Patent classifications
G06F2200/1635
Computing device display bonding
The description relates to display devices. One example can include a display having an active area surrounded by an inactive deadband. The example can also include a chassis, the display received in the chassis and secured to the chassis beneath the inactive deadband with adhesive. The example can further include a fastening assembly positioned below the inactive deadband and farther beneath the plane than the adhesive, where the fastening assembly creates a retention force between the display and the chassis.
COMPUTER WITH FUNCTION EXPANSION MECHANISM AND FUNCTION EXPANSION METHOD WITHOUT REMOVAL OF COMPUTER
A computer with a function expansion mechanism includes a computer host and a function expansion device. The computer host includes a base and a functional base cover covering the base. A bottom surface of the base has a first opening, and the base is provided therein with a connector exposed from the first opening. The function expansion device includes an expansion seat, a top surface of the expansion seat has a second opening, and the expansion seat is provided therein with a docking connector exposed from the second opening. The computer host is stacked and assembled by the bottom surface at the top surface of the function expansion device, such that the first opening and the second opening are in communication with each other and the connector and the docking connector are mutually docked, thereby achieving an effect of function expansion without removal of a computer.
HEADER FOR MODULAR ENERGY SYSTEM
A modular energy system is disclosed including a header module including an enclosure and a display including a coupler. The enclosure defines a recess. The recess includes a first guidewall and a second guidewall. The coupler is removably positionable in the recess. The coupler includes a first sidewall and a second sidewall. The first guidewall is configured to guide the first sidewall as the coupler moves through the recess. The second guidewall is configured to guide the second sidewall as the coupler moves through the recess.
Portable blockchain mining systems and methods of use
Portable blockchain mining systems and methods of use are discussed here. Systems include a portable building; a plurality of blockchain mining processors mounted within, or a plurality of blockchain mining processor mounts located within, an interior of the portable building; an air inlet defined in the portable building; and an air outlet defined in the portable building. Air outlets may be above the air inlet and oriented to direct exhaust air in an upward direction out of the portable building. A cooling fan may be connected to convey air through the air inlet, across the plurality of blockchain mining processors and out the air outlet. The cooling fan may simultaneously cool a genset and processors 72. Compact, stackable mining modules are discussed.
CONTROLLER WITH BIOMETRIC SENSOR PATTERN
In one example, a display unit comprises a display panel that is configured to display digital images. The display unit further comprises an at least partially transparent protective layer that is arranged above the display panel. The display unit further comprises a controller that is communicatively attached onto an upper surface of the display panel. A biometric sensor pattern is integrated in the controller, and the controller is configured to control the biometric sensor pattern.
Computer and high-density server accommodating multiple modules
A computer, serving as a high-density server, includes a substrate, a plurality of connectors each including a plurality of electrodes, and a plurality of modules detachably attached to the substrate via connectors. The modules are attached to the connectors via different combinations of electrodes such that a first module (e.g. a CPU) is attached to one connector via a first combination of electrodes while a second module (e.g. a storage module or an attachment module) is attached to another connector via a second combination of electrodes. The connectors are aligned in a first direction on the substrate or in an array defined by first and second directions perpendicular to each other, wherein the connectors are selectively and electrically connected together with electrodes.
ELECTRONIC DEVICE AND CONTROL METHOD THEREOF
A plurality of modules are connected to the front side and back side of an electronic device via corresponding attachment/detachment units. The electronic device includes an orientation detection unit that detects the orientation of the electronic device. Based on a selection of a module to be removed and a touch operation on a touch panel of the electronic device, the selected module is determined to be either on the front side or the back side of the electronic device. When the electronic device is in an orientation suitable for removal of the selected module, the module is disconnected from the electronic device by a corresponding attachment/detachment unit.
Voice-activated electronic device assembly with separable base
A voice-activated electronic device including a first portion with a first internal surface having a first attachment structure, and a second portion with a second internal surface having a second attachment structure. The first and second internal surfaces have compatible shapes that permit the first and second portions to be moved from a separated position to a joined position, where when the first portion and the second portion are in the joined position the first and second internal surfaces form a nested arrangement. The first and second attachment structures form a secure but separable connection to one another when the first and second portions are in the joined position. The first and second portions are configured to be joined securely and separated through manual human manipulation of one or both of the first portion and the second portion to move the first and second portions between separated and joined positions.
3-DIMENSIONAL MULTI-LAYERED MODULAR COMPUTER ARCHITECTURE
A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.
Docking Station for Blade Computing Device
A docking station for a blade computing device includes a power supply, a cooling system, a communication interface to connect the docking station to an external device and an electrical connector to connect the docking station to a blade computing device.