A plug-in mobile peripheral component interconnect express module connector is disclosed, comprising a plastic body, and a first terminal set and a second terminal set disposed relatively in the plastic body. The plastic body includes transversely penetrated slots, an upper end surface of the slots has intermittently plural upper magazines, and a lower end surface has intermittently plural lower magazines. The first terminal set includes plural first elastic terminals inserted in the upper magazines, and the second terminal set includes plural second elastic terminals inserted in the lower magazines. Each first elastic terminal is opposed to each second elastic terminal, forming a holding gap. A motherboard is inserted between the first elastic terminals and the second elastic terminals from a side, and an MXM board is inserted between the first elastic terminals and the second elastic terminals from the other side.

Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuitry is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.

An electronic module has a flexible wiring member, a wiring circuit board, and a conductive connection member. The flexible wiring member has a flexible base, a first wiring layer formed on at least one face of the flexible base, and a first electrode formed of the first wiring layer at the end part that is not covered by a first insulating layer. The wiring circuit board has a base provided with a wiring, a second insulating layer having opening formed on at least one face of the base, and a second electrode formed in the opening. The conductive connection member connects the first electrode and the second electrode to each other. The end of the flexible wiring member is arranged above the opening in plan view.

This disclosure provides storage chassis including base storage sub-assemblies and partitions. Base includes bottom plate, top plate, first side plate and second side plate. Front side of bottom plate is opposite to back side of bottom plate. Bottom plate is located opposite to top plate. First side plate is located opposite to second side plate. First side plate and second side plate are connected to and located between bottom plate and top plate. Storage sub-assemblies are movably disposed between first side plate and second side plate. Partitions are disposed between first side plate and second side plate. Opposite ends of each partition are respectively connected to top plate and bottom plate. Partitions separate storage sub-assemblies from one another so that storage sub-assemblies are respectively located in airflow channels that are independent to one another.

An interface card cage includes a first assembly and a second assembly. The first assembly includes a first side wall, a second side wall, and a bent portion. The second side wall has an opening. The bent portion and the first side wall extend in different directions. The bent portion includes a protrusion extending from the bent portion. The second assembly includes an assembly part having a slot. The assembly part includes a first side plate and a second side plate. The first side plate has a recess. The assembly part has a first edge and a second edge. A direction from the first edge to the second edge is different from a direction from the first side plate to the second side plate. The bent portion of the first assembly is located in the slot. The protrusion is located in the recess.

A computing chassis, including: a first storage processor assembly; a second storage processor assembly; a first midplane, wherein the first storage processor assembly and the second storage processor assembly are coupled concurrently to the first midplane; and a second midplane, wherein the first storage processor assembly and the second storage processor assembly are coupled concurrently to the second midplane, wherein communication between the first storage processor assembly and the second storage processor assembly is through the first midplane and the second midplane independently.

A tool-free support mounting structure is provided, including a base, a handle, and a support. The handle and the support are slidably connected along a first direction; the support and the base are clamped through a limiting slot and a limiting bulge; a slot width direction of the limiting slot is consistent with the first direction, and a slot depth direction is a second direction perpendicular to the first direction; when the limiting bulge is embedded in the limiting slot, the handle and the base are clamped through a fixing slot taking a slot depth direction as the first direction, and a fixing bulge; and an opening used for guiding the fixing bulge to enter, along the second direction, is formed in a notch of the fixing slot.

A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.

A display device includes a display panel, a bonding substrate and a bridge board. The display panel includes a pixel array disposed on a base substrate and an input pad electrically connected to the pixel array. The bonding substrate is disposed under the display panel and includes an output pad. The bridge board is bonded to the input pad of the display panel and the output pad of the bonding substrate to electrically connect the display panel to the bonding substrate, wherein the bridge board includes a rigid material.

A computing system includes a liquid cooled segment and an air cooled segment that are both removably received and secured inside a chassis with a fixed physical arrangement relative to one another. The fluid cooled segment includes an enclosure forming an enclosed space for placement of one or more high heat generating components. The enclosed space being in fluid communication with an inlet tube for receiving a cooling fluid and an outlet tube for expelling the cooling fluid that has been used to cool the high heat generating components. The enclosure includes a leak proof connector configured on the enclosure. The air cooled segment includes one or more reduced heat generating components. The reduced heat generating components are electrically coupled to the high heat generating components through the leak proof connector.