A multichip package having a main die coupled to one or more daughter dies is provided. The main die may include embedded universal interface blocks (UIB) each of which can be used to interface with a corresponding daughter die to support high bandwidth parallel or serial communications. Each UIB may include an integrated processor subsystem and associated pattern sequencing logic to perform interface initialization and margining operations. Each UIB may perform simultaneous accesses to a daughter die across one or more channels. Each UIB may also include multiple phase-locked loop circuits for providing different clock signals to different portions of the UIB and a 2 clock phase generation logic. Each UIB may include multiple IO modules, each of which may optionally include its own duty cycle correction circuit. Each IO module may include buffer circuits, each of which may have a de-emphasis control logic for adjusting buffer drive strength.

An expansion card may include a printed circuit board and a hardware accelerator that is disposed on the printed circuit board. The hardware accelerator may include application-specific hardware circuitry designed to perform a computing task. The hardware accelerator may also offload a portion of the computing task from a central processing unit of a computing device by executing, via the application-specific hardware circuitry, the portion of the computing task. The expansion card may further include an edge connector, disposed on the printed circuit board, that is dimensioned to be inserted into an expansion socket of the computing device. The edge connector may couple the hardware accelerator to the central processing unit via a computing bus connected to the expansion socket. The edge socket may also include a pinout that is more compact than a pinout specification defined for the computing bus. Various other apparatuses, systems, and methods are also disclosed.

The present invention relates to cache coherent node controllers for scale-up shared memory systems. In particular it is disclosed a computer system at least comprising a first group of CPU modules connected to at least one first FPGA Node Controller configured to execute transactions directly or through a first interconnect switch to at least one second FPGA Node Controller connected to a second group of CPU modules running a single instance of an operating system.

A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

A multichip package having a main die coupled to one or more daughter dies is provided. The main die may include embedded universal interface blocks (UIB) each of which can be used to interface with a corresponding daughter die to support high bandwidth parallel or serial communications. Each UIB may include an integrated processor subsystem and associated pattern sequencing logic to perform interface initialization and margining operations. Each UIB may perform simultaneous accesses to a daughter die across one or more channels. Each UIB may also include multiple phase-locked loop circuits for providing different clock signals to different portions of the UIB and a 2 clock phase generation logic. Each UIB may include multiple IO modules, each of which may optionally include its own duty cycle correction circuit. Each IO module may include buffer circuits, each of which may have a de-emphasis control logic for adjusting buffer drive strength.

An expansion card may include a printed circuit board and a hardware accelerator that is disposed on the printed circuit board. The hardware accelerator may include application-specific hardware circuitry designed to perform a computing task. The hardware accelerator may also offload a portion of the computing task from a central processing unit of a computing device by executing, via the application-specific hardware circuitry, the portion of the computing task. The expansion card may further include an edge connector, disposed on the printed circuit board, that is dimensioned to be inserted into an expansion socket of the computing device. The edge connector may couple the hardware accelerator to the central processing unit via a computing bus connected to the expansion socket. The edge socket may also include a pinout that is more compact than a pinout specification defined for the computing bus. Various other apparatuses, systems, and methods are also disclosed.

The embodiments described herein describe technologies for memory systems. One implementation of a memory system includes a motherboard substrate with multiple module sockets, at least one of which is populated with a memory module. A first set of data lines is disposed on the motherboard substrate and coupled to the module sockets. The first set of data lines includes a first subset of point-to-point data lines coupled between a memory controller and a first socket and a second subset of point-to-point data lines coupled between the memory controller and a second socket. A second set of data lines is disposed on the motherboard substrate and coupled between the first socket and the second socket. The first and second sets of data lines can make up a memory channel.

A motherboard includes a multilayer printed circuit board (PCB), a central processing unit (CPU) slot, at least one first memory slot, at least one second memory slot, a plurality of first traces, and a plurality of second traces. The CPU slot, the first memory slot, and the second memory slot are disposed on the first wiring layer of the multilayer PCB, and the second memory slot is disposed between the first memory slot and the CPU slot. The first traces are disposed on the first wiring layer of the multilayer PCB. The CPU slot is electrically connected to the first memory slot by the first traces. The second traces are disposed on the second wiring layer of the multilayer PCB which is different from the first wiring layer, and the CPU slot is electrically connected with the second memory slot by the second traces.

According to an embodiment, an electronic circuit board includes a nonvolatile memory, a reading circuit to read data stored in the nonvolatile memory, a switch, and a communication circuit. When power is supplied from a first power source, the switch performs switching to a first state in which the nonvolatile memory and a host device configured to read and write data from and in the nonvolatile memory are connected. When power is supplied from a second power source, the switch performs switching to a second state in which the host device and the nonvolatile memory are not connected and the reading circuit and the nonvolatile memory are connected. The communication circuit transmits, to an external device, the data read by the reading circuit from the nonvolatile memory when power is being supplied from the second power source.

A multichip package having a main die coupled to one or more daughter dies is provided. The main die may include embedded universal interface blocks (UIB) each of which can be used to interface with a corresponding daughter die to support high bandwidth parallel or serial communications. Each UIB may include an integrated processor subsystem and associated pattern sequencing logic to perform interface initialization and margining operations. Each UIB may perform simultaneous accesses to a daughter die across one or more channels. Each UIB may also include multiple phase-locked loop circuits for providing different clock signals to different portions of the UIB and a 2 clock phase generation logic. Each UIB may include multiple IO modules, each of which may optionally include its own duty cycle correction circuit. Each IO module may include buffer circuits, each of which may have a de-emphasis control logic for adjusting buffer drive strength.