Systems, methods, storage media, and computing platforms for scanning items at the point of manufacturing are disclosed. Exemplary implementations may: receive a first set of images of an item from a first set of camera sources; detect a code in the first set of images; combine, responsive to detecting the code, along a second axis perpendicular to the first axis, the first set of images into a first set of combined images; rotate parallel to the first axis; and combine along the first axis.

Even when a missing portion occurs in a solid data set on a columnar structure, an estimator for a deflection value and an accuracy of the deflection value are correctly estimated according to an extent of the missing portion and the like. A measurement accuracy estimation unit (15) is included that: calculates a deflection of a columnar structure and an extent of a missing portion, from a solid data set on the columnar structure; calculates an accuracy assessment indicator for the deflection that is acquirable when a plurality of missing portion patterns occur on a virtual basis, based on a plurality of solid data sets in each of which the calculated extent of the missing portion is smaller than a preset threshold value, the accuracy assessment indicator being calculated for each missing portion pattern; and calculates an accuracy of the deflection calculated from the solid data set, based on the calculated accuracy assessment indicator for each missing portion pattern, and based on the calculated extent of the missing portion in the solid data set.

A dismantling procedure selecting apparatus includes a dismantling information storage unit that stores a plurality of pieces of dismantling information respectively including a plurality of predetermined dismantling procedures for a plurality of dismantled objects each used as a reference for dismantling an object to be dismantled, a whole detector that captures a whole image of the object to be dismantled, a detail detector that captures an image of at least a portion of the object to be dismantled, and a dismantling procedure deriving unit that extracts a first feature as a feature of the object to be dismantled based on data obtained by capturing an image by at least one of the whole detector and the detail detector, obtains a degree of matching between the first feature and each of a plurality of second features that are respectively features of a plurality of dismantled objects, and selects a dismantling procedure associated with one of a plurality of the dismantled objects having a second feature having a highest degree of matching among a plurality of second features.

An optical inspection is performed to detect potential defects within integrated circuit devices and a first electron-based inspection of less than all of the potential defects is performed to identify primary actual defects. A process window of manufacturing parameter settings used to manufacture the integrated circuit devices is identified and the integrated circuit devices manufactured using the manufacturing parameter settings inside the process window have less than a threshold number of the primary actual defects. To identify additional actual defects a second electron-based inspection is performed that is limited to selected ones of the potential defects in the integrated circuit devices that were manufactured using the manufacturing parameter settings inside the process window but were uninspected in the first electron-based inspection.

Aspects of the disclosure provide methods and apparatuses of quality assessment for three dimensional (3D) graphics modeling. In some examples, an apparatus for quality assessment includes processing circuitry. The processing circuitry determines an updated virtual camera position in response to a position change of a virtual camera for projection from a three-dimensional (3D) space to a two-dimensional (2D) space. The processing circuitry projects a reference 3D representation according to the updated virtual camera position to generate a reference 2D image, and projects a 3D representation under assessment according to the updated virtual camera position to generate an assessment 2D image. The processing circuitry calculates an assessment score associated with the updated virtual camera position based on the reference 2D image and the assessment 2D image.

A method of locating a defect in an e-coat on a surface can include acquiring an image of the surface. A correction coefficient can be applied to the image to form an adjusted image. The correction coefficient can relate pixel values of the image to a calibration value. The adjusted image can be separated into a spectral component which can be modified by a block average determination to create a modified spectral component. The spectral components can be compared with the modified spectral components to form a difference image. The difference image can be dilated and eroded. A region of interest can be identified from an image region using a blob detection. The defect can be classified as a defect type. The defect can be repaired or a coding parameter can be altered based on the defect.

The invention relates to a method for characterizing, from a volume image, a fibrous structure having a three-dimensional weaving between a plurality of warp yarns extending along a first direction and a plurality of weft yarns extending along a second direction perpendicular to the first one, the method comprising: a first processing (E10) of the volume image by filtering along a third direction perpendicular to the first and second directions so as to attenuate the periodic patterns along the third direction, obtaining (E20) a two-dimensional image corresponding to an intermediate plane along the third direction of the filtered volume image, a second processing (E31, E41) of the two-dimensional image by filtering along the first or second direction so as to attenuate the periodic patterns, obtaining (E32, E33) a one-dimensional profile representing the positions of warp or weft columns and corresponding to an intermediate line along the first or second direction of the filtered two-dimensional image, and comparing (E33, E43) the one-dimensional profile with a reference profile.

A method for detecting defects in a formed metal part includes locating one or more regions of interest in a synthetic image of a part manufactured by a forming process. The synthetic image is informed based on a physics-based simulation of the forming process. The regions of interest indicate a high risk of having a defect from the forming process. A set of training images including real images of actual manufactured parts are registered with the synthetic image. The regions of interest are overlaid on each training image, to extract patches from the training images that correspond to high-risk regions. An anomaly detection model is trained on the patches extracted from the training images to detect a defect in a formed metal part from an acquired image of the formed metal part, by detecting an anomaly in a patch extracted from the acquired image that corresponds to a high-risk region.

The invention concerns a method (1) to detect deformations of, and/or damages to, structures permanently arranged on the earth's surface. In particular, said method (1) comprises: acquiring (11) georeferencing data indicative of geographical reference positions of predefined points of interest of a given structure to be monitored permanently arranged on the earth's surface, wherein said predefined points of interest are representative of a 3D geometry of the given structure without deformations and damages; acquiring (12) a SAR image of an area of the earth's surface where the given structure is arranged, wherein said SAR image is associated with a given reference coordinate system; transforming (13) the geographical reference positions of the predefined points of interest into corresponding expected positions in the given reference coordinate system associated with the acquired SAR image so as to carry out a reprojection of the 3D geometry of the given structure without deformations and damages on the acquired SAR image; identifying (14) in the acquired SAR image the predefined points of interest of the given structure; determining (15) actual positions in the given reference coordinate system associated with the acquired SAR image of the predefined points of interest identified in said SAR image; making a comparison (16) between the expected positions of the predefined points of interest and the corresponding actual positions in the acquired SAR image; and detecting (17) one or more deformations of, and/or one or more damages to, said given structure on the basis of the comparison made.

A solder printing inspection device includes: an illumination device that irradiates, with a predetermined light, a printed circuit board on which a solder paste is printed; an imaging device that takes an image of the printed circuit board irradiated with the predetermined light and obtains image data; and a control device that: based on the image data, obtain three-dimensional measurement data of the solder paste printed on the printed circuit board, based on the three-dimensional measurement data, extracts upper portion shape data of an upper portion of the solder paste, the upper portion having a height equal to or higher than a predetermined height, and compares the upper portion shape data with a predetermined criterion and determines whether a quality of a three-dimensional shape of the upper portion of the solder paste is good or poor.