G06F1/181

Fabric-Covered Electronic Device

An electronic device such as a voice-controlled speaker device may have a housing characterized by a vertical longitudinal axis. A flexible substrate such as a flexible mesh substrate with component support regions coupled by flexible segments may be wrapped around the housing and the vertical axis. The housing may have surface regions with compound curvature. The flexible substrate may conform to the regions with compound curvature. A fabric spacer layer may be interposed between the flexible substrate and the housing. Electrical components such as input-output devices may be mounted to the component support regions. A display may be formed from an array of light-emitting devices that are mounted on respective component support regions. Light from the light-emitting devices may pass through the fabric spacer layer toward the housing and back out away from the housing. An outer fabric layer may cover the mesh.

Range Extender Device

This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.

Display device and frame module thereof
11567545 · 2023-01-31 · ·

A display device includes a frame module, a display panel, a backlight module, a rear case and a control module. The frame module includes a back plate, a frame and a fixing column. The back plate has a first surface and a second surface opposite to the first surface and a hole extending from the first surface to the second surface. The fixing column is protrudingly disposed on the frame and is coupled to the hole. The fixing column includes a pressing portion and a connecting portion connecting the frame and the pressing portion. The connecting portion is disposed in the hole, and the frame presses against the first surface, and the pressing portion presses against the second surface. The backlight module is disposed between the back plate and the display panel. The control module is disposed between the rear case and the frame module.

Data Center Rack Including an Ultracapacitor Module
20230026454 · 2023-01-26 ·

A data center rack is disclosed. The data center rack comprises a plurality of chamber openings including computing devices; and at least one chamber opening including a mounted ultracapacitor module comprising a plurality of ultracapacitors. A data center comprising a data center rack is also disclosed.

HIGH AVAILABILITY COMBINED DATA/POWER PROVISIONING SYSTEM
20230024116 · 2023-01-26 ·

A combined data/power coupling device includes a chassis having first and second powering device connectors and a powered device connector each coupled to a data/power coupling subsystem. The data/power coupling subsystem configures each of the first and second powering device connectors to receive power from at least one powering device, configures the first powering device connector to receive data from the at least one powering device, and provides data and power received via the first powering device connector to a powered device via the powered device connector. When the data/power coupling subsystem determines that data and power are not available via the first powering device connector, it configures the second powering device connector to receive data from the at least one powering device, and provides data and power received via the second powering device connector to the powered device via the powered device connector.

CHASSIS LAYOUT MONITORING AND ANALYSIS TO ENHANCE TEMPERATURE MANAGEMENT

A number of slots in a chassis of an information handling system and a number of a plurality of sleds to be housed in the chassis may be determined. An airflow for each of the plurality of sleds in each of the plurality of placement configurations may be determined based, at least in part, on the number of slots in the chassis and the number of the plurality of sleds to be housed in the chassis. A recommended placement for each of the sleds may be determined based at least in part on the airflow for each of the plurality of sleds for the plurality of placement configurations. A notification may be generated comprising the recommended placements for each of the plurality of sleds.

Dynamic Information Tag
20230022837 · 2023-01-26 · ·

A dynamic information tag is disclosed for performing a dynamic information tag operation. The dynamic information tag includes a tag housing, the tag housing being sized to fit within a recess of an information handling system configured for receipt of a static information tag; a control and connection portion; and, a display coupled to the control and connection portion, the display being controlled via the control and connection portion to present information handling system information.

Electronic device having plurality of displays enclosing multiple sides and method for controlling same

An electronic device and method for controlling the electronic device are provided. The electronic device includes a first surface in a first direction, a second surface in a second direction opposite to the first direction, and a third surface enclosing at least a portion of a space formed between the first surface and the second surface. The electronic device also includes an audio module changing an audio signal input to the electronic device into an electronic signal, and a processor being operationally connected to the display and the audio module. The processor is configured to detect the audio signal input via the audio module from a first user via the first surface, detect a touch signal dragged from the third surface in the direction of the second surface, and display in the second surface a translation corresponding to the audio signal.

Open concept charging computer cart
11705747 · 2023-07-18 · ·

An open concept computer cart has a frame, a lower computer storage shelf supported by the frame, an upper computer storage shelf supported by the frame, and a forward-facing brick storage area formed vertically intermediate the upper and lower computer storage shelves. The upper and lower computer storage shelves are rearwardly inclined to prevent computers stored thereon from sliding off of the shelves. A single wiring retention strip is formed along a front surface of the open concept computer cart, and a power outlet strip is formed along a rear of the brick storage area. The wiring retention strip has wire retention cutouts formed along its length to retain charging tethers for computers stored on both the upper and lower computer storage shelves.

Slot airflow based on a configuration of the chassis

An information handling system includes a chassis having multiples sleds and an embedded controller. The embedded controller retrieves relative impedances for all of the sleds, and calculates a maximum available airflow for the first sled based the relative impedances of all other sleds. A baseboard management controller (BMC) of a first sled requests a boot operation for the first sled. The BMC collects configuration information for the first sled, and determines an airflow impedance of the first sled based on the configuration information. The BMC provides the airflow impedance and a power allocation request to the embedded controller. The BMC compares the maximum available airflow to a minimum airflow requirement for the first sled. If the maximum available airflow is less than the minimum airflow requirement, the BMC implements power limits for processors in the first sled to prevent overheating of components within the first sled.