This disclosure relates to a liquid cooling device including a first heat exchanger that has a first inlet and a first outlet, a second heat exchanger that has a second inlet and a second outlet, a heat dissipation component that has a first heat inlet, a second heat inlet, and a heat outlet, and a fluid driving component that has a fluid inlet, a first fluid outlet, and a second fluid outlet. The first heat inlet and the second heat inlet are in fluid communication with the heat outlet. The first heat inlet is in fluid communication with the first outlet. The second heat inlet is in fluid communication with the second outlet. The fluid inlet is in fluid communication with the heat outlet. The first fluid outlet and the second fluid outlet are respectively in fluid communication with the first heat inlet and the second heat inlet.

In one embodiment, a processor includes a plurality of cores each including a first storage to store a physical identifier for the core and a second storage to store a logical identifier associated with the core; a plurality of thermal sensors to measure a temperature at a corresponding location of the processor; and a power controller including a dynamic core identifier logic to dynamically remap a first logical identifier associated with a first core to associate the first logical identifier with a second core, based at least in part on a temperature associated with the first core, the dynamic remapping to cause a first thread to be migrated from the first core to the second core transparently to an operating system. Other embodiments are described and claimed.

A VR integrated machine and a running method thereof are provided. The VR integrated machine includes a heat generating device, a heat conducting member and thermoelectric conversion member, the heat conducting member is connected with the heat generating device, the thermoelectric conversion member has a first end connected with the heat conducting member, and is configured to generate electrical energy and to supply the electrical energy to the UR integrated machine.

Examples herein relate to assigning, by a system agent of a central processing unit (CPU), an operating frequency to a core group based priority level of the core group while avoiding throttling of the system agent. Avoiding throttling of the system agent can include maintaining a minimum performance level of the system agent. A minimum performance level of the system agent can be based on a minimum operating frequency. Assigning, by a system agent of a central processing unit, an operating frequency to a core group based priority level of the core group while avoiding throttling of the system agent can avoid a thermal limit of the CPU. Avoiding thermal limit of the CPU can include adjusting the operating frequency to the core group to avoid performance indicators of the CPU. A performance indicator can indicate CPU utilization corresponds to Thermal Design Point (TDP).

Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.

A device includes a thermal mitigation system that operates to reduce performance of a component of the device to prevent the device from getting too hot. The system uses a combination of a time-based technique and a temperature-based technique to perform thermal mitigation. The time-based technique refers to using an indication of the device usage as well as the amount of current drawn by the device at any given time to predict an amount of time that the device is to run in a non-reduced performance mode before reaching a target temperature threshold, and an amount of time for the device to run in a reduced performance mode to cool down. The temperature-based technique refers to monitoring the temperature of the device (or a component of the device) and powering off the device in response to detecting that a monitored temperature exceeds a critical threshold temperature.

A cooling module for a printed circuit board having one or more heat generating components. The cooling module comprises a casing defining a first internal volume adapted for mounting a printed circuit board therein, the casing comprising a first internal major surface and a second internal major surface. The cooling module further comprises a chamber defining a second internal volume in fluid communication with the first internal volume. The first and/or second internal major surface comprises a first cavity. The first and/or second internal major surface further comprises a first channel connecting the first cavity to the second internal volume.

An electronic device and a control method for controlling the electronic device is disclosed. The electronic device includes: a middle frame; a heat source mounted on the middle frame; a housing having a heat dissipation area and a non-heat-dissipation area, the heat source being located between the heat dissipation area and the middle frame, and a heat dissipation coefficient of the heat dissipation area being higher than that of the non-heat-dissipation area; and a processing module, configured to adjust heat dissipation power of the heat dissipation area according to a temperature of a non-contact position of the housing and a measured temperature of a contact position of the housing.

A temperature control method, a memory storage apparatus, and a memory control circuit unit are disclosed. The method includes: detecting a system parameter of the memory storage apparatus, and the system parameter reflects wear of a rewritable non-volatile memory module in the memory storage apparatus; determining a temperature control threshold value according to the system parameter; and performing a temperature reducing operation in response to a temperature of the memory storage apparatus reaching the temperature control threshold value to reduce the temperature of the memory storage apparatus.

A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.