A recognition device includes an imaging device that images a tip of the lead of a lead component multiple times at different shutter speeds, and multiple pieces of captured image data corresponding to the multiple times of imaging are generated. Then, it is determined whether the tip position of the lead is recognizable based on each of the multiple pieces of captured image data, and a shutter speed between the fastest shutter speed and the slowest shutter speed among the shutter speeds at the time of imaging according to the pieces of captured image data, which are determined to be recognizable, is determined as the optimum shutter speed. By determining the optimum shutter speed in this manner, the exposure light amount at the time of imaging can be stabilized regardless of the shape of the tip of the lead, and the tip position of the lead can be appropriately recognized.

A capacitor testing device includes a carrier with a plurality of clamping holes which are configured to carry capacitors to be tested; a conveying means being configured to convey the carrier; an image collection assembly, including an upper image collection assembly disposed above the conveying means and a lower image collection assembly disposed below the conveying means, the upper image collection assembly and the lower image collection assembly being configured to perform defect testing on outer surfaces of the capacitors to be tested; and a performance testing means, including a performance testing circuit board and a lifting assembly being configured to drive the performance testing circuit board to ascend or descend, and the performance testing means being configured to test electrical performances of the capacitors to be tested.

A system for inspecting an object for defects includes a component inspecting module (4) and an inspecting module (7). The system executes the following steps: identifying at least one component (400) and detecting defects of the identified component (400) through comparing one or more characteristics of at least one element of the component (400) with those of a specimen, wherein the components (400) of the object, upon being identified, are each assigned a corresponding inspection algorithm (307) by an assigning module (6) based on an inspection criteria for the object to be inspected.

A component mounter images suction states of components picked up by a suction nozzle, processes images of the suction states of the components to recognize the suction state of the component, and stores the images in a storage device with linking production information related to the components. An inspection machine images a mounted state of each component on a board, processes an image of mounted state of each component to recognize the mounted state of each component, and inspects whether a mounting error occurred for each component based on the recognition result. The inspection machine determines that a mounting error occurred for any of the components the image of the mounted state of the component for which a mounting error was determined to have occurred and a searched image of the suction state of the component are displayed on the display monitor in a comparative manner.

An abnormality diagnosis system includes an image acquisition unit and an abnormality determination unit. The image acquisition unit acquires a circuit image to be diagnosed which is an image visually representing a logical circuit in a control apparatus that controls an apparatus in a facility and a control state in the logical circuit, and is a subject of an abnormality diagnosis. The abnormality determination unit determines whether or not there is a deviation between the circuit image to be diagnosed acquired by the image acquisition unit and a normal circuit image, which is a circuit image in a state in which a facility related to the control apparatus corresponding to the circuit image to be diagnosed is in a normal state. The abnormality determination unit determines that an abnormality has occurred in the facility when it is determined that there is a deviation.

The image generation method includes: selecting a clip area (C1) in which a pattern having a uniqueness value higher than the threshold value exists; determining a first specific point (P1) which is a specific point existing in the selected clip area (C1); generating an image of a first point (F1) on a chip by a scanning electron microscope, the first point (F1) being specified by coordinates of the first specific point (P1); calculating a vector (V1) indicating deviation between the first specific point (P1) and the first point (F1) on the image; determining a second specific point (P5) in a clip area in which a pattern having a uniqueness value equal to or less than the threshold value exists; and correcting coordinates of the second specific point (P5) based on the vector (V1).

An electronic component mounter where information indicating completion of component mounting is memorized each time a component is mounted on circuit board by suction nozzle. Then, in a case in which mounting work is interrupted by a stoppage of the electronic component mounter and then restarted, the mounting position of the electronic component is imaged by mark camera according to information memorized immediately before the mounting work was interrupted. Also, with the electronic component mounter, in a case in which mounting work is interrupted by a stoppage of the mounter and then restarted, the mark camera is moved along a path over which the suction nozzle moved until the position of the suction nozzle when mounting work was interrupted. Here, imaging of the circuit board is performed by the mark camera.

A component orientation determination data creation device for creating component orientation determination data used in a component orientation determination system that determines an orientation of the component by comparing a brightness value of a determination region specified in the component orientation determination data within an image of the component captured by a camera with a determination threshold. A difference image between an image of the component in a correct orientation and an image of the component in another orientation is calculated by acquiring multiple images of the component in different orientations by changing the orientation with respect to the camera of the component that is the target for the component orientation determination data creation.

There is provided a mask inspection system and a method of mask inspection. The method comprises: during a runtime scan of a mask of a semiconductor specimen, processing a plurality of aerial images of the mask acquired by the mask inspection system to calculate a statistic-based Edge Positioning Displacement (EPD) of a potential defect, wherein the statistic-based EPD is calculated using a Print Threshold (PT) characterizing the mask and is applied to each of the one or more acquired aerial images to calculate respective EPD of the potential defect therein; and filtering the potential defect as a “runtime true” defect when the calculated statistic-based EPD exceeds a predefined EPD threshold, and filtering out the potential defect as a “false” defect when the calculated statistic-based EPD is lower than the predefined EPD threshold. The method can further comprise after-runtime EPD-based filtering of the plurality of “runtime true” defects.

A circuit board detection method includes obtaining an input circuit board image, performing a detection on designated components of a circuit board in the circuit board image according to a preset detection method, determining whether a designated component in the circuit board image that fails the detection is allowed to shift within a preset angle range, and determining that the circuit board passes the detection when the designated component that fails the detection is allowed to shift within the preset angle range. The designated components include one or both of silkscreened components and non-silkscreened components.