In some embodiments, an apparatus can include a printed circuit board (PCB) that has layers and includes a first portion and a second portion. The first portion can have a data port and a power port. A first layer is associated with data of the first portion of the PCB, and a second layer is associated with power of the first portion of the PCB. The second portion can have a data port and a power port. A third layer is associated with data of the second portion, and a fourth layer is associated with power of the second portion. The first portion or the second portion can have vias defining an electromagnetic interference (EMI) shield. The apparatus can include a power filter and a data filter that can, respectively, isolate power and data of the first portion from the second portion.

A method is disclosed, including the following operations: arranging a first gate structure extending continuously above a first active region and a second active region of a substrate; arranging a first separation spacer disposed on the first gate structure to isolate an electronic signal transmitted through a first gate via and a second gate via that are disposed on the first gate structure, in which the first gate via and the second gate via are arranged above the first active region and the second active region respectively; and arranging a first local interconnect between the first active region and the second active region, in which the first local interconnect is electrically coupled to a first contact disposed on the first active region and a second contact disposed on the second active region.

A method is disclosed, including the following operations: arranging a first gate structure extending continuously above a first active region and a second active region of a substrate; arranging a first separation spacer disposed on the first gate structure to isolate an electronic signal transmitted through a first gate via and a second gate via that are disposed on the first gate structure, in which the first gate via and the second gate via are arranged above the first active region and the second active region respectively; and arranging a first local interconnect between the first active region and the second active region, in which the first local interconnect is electrically coupled to a first contact disposed on the first active region and a second contact disposed on the second active region.

Techniques and architecture are disclosed for a method for making a custom circuit comprising forming a common wafer template, selecting at least two elements of the common wafer template to be chosen elements, and adding at least one metal layer to interconnect the chosen elements to form a circuit. The common wafer template includes a plurality of transistors, a plurality of resistors, a plurality of capacitors, and a plurality of bond pads. Final circuit customization of the common wafer template is accomplished by adding at least one metal layer that forms interconnects to passive and active elements in the template in order to complete the circuit.

An integrated circuit includes a standard cell including a first output pin and a second output pin configured to each output the same output signal, a first routing path connected to the first output pin, and a second routing path connected to the second output pin. The first routing path includes a first cell group including at least one load cell, the second routing path includes a second cell group including at least one load cell, and the first routing path and the second routing path are electrically disconnected from each other outside the standard cell.

An integrated circuit includes a standard cell including a first output pin and a second output pin configured to each output the same output signal, a first routing path connected to the first output pin, and a second routing path connected to the second output pin. The first routing path includes a first cell group including at least one load cell, the second routing path includes a second cell group including at least one load cell, and the first routing path and the second routing path are electrically disconnected from each other outside the standard cell.

A computer-readable storage medium that stores computer program code which, when executed by one or more processors, causes the one or more processors to execute tools for designing an integrated circuit (IC). The tools include a placing and routing tool that generates layout data and wire data corresponding to a net included in the IC by placing and routing standard cells defining the IC, the wire data including physical information of a wire implementing the net, and a timing analysis tool that calculates a wire delay with respect to the wire corresponding to the net, based on the physical information, updates the wire delay based on process variation of the wire, and calculates a timing slack by using the updated wire delay.

A computer-readable storage medium that stores computer program code which, when executed by one or more processors, causes the one or more processors to execute tools for designing an integrated circuit (IC). The tools include a placing and routing tool that generates layout data and wire data corresponding to a net included in the IC by placing and routing standard cells defining the IC, the wire data including physical information of a wire implementing the net, and a timing analysis tool that calculates a wire delay with respect to the wire corresponding to the net, based on the physical information, updates the wire delay based on process variation of the wire, and calculates a timing slack by using the updated wire delay.

Methods and systems of routing a design layout include setting an inner region and an outer region for modification of structures in an original design layout, in accordance with a minimum spacing that is based on a fabrication process. Routing of trim positions and conductive wire extents is performed within the inner region, based on positions of shapes within the outer region, including node folding of a new constraint graph to minimize perturbations from a previous constraint graph, to generate an updated design layout that can be manufactured using the fabrication process.

Methods and systems of routing a design layout include setting an inner region and an outer region for modification of structures in an original design layout, in accordance with a minimum spacing that is based on a fabrication process. Routing of trim positions and conductive wire extents is performed within the inner region, based on positions of shapes within the outer region, including node folding of a new constraint graph to minimize perturbations from a previous constraint graph, to generate an updated design layout that can be manufactured using the fabrication process.