Example mobile terminals are disclosed. One example terminal includes a rotating member, a flexible screen, a bending support part, and a temperature equalization plate. The flexible screen includes two unfolded regions and a bent region that is disposed opposite to the rotating member. The bending support part is located between the flexible screen and the rotating member. The temperature equalization plate is configured to balance temperatures in the two unfolded regions and includes two temperature equalization parts opposite to the two unfolded regions in a one-to-one correspondence and a flexible connection part that connects the two temperature equalization parts. The flexible connection part is located on a side of the bending support part and away from the flexible screen.

An electronic device is provided, which may include a first housing; a second housing configured to accommodate at least a portion of the first housing and guide a sliding movement of the first housing; a display including a first display area disposed on the first housing and a second display area extending from the first display area; a PCB configured to accommodate at least one electronic component; a support member configured to support the PCB; a side wall member connected to the support member and facing at least a portion of the first housing; a heat dissipation sheet configured to receive heat from the at least one electronic component, the heat dissipation sheet being disposed on the support member and the side wall member; and a heat dissipation member disposed on the side wall member and facing the heat dissipation sheet.

A cooling system is described. The cooling system includes a support structure, a cooling element, and drive electronics. The cooling element has a central axis and is supported by the support structure at the central axis. First and second portions of the cooling element are on first and second sides of the central axis and unpinned. The first and second portions of the cooling element undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The cooling element further has first and second piezoelectrics having opposite polarizations. The first piezoelectric is part of the first portion of the cooling element. The second piezoelectric is part of the second portion of the cooling element. The drive electronics drive the first and second portions of the cooling element using a single drive signal.

Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.

In one embodiment, a method for managing a heatsink of an information handling system includes: determining, by a controller unit of the information handling system, that a vibration event is to occur, the vibration event associated with a vibration unit of the information handling system, the controller unit communicably coupled to the vibration unit, the vibration unit removably coupled to the heatsink; and causing, by the controller unit, the vibration unit to generate the vibration event, the vibration event causing the vibration unit to apply one or more vibrations to the heatsink, the one or more vibrations causing a boundary layer of particles to be removed from a surface of the heatsink.

Information handling system (IHS) heatsinking systems and methods may employ a thermally conductive compression attached memory module (CAMM) bolster plate affixed to one surface of a circuit board of the CAMM, between a central processing unit (CPU) of the IHS and memory devices mounted on the CAMM, to provide compression between the CAMM and a z-axis compression connector and to capture and dissipate heat from the CPU and the memory devices. Spacing between the CPU and the DIMM may enable this capture and dissipation of heat from the CPU. The bolster plate may be configured to receive at least one conductive fastener that bears on the bolster plate and presses the CAMM to the z-axis compression connector, and to conductively thermally couple the CAMM and bolster plate to a ground plane of a system printed circuit board (PCB) mounting the CPU and the CAMM.

Circuit apparatus are disclosed. An example circuit apparatus includes a body including a plurality of first traces formed on the body, and a plurality of openings formed through the body and located between respective ones of the first traces. The openings provide airflow to a fan module of an electronic device through the body of the circuit apparatus.

In one embodiment, a method for managing thermal dissipation in a display of an information handling system includes: emitting, by a light source of the display, a visible light within the display, the visible light associated with a heat within the display; receiving, by an absorption layer of the display, the visible light within the display, the absorption layer coupled to a display cover of the display; absorbing, by the absorption layer, a portion of the visible light comprising a light leakage from the display; absorbing, by the absorption layer, a portion of the heat within the display; and transferring, by the absorption layer, the portion of the heat into the display cover.

An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

A mobile phone may include a display, wireless communication circuitry, a battery, and an enclosure enclosing the display, the wireless communication circuitry, and the battery. The enclosure may include a front cover formed from a transparent material and defining a front exterior surface of the mobile phone, a rear cover formed from a glass material and defining a rear exterior surface of the mobile phone, and a first housing component including a first wall section defining a first side exterior surface of the mobile phone, a second wall section defining a second side exterior surface opposite to the first side exterior surface, and a mid-chassis section extending between the first wall section and the second wall section.