extending from a lower end of the front surface toward the rear side, left and right side surfaces extending from left and right side ends of the front surface, and a rear surface connecting rear ends of the top surface, the bottom surface, and the left and right side surfaces; a front cover shielding the front surface; a display panel disposed behind the front cover; a base board coupled to a rear surface of the front panel and having a front surface on which the display panel is mounted; a module board coupled to a rear surface of the base board in a direction perpendicular to the base board; and one or more terminal portions electrically connected to the module board. A circuit terminal coming into contact with a connection pin of the terminal portion is formed on one side surface of a rear end portion of the module board. The rear end portion of the module board on which the circuit terminal is formed passes through a slit formed in the rear surface and protrudes to an outside of the rear surface.