To facilitate evaluation of a predicted process shape in process recipe development using machine learning, a process recipe search apparatus that searches for an etching recipe that is a parameter of a plasma processing apparatus set so as to etch a sample into a desired shape displays, on a display device, the predicted process shape of the sample by a candidate etching recipe predicted by using a machine leaning model, by highlighting a difference between the predicted process shape and a target shape.

A method includes determining topographic information of a substrate for use in a lithographic imaging system, determining or estimating, based on the topographic information, imaging error information for a plurality of points in an image field of the lithographic imaging system, adapting a design for a patterning device based on the imaging error information. In an embodiment, a plurality of locations for metrology targets is optimized based on imaging error information for a plurality of points in an image field of a lithographic imaging system, wherein the optimizing involves minimizing a cost function that describes the imaging error information. In an embodiment, locations are weighted based on differences in imaging requirements across the image field.

A method for evaluating a turbine component includes inducing a thermal response of the component at an initial time, capturing a two-dimensional infrared image of the thermal response of the component with a thermal imaging device, wherein the two-dimensional infrared image comprises a plurality of infrared image pixels, generating a two-dimension to three-dimension mapping template to correlate two-dimensional infrared image data with three-dimensional locations on the component, mapping at least a subset of the plurality of infrared image pixels of the two-dimensional infrared image to three-dimensional coordinates using the mapping template, and generating a three-dimensional infrared image and infrared data of the component from the mapped infrared image pixels to three-dimensional coordinates, wherein the three-dimensional infrared image and infrared data is used to qualify the component for use.

A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.

The disclosure provides a surface inspection apparatus for inspecting a surface of an object, a non-transitory computer readable medium thereof, and a surface inspection method thereof. According to an aspect of the disclosure, the surface inspection apparatus includes an imaging device configured to image a surface of an object to be inspected, and a processor configured to calculate a numerical value representing a quality of the surface by processing an image captured by the imaging device, and display, on a display device, the image including an index for specifying a position of a portion that has contributed to the calculation of the numerical value and the numerical value.

A data processing device for detecting defects in sample image data generated by a charged particle assessment system, the device comprising: a first processing module configured to receive a sample image datastream from the charged particle assessment system, the sample image datastream comprising an ordered series of data points representing an image of the sample, and to apply a first defect detection test to select a subset of the sample image datastream as first selected data, wherein the first defect detection test is a localised test which is performed in parallel with receipt of the sample image datastream; and a second processing module configured to receive the first selected data and to apply a second defect detection test to select a subset of the first selected data as second selected data.

Some embodiments provide a method for calculating parasitic parameters for a pattern to be manufactured on an integrated circuit (IC) substrate. The method receives a definition of a wire structure as input. The method rasterizes the wire structure (e.g., produces pixel-based definition of the wire structure) to produce several images. Before rasterizing the wire structure, the method in some embodiments decomposes the wire structure into several components (e.g., several wires, wire segments or wire structure portions), which it then individually rasterizes. The method then uses the images as inputs to a neural network, which then calculates parasitic parameters associated with the wire structure. In some embodiments, the parasitic parameters include unwanted parasitic capacitance effects exerted on the wire structure. Conjunctively, or alternatively, these parameters include unwanted parasitic resistance and/or inductance effects on the wire structure.

There is provided a system and a method comprising obtaining data D.sub.contour informative of a contour of an element of a semiconductor specimen acquired by an examination tool, using the data D.sub.contour to generate a signal informative of a curvature of the contour of the element, determining at least one of data D.sub.periodicity informative of a periodicity of the signal, or data D.sub.discontinuities informative of a number of discontinuities in the signal, wherein each discontinuity is informative of a transition between a convex portion of the contour and a concave portion of the contour, and using at least one of the data D.sub.periodicity or the data D.sub.discontinuities to determine data informative of correct manufacturing of the element.

Provided is a method of measuring uniformity of a signal line pattern formed on a printed circuit board. The method includes acquiring, by a microscope camera, an image by photographing straight-line shaped dummy signal line patterns formed side by side in a lateral or longitudinal direction on a surface of the outer-layer board, receiving, by a processor included in computing equipment, the image from the microscope camera and marking a first virtual line and a second virtual line, which cross the dummy signal line patterns in the longitudinal direction, on the image, generating, by a user interface included in the computing equipment, intersection points between the first and second virtual lines and the dummy signal line patterns on the image according to manipulation of a measurer, calculating, by the processor, a first distance value between adjacent intersection points located on the first virtual line and a second distance value between adjacent intersection points located on the second virtual line, and measuring, by the processor, uniformity of the signal line pattern on the basis of a difference value between the first distance value and the second distance value.

Methods and apparatuses related to fiducial designs for fiducial markers on glass substrates, or other transparent or translucent substrates, are disclosed. Example fiducial designs can facilitate visual recognition by enhancing edge detection in visual perception. In example fiducial designs, optical features on glass substrates can re-direct light so as to present a bright image region. Such optical features can include surface relief patterns formed in a coating on the surface of glass substrates. An exemplary method for manufacturing the fiducial markers can involve transfers of a fiducial design across a master mold or plate, a submaster mold or plate, and a target glass substrate. A fiducial marker can facilitate the use of the substrate in a variety of applications, including machine vision systems that facilitate automated performance of manufacturing processes on input working material.