Provided is a communication system including: a first communication bus available for communication of at least a first communication scheme; a second communication bus available for both communication of the first communication scheme and communication of a second communication scheme having a lower processing load than the first communication scheme; a plurality of first communication devices connected to both the first communication bus and the second communication bus; a plurality of second communication devices, connected to the second communication bus, which perform communication through the second communication scheme using the second communication bus; and a processor that detects an abnormality of the first communication bus, wherein each of the plurality of first communication devices performs communication through the first communication scheme using the first communication bus in a case where the abnormality of the first communication bus is not detected by the processor, and performs communication through the first communication scheme using the second communication bus in a case where the abnormality of the first communication bus is detected by the processor.

Mobile devices executing applications utilize data services worldwide. The application executing on these mobile devices may be tested using proxy access devices (PADs) located at various points-of-presence (POPs) at different geolocations. A plurality of PADs in a high density configuration are managed to provide a pool of accessible devices at a POP for developers to utilize in testing. The PADs may comprise consumer-grade devices which individually are less reliable than that desired by an operator of the POP. Systems are used to provide a desired level of reliability by maintaining a reserve of additional PADs, automatically fixing problems, generating trouble tickets for more detailed troubleshooting, and so forth.

A communication module includes a master chip, an encrypted chip electrically connected to the master chip, and a communication chip electrically connected to the master chip, and the master chip includes an MOSI pin connected to an MOSI pin of the encrypted chip, and includes an MISO pin connected to an MISO pin of the encrypted chip, and includes a clock (CLK) pin connected to a CLK pin of the encrypted chip, and includes a CS pin connected to a CS pin of the encrypted chip, and the master chip includes an AUX_ANT pin and a MAIN_ANT pin connected to the communication chip.

A communication module includes a master chip, an encrypted chip electrically connected to the master chip, and a communication chip electrically connected to the master chip, and the master chip includes an MOSI pin connected to an MOSI pin of the encrypted chip, and includes an MISO pin connected to an MISO pin of the encrypted chip, and includes a clock (CLK) pin connected to a CLK pin of the encrypted chip, and includes a CS pin connected to a CS pin of the encrypted chip, and the master chip includes an AUX_ANT pin and a MAIN_ANT pin connected to the communication chip.

Various examples described herein provide for determining a first data input/output (I/O) type of a computing device module and a second data I/O type of an I/O switch module, where the computing device module and the I/O switch module are coupled through a backplane system that includes a retimer. In response to the first data I/O type matching the second data I/O type, a connection between the computing device module and the I/O switch module may be permitted or prevented via the retimer.

Various examples described herein provide for determining a first data input/output (I/O) type of a computing device module and a second data I/O type of an I/O switch module, where the computing device module and the I/O switch module are coupled through a backplane system that includes a retimer. In response to the first data I/O type matching the second data I/O type, a connection between the computing device module and the I/O switch module may be permitted or prevented via the retimer.

Techniques are disclosed for performing secure remote bootstrapping operations of a network device such that sensitive configuration resides in volatile memory or is inaccessible upon power loss. In one example, a network device performs a first request for onboarding information. In response to determining that a first initialization of the network device has not occurred, the network device performs the first initialization by configuring, with the onboarding information, the network device to mount a portion of a file system to a volatile memory and not a non-volatile memory. After rebooting, the network device performs a second request for the onboarding information. In response to determining that the first initialization of the network device has occurred, the network device performs a bootstrapping operation of the network device. The bootstrapping operation may configure the network device for remote management such that any subsequent configuration obtained remotely is not retained on power loss.

A computation unit having at least one computation core, a primary memory device, and at least one main connecting unit for connecting the at least one computation core to the primary memory device, the computation unit having at least two functional units, at least a first functional unit of the at least two functional units being embodied a) to receive first data from at least one further functional unit of the at least two functional units, and/or b) to transmit second data to at least one further functional unit of the at least two functional units.

A set of the dies and the package are provided with a plurality of dies each including at least an accelerator core or a CPU core, an external interface, memory interfaces, and a die interface for connecting to another die. At least two dies of the set of dies include a first type die and a second type die each including both the accelerator core and the CPU core, and the core number ratio between the accelerator core and the CPU core in the first type die differs from that in the second type die. The memory interfaces include an interface conforming to TCI. The memory interfaces further include an interface conforming to HBM.

A set of the dies and the package are provided with a plurality of dies each including at least an accelerator core or a CPU core, an external interface, memory interfaces, and a die interface for connecting to another die. At least two dies of the set of dies include a first type die and a second type die each including both the accelerator core and the CPU core, and the core number ratio between the accelerator core and the CPU core in the first type die differs from that in the second type die. The memory interfaces include an interface conforming to TCI. The memory interfaces further include an interface conforming to HBM.