Adapters for mounting patch panels to data center racks enable the patch panels to be repositioned with respect to the racks in a rotatable or pivotable manner. A patch panel mounted to an adapter has a jack or port on one side of the adapter, and a jack or port on another side of the adapter. With the adapter aligned at an obtuse angle with respect to a front edge of a rack, a component may be inserted into the rack, or removed from the rack. Subsequently, the adapter aligned at an acute angle, or any other angle, with respect to the front edge of the rack. Mounting patch panels to the adapters enables the patch panels to be maintained outside of the rack, and increases a number of components that may be installed within the rack, or space or volume that may e occupied by components within the rack.

A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

A supporting back plate is applied to a direct back-lit display with a thin type, which includes a first casing, a second casing, an optical member, at least one circuit board, the supporting back plate and lights. The first casing has an opening portion and is connected to the second casing. The optical member is disposed between the first casing and the second casing, and exposed via the opening portion. The supporting back plate is disposed between the second casing and optical member. The supporting back plate includes a first area and a second area. A distance from the first area to the second casing is greater than a distance from the second area to the second casing. The circuit board is disposed on the first area of the supporting back plate. The lights are disposed on the supporting back plate.

A component carrier includes a baseboard, two sidewalls, and an ejector. The two sidewalls extend from opposite sides of the baseboard. The ejector includes a side plate, a handle, and a tab. The side plate is positioned in proximity to a first sidewall of the two sidewalls of the component carrier. The handle extends from a first end of the side plate in a first direction that is generally perpendicular to the side plate. The tab is positioned in proximity to the baseboard, and extends from a second opposing end of the side plate in a second direction that is generally perpendicular to the side plate and opposite to the first direction, the tab coupled to a first connector extending from the baseboard. The baseboard includes a first opening such that a portion of the tab of the ejector is configured to directly contact the electronic component therethrough.

Disclosed is a computer case with I/O panels on opposite sides of the case, and a method for providing the case. The case includes a top, a bottom, a back side that is opposite a front side, and a right side that is opposite a left side. The case also includes a front I/O opening formed in the front side that receives a front I/O panel. The computer case also includes a rear I/O opening in the back side that receives a rear I/O panel.

A heat dissipation case includes a case body, a carrying frame configured to be slidably mounted on the case body, a shutter rotationally mounted on the case body, and a number of levers rotationally mounted on the case body. One end of the levers resists against the shutter. The carrying frame is configured to resist against the other end of the levers, so that the end of the levers resisting against the shutter drives the shutter to rotate and open toward the carrying frame.

A device having fool-proofing structure is configured to be inserted into a cabinet along a first direction and includes a case and an elastic sheet module. The elastic sheet module is disposed on a side of the case and includes a first end disposed on the case, a second end opposite to the first end, a first protrusion portion and a second protrusion portion. The first protrusion portion is adjacent to the second end, protrudes from the case and is configured to abut against the cabinet. The second protrusion portion is farther from the second end than the first protrusion portion, protrudes from the case, and is configured to make the second end and the first protrusion portion move toward the interior of the case as being pressed by a force.

An electronic device includes a frame, a covering structure and a functional module. The frame has an opening and a fixing portion corresponding to the opening. The covering structure and the functional module constitutes a function expansion assembly. The covering structure is used to be detachably fixed at the electronic device and to cover the opening. The functional module includes an expansion circuit board and an operation interface. The expansion circuit board is used to be detachably fixed at the fixing portion, and the operation interface is located corresponding in position to the opening. When the covering structure is detached from the electronic device, the operation interface is accessible through the opening.

Example implementations relate to a host electronic device and a method of establishing a thermal contact with a removable electronic device by a cooling component of the host electronic device. The host electronic device includes a housing, the cooling component, and a plurality of flexible arms. The cooling component is movably coupled to the housing. The plurality of flexible arms extend towards an internal cavity of the housing to hold the cooling component in a first position (retracted position). Further, the plurality of flexible arms are displaceable from the internal cavity by a movement of the removable electronic device into the host electronic device, to allow the cooling component to drop down to a second position (extended position) for establishing the thermal contact with a heat generating component of the removable electronic device.

An electronic device includes a system board, a power module and a conductive part. The system board includes a first surface and a second surface opposite to each other. The power module is disposed on the second surface and provides power to the semiconductor device through the system board. The conductive part is disposed on a first side of the power module adjacent to the second surface, wherein the conductive part is electrically connected with the and the system board, wherein the power is transmitted between the and the semiconductor device through the conductive part. The power module includes at least one switch circuit and a magnetic core assembly. The at least one switch circuit disposed on a second side of the power module away from the conductive part. The magnetic core assembly is arranged between the switch circuit and the conductive part.