Technologies for dynamic accelerator selection include a compute sled. The compute sled includes a network interface controller to communicate with a remote accelerator of an accelerator sled over a network, where the network interface controller includes a local accelerator and a compute engine. The compute engine is to obtain network telemetry data indicative of a level of bandwidth saturation of the network. The compute engine is also to determine whether to accelerate a function managed by the compute sled. The compute engine is further to determine, in response to a determination to accelerate the function, whether to offload the function to the remote accelerator of the accelerator sled based on the telemetry data. Also the compute engine is to assign, in response a determination not to offload the function to the remote accelerator, the function to the local accelerator of the network interface controller.

Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuity is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.

An apparatus, system, and method are disclosed for efficiently managing commands in a solid-state storage device that includes a solid-state storage arranged in two or more banks. Each bank is separately accessible and includes two or more solid-state storage elements accessed in parallel by a storage input/output bus. The solid-state storage includes solid-state, non-volatile memory. The solid-state storage device includes a bank interleave that directs one or more commands to two or more queues, where the one or more commands are separated by command type into the queues. Each bank includes a set of queues in the bank interleave controller. Each set of queues includes a queue for each command type. The bank interleave controller coordinates among the banks execution of the commands stored in the queues, where a command of a first type executes on one bank while a command of a second type executes on a second bank.

A universal bracket for mechanically coupling an information handling resource to a chassis of an information handling system may include a first mechanical member having a pair of guide features located on opposite edges of the first mechanical member and a second mechanical member having corresponding guide features configured to mechanically couple to the pair of guide features in order to enable the second mechanical member to slide relative to the first mechanical member in a linear direction such that a height of the universal bracket is configurable to match a height of the information handling resource.

An information handling system includes a chassis having multiples sleds and an embedded controller. The embedded controller retrieves relative impedances for all of the sleds, and calculates a maximum available airflow for the first sled based the relative impedances of all other sleds. A baseboard management controller (BMC) of a first sled requests a boot operation for the first sled. The BMC collects configuration information for the first sled, and determines an airflow impedance of the first sled based on the configuration information. The BMC provides the airflow impedance and a power allocation request to the embedded controller. The BMC compares the maximum available airflow to a minimum airflow requirement for the first sled. If the maximum available airflow is less than the minimum airflow requirement, the BMC implements power limits for processors in the first sled to prevent overheating of components within the first sled.

Technologies for managing configuration-free platform firmware include a compute device, which further includes a management controller. The management controller is to receive a system configuration request to access a system configuration parameter of the compute device and access the system configuration parameter in response to a receipt of the system configuration request.

A backplane management and configuration system includes a chassis housing a first storage system having a first backplane, a second storage system having a second backplane, a second computing device coupled to each of the first backplane and the second backplane via a second multiplexer and a communication bus, and a first computing device coupled to each of the first backplane and the second backplane via a first multiplexer and the communication bus. A backplane configuration/management subsystem in the first computing device detects a multi-computing-device configuration including the first and second computing devices in the chassis and, in response, determines a first computing device location in the chassis. Based on the first computing device location, the backplane configuration/management subsystem identifies a first backplane identifier for the first backplane and, in response, configures the first backplane for management by the backplane configuration/management subsystem and ignores the second backplane.

The present invention discloses an electronic device and a cable organizing assembly. The electronic device includes a main structure with a body and the cable organizing assembly. The body has a penetration hole passing through the body and extends from a bottom surface to form a wall having a notch. The cable organizing assembly includes a cable fastening member fixed at the wall and correspondingly sealing the notch. The cable fastening member includes multiple cable grooves for fastening at least one cable. The central axis of each cable groove is not parallel to the central axis of the penetration hole. Cables pass through the penetration hole from one side of a top surface, become bent, and are fixed on one side of the bottom surface of the body by the cable organizing assembly. Thus, a liquid from the exterior is unlikely to enter along the cables into the interior.

A fixing assembly and an electronic device including same are disclosed. The fixing assembly includes a supporting member, a locking member, and a latching member. The supporting member includes a first supporting portion and a second supporting portion connected with each other, and the second supporting portion defines a sliding slot. The locking member includes a locking portion and a connecting portion connected with each other, the connecting portion includes a protrusion and a latching hole. The protrusion is slidably arranged in the sliding slot. When the protrusion slides along the sliding slot, the locking member slides and then rotates relative to the supporting member. The latching member is arranged on the second supporting portion and is adapted to be inserted into the latching hole. When the latching member is inserted into the latching hole, the fan is sandwiched and held between the first supporting portion and the locking portion.

Disclosed are a liquid cooling plate suitable for liquid cooling heat dissipation of an electronic device and a heat dissipation unit. The liquid cooling plate includes a liquid cooling plate body and at least one heat dissipation flow channel, wherein the liquid cooling plate body is provided with a first heat dissipation surface and a second heat dissipation surface that are arranged in parallel, the first heat dissipation surface being planar, a plurality of heat dissipation bosses being arranged on the second heat dissipation surface, and heat dissipation flow channels extending along the heat dissipation bosses are provided inside the liquid cooling plate body at positions corresponding to the at least one of the heat dissipation bosses between the first heat dissipation surface and the second heat dissipation surface, the plurality of heat dissipation flow channels being connected to form a cooling liquid flow path having an inlet and an outlet.