An electronic component handling apparatus, for handling a DUT having a temperature detection circuit and pressing the DUT against a socket electrically connected to a tester testing the DUT, includes: a temperature adjuster adjusting a temperature of the DUT; a first calculator calculating the temperature of the DUT based on a detection result of the temperature detection circuit; a temperature controller controlling the temperature adjuster; and a first receiver receiving a first signal output from the tester, a temperature control including a first temperature control based on the temperature of the DUT calculated by the first calculator and a second temperature control, and the temperature controller switching the temperature control of the DUT from the first temperature control to the second temperature control when the first receiver receives the first signal after the temperature controller starts the first temperature control.

A method can include obtaining a set of images of a set of occupants located in an interior environment. The interior environment can have a first temperature. The method can include identifying, based on the set of images, a set of occupant characteristics corresponding to the set of occupants. The method can include obtaining a second temperature of an external environment. The method can include generating, by comparing the set of occupant characteristics to the second temperature, a discrepancy factor. The method can include determining that the discrepancy factor exceeds a threshold. The method can include initiating, in response to the determining that the discrepancy factor exceeds the threshold, a modification of the first temperature.

A method can include obtaining a set of images of a set of occupants located in an interior environment. The interior environment can have a first temperature. The method can include identifying, based on the set of images, a set of occupant characteristics corresponding to the set of occupants. The method can include obtaining a second temperature of an external environment. The method can include generating, by comparing the set of occupant characteristics to the second temperature, a discrepancy factor. The method can include determining that the discrepancy factor exceeds a threshold. The method can include initiating, in response to the determining that the discrepancy factor exceeds the threshold, a modification of the first temperature.

A smart-home device may include a temperature sensor, energy-consuming subsystems, and processors programmed to receive a temperature measurement from the temperature sensor for an ambient environment surrounding the temperature sensor; receive inputs from the energy-consuming subsystems that indicate power-consuming activities of the energy-consuming subsystems; providing the inputs from the energy-consuming subsystems to a model that is trained to calculate an effect of the power-consuming activity of the energy-consuming subsystems on the temperature measurement from the temperature sensor; and calculating an estimate of the temperature of the ambient environment by compensating the temperature measurement from the temperature sensor with using the effect of the power-consuming activity of the energy-consuming subsystems.

A smart-home device may include a temperature sensor, energy-consuming subsystems, and processors programmed to receive a temperature measurement from the temperature sensor for an ambient environment surrounding the temperature sensor; receive inputs from the energy-consuming subsystems that indicate power-consuming activities of the energy-consuming subsystems; providing the inputs from the energy-consuming subsystems to a model that is trained to calculate an effect of the power-consuming activity of the energy-consuming subsystems on the temperature measurement from the temperature sensor; and calculating an estimate of the temperature of the ambient environment by compensating the temperature measurement from the temperature sensor with using the effect of the power-consuming activity of the energy-consuming subsystems.

An electronic thermostat replaces an electro-mechanical thermostat and is located in a different location from the blower motor it controls. The electronic thermostat controls the blower motor on the same wires from which the thermostat receives power. The safe, low voltage power supply that powers the electronic thermostat is located at the blower motor location and is housed in the Blower Motor Module (BMM). This configuration has the advantage that it removes a bulky and space consuming component from the thermostat, the A/C transformer. This also reduces the amount of power (heat) dissipated by the electronic thermostat power supply, thus reducing a source of potential temperature measurement inaccuracies. Also, removing the 120 VAC power from the thermostat and replacing it with an isolated low voltage source increases safety. This architecture also makes the necessary over the power wires communications less complex and safter, and it reduces the number of components necessary to accomplish the communication's link, and makes the link more robust and noise immune.

An electronic thermostat replaces an electro-mechanical thermostat and is located in a different location from the blower motor it controls. The electronic thermostat controls the blower motor on the same wires from which the thermostat receives power. The safe, low voltage power supply that powers the electronic thermostat is located at the blower motor location and is housed in the Blower Motor Module (BMM). This configuration has the advantage that it removes a bulky and space consuming component from the thermostat, the A/C transformer. This also reduces the amount of power (heat) dissipated by the electronic thermostat power supply, thus reducing a source of potential temperature measurement inaccuracies. Also, removing the 120 VAC power from the thermostat and replacing it with an isolated low voltage source increases safety. This architecture also makes the necessary over the power wires communications less complex and safter, and it reduces the number of components necessary to accomplish the communication's link, and makes the link more robust and noise immune.

A temperature-controlled electronic apparatus, comprises: a circuit board; a plurality of electronic components, mounted on the circuit board in an arrangement to form at least one electronic circuit; a temperature sensor, configured to measure a temperature of the at least one electronic circuit; and a heat-generating component, configured to be controlled by a temperature control circuit, the temperature control circuit being configured to control an amount of heat generated by the heat-generating component in response to the temperature measured by the temperature sensor. The plurality of electronic components are arranged on the circuit board to lie on one of one or more paths, each path of the one or more paths being defined by a respective circle having a radius.

A temperature-controlled electronic apparatus, comprises: a circuit board; a plurality of electronic components, mounted on the circuit board in an arrangement to form at least one electronic circuit; a temperature sensor, configured to measure a temperature of the at least one electronic circuit; and a heat-generating component, configured to be controlled by a temperature control circuit, the temperature control circuit being configured to control an amount of heat generated by the heat-generating component in response to the temperature measured by the temperature sensor. The plurality of electronic components are arranged on the circuit board to lie on one of one or more paths, each path of the one or more paths being defined by a respective circle having a radius.

Electronic thermostats are expanding to a higher integration of services that includes, for example, the integration of a home Internet-of-Things (IoT) gateway, local rule control, local machine learning capability, and higher resolution thin-film transistor (TFT) display. However, the required incorporation of higher processing power control units and/or large display typically results in a higher heat dissipation of electronic components, thus increasing the temperature around the components of an electronic thermostat. The system heat dissipation consequently degrades the accuracy of the on-board temperature sensors. An aspect of the embodiments provides a compensation for the temperature rise effect on the printed circuit board (PCB) of the electronic thermostat to obtain better precision and performance. Once the measurements from the temperature sensors have stabilized, the compensated ambient temperature may be used by an associated system (for example, a HVAC system).