There are provided an imaging device, a distance measurement method, a distance measurement program, and a recording medium capable of accurately measuring a distance to a subject without depending on a color of the subject. A bifocal imaging lens, a first pixel and a second pixel that respectively pupil-divide and selectively receive luminous flux incident through a first region of the first region and a second region having different focusing distances of the imaging lens, an image sensor having a third pixel and a fourth pixel corresponding to the second region, a first image acquisition unit (41-1) and a second image acquisition unit (41-2) that acquire a first image and a second image having asymmetric blurs from a first pixel group (22A) and a third pixel group (22C) of the image sensor, a third image acquisition unit (43-1) and a fourth image acquisition unit (43-2) that add pixel values of adjacent pixels of the first and second pixels of the image sensor and add pixel values of adjacent pixels of the third and fourth pixels to acquire a third image and a fourth image having symmetric blurs, and a distance calculation unit (45) that calculates a distance to a subject in the image based on the acquired first and third images or the acquired second and fourth images are included.

A system and method of determining synthetic dual-pixel data, performing deblurring, predicting dual pixel views, and view synthesis. The method including: receiving an input image; determining synthetic dual-pixel data using a trained artificial neural network with the input image as input to the trained artificial neural network, the trained artificial neural network includes a latent space encoder, a left dual-pixel view decoder, and a right dual-pixel view decoder; and outputting the synthetic dual-pixel data. In some cases, determination of the synthetic dual-pixel data can include performing reflection removal, defocus deblurring, or view synthesis.

A system and method of determining synthetic dual-pixel data, performing deblurring, predicting dual pixel views, and view synthesis. The method including: receiving an input image; determining synthetic dual-pixel data using a trained artificial neural network with the input image as input to the trained artificial neural network, the trained artificial neural network includes a latent space encoder, a left dual-pixel view decoder, and a right dual-pixel view decoder; and outputting the synthetic dual-pixel data. In some cases, determination of the synthetic dual-pixel data can include performing reflection removal, defocus deblurring, or view synthesis.

An image processing method includes a first step of acquiring a first image having disparity information and refocus information, and a second step of inputting the first image or the disparity information and the refocus information into a machine learning model, and of generating a second image having an in-focus position different from an in-focus position of the first image based on the refocus information. The refocus information is information on a distance between the in-focus position of the first image and the in-focus position of the second image.

An image processing method includes a first step of acquiring a first image having disparity information and refocus information, and a second step of inputting the first image or the disparity information and the refocus information into a machine learning model, and of generating a second image having an in-focus position different from an in-focus position of the first image based on the refocus information. The refocus information is information on a distance between the in-focus position of the first image and the in-focus position of the second image.

A metrology system is provided including a projected pattern for points-from-focus type processes. The metrology system includes an objective lens portion, a light source, a pattern projection portion and a camera. Different lenses (e.g., objective lenses) having different magnifications and cutoff frequencies may be utilized in the system. The pattern projection portion includes a pattern component with a pattern. At least a majority of the area of the pattern includes pattern portions that are not recurring at regular intervals across the pattern (e.g., as corresponding to a diverse spectrum of spatial frequencies that result in a relatively flat power spectrum over a desired range and with which different lenses with different cutoff frequencies may be utilized). The pattern is projected on a workpiece surface (e.g., for producing contrast) and an image stack is acquired, from which focus curve data is determined that indicates 3 dimensional positions of workpiece surface points.

A metrology system is provided including a projected pattern for points-from-focus type processes. The metrology system includes an objective lens portion, a light source, a pattern projection portion and a camera. Different lenses (e.g., objective lenses) having different magnifications and cutoff frequencies may be utilized in the system. The pattern projection portion includes a pattern component with a pattern. At least a majority of the area of the pattern includes pattern portions that are not recurring at regular intervals across the pattern (e.g., as corresponding to a diverse spectrum of spatial frequencies that result in a relatively flat power spectrum over a desired range and with which different lenses with different cutoff frequencies may be utilized). The pattern is projected on a workpiece surface (e.g., for producing contrast) and an image stack is acquired, from which focus curve data is determined that indicates 3 dimensional positions of workpiece surface points.

A distance measurement camera 1 contains a first optical system OS1 for collecting light from a subject 100 to form a first subject image, a second optical system OS2 for collecting the light from the subject 100 to form a second subject image, an imaging part S for imaging the first subject image formed by the first optical system OS1 and the second subject image formed by the second optical system OS2, and a distance calculating unit 4 for calculating the distance to the subject 100 based on the first subject image and the second subject image imaged by the imaging part S. The distance calculating part 4 calculates the distance to the subject 100 based on an image magnification ratio between a magnification of the first subject image and a magnification of the second subject image.

A distance measurement camera 1 contains a first optical system OS1 for collecting light from a subject 100 to form a first subject image, a second optical system OS2 for collecting the light from the subject 100 to form a second subject image, an imaging part S for imaging the first subject image formed by the first optical system OS1 and the second subject image formed by the second optical system OS2, and a distance calculating unit 4 for calculating the distance to the subject 100 based on the first subject image and the second subject image imaged by the imaging part S. The distance calculating part 4 calculates the distance to the subject 100 based on an image magnification ratio between a magnification of the first subject image and a magnification of the second subject image.

A coordinate measuring machine (CMM) system is provided including utilization of a vision probe (e.g., for performing operations for determining and/or measuring surface profiles of workpieces, etc.) The angular orientation of the vision probe may be adjusted using a rotation mechanism so that the optical axis of the vision probe is directed toward an angled surface of a workpiece (e.g., in some implementations the optical axis may be approximately perpendicular to the angled workpiece surface). X-axis, y-axis and z-axis slide mechanisms (e.g., moving in mutually orthogonal directions) may in conjunction move the vision probe to acquisition positions along an image stack acquisition axis (which may approximately coincide with the optical axis) for acquiring a stack of images of the angled workpiece surface. Focus curve data may be determined from analysis of the image stack, which indicates 3-dimensional positions of surface points on the angled surface of the workpiece.