The invention relates to a method for determining the performance of a welding method carried out on a metal workpiece, in particular an electric arc welding or laser welding method, with the following steps: introducing one or more extracts of the initial image each having at least one presumed projection, as input to at least one neural network, in particular a convolutional neural network, so as to classify the presumed projections as confirmed or unconfirmed projections, carrying out a second digital processing operation on the initial image comprising the previously classified projections so as to determine at least one parameter representative of the quantity of confirmed projections chosen from the surface of one or more projections.

A substrate foreign matter inspection device includes: an image data obtaining device that obtains image data of a target inspection area in the printed circuit board including a printed portion of the solder paste; a storage that stores a neural network and a model, the model being generated by learning of the neural network that includes an encoding portion and a decoding portion by using, as learning data, only image data of the target inspection area that do not include any foreign matter; and a control device that obtains reconfigured image data by inputting original image data obtained by the image data obtaining device into the model, compares the original image data with the reconfigured image data, and determines whether any foreign matter is present or absent on the printed circuit board based on a result of comparison with the reconfigured image data.

Dynamic range enhancement methods and systems for display for use welding applications are described. A display system in a dynamic range enhancement system can include, for example, a splitter, a high density filter, a low density filter, a first image sensor, a second image sensor, a graphical circuit, and a display. The high density filter and the first image sensor can be disposed in a first path. The low density filter and the second image sensor can be disposed in a second path. The first image sensor can receive filtered electromagnetic waves from the high density filter. The second image sensor can receive filtered electromagnetic waves from the low density filter. The graphic circuit can combine the signals from the first image sensor and the second image sensor to provide a high dynamic range image or video that is displayed on the display of a welding helmet, for example.

A method for detecting a bonding failure part of a compound semiconductor chip cut from a compound semiconductor wafer in which a first transparent substrate composed of a compound semiconductor having a light-emitting layer is bonded with a second transparent substrate composed of a compound semiconductor, includes: irradiating the compound semiconductor chip with a coaxial vertical light, and identifying a color of a reflected-light from the bonding failure part of the compound semiconductor chip to detect the bonding failure part. As a result, a method for detecting a bonding failure part can precisely detect a bonding failure part on a bonding interface of a compound semiconductor chip cut from a compound semiconductor wafer in which two transparent substrates composed of a compound semiconductor are directly bonded with each other.

In one embodiment, an X-ray inspection system may capture one or more X-ray images for samples of interest processed by a first tool. The X-ray inspection system may be inline with the first tool and have an inspection speed of 300 mm.sup.2 per minute or greater. The system may determine, in real-time, metrology information related to the samples of interest based on the X-ray images. The metrology information may indicate that a sample parameter associated with the samples of interest is outside of a pre-determined range. The system may provide instructions or data to one or more of the first tool or one or more second tools to adjust process parameters associated with the respective tools based on metrology information. The adjusted process parameters may reduce a processing error probability, of the respective tool for processing subsequent samples, related to the sample parameter being outside of the pre-determined range.

In various examples, a computer-implemented method of generating instructions for a welding robot. The computer-implemented method comprises identifying an expected position of a candidate seam on a part to be welded based on a Computer Aided Design (CAD) model of the part, scanning a workspace containing the part to produce a representation of the part, identifying the candidate seam on the part based on the representation of the part and the expected position of the candidate seam, determining an actual position of the candidate seam, and generating welding instructions for the welding robot based at least in part on the actual position of the candidate seam.

A welding work measurement system enables accurate measurement of a positional relation between respective parts. Therefore, a welding work measurement system includes a photodetection unit that detects light generated by a plurality of markers attached to a torch for welding a welding object or light reflected by the plurality of markers, a marker position acquisition unit that acquires marker position data that is three-dimensional coordinate data on the markers on the basis of the light detected by the photodetection unit, and a torch position acquisition unit that acquires torch position data that is three-dimensional coordinate data on the torch on the basis of the marker position data.

A method for welding a workpiece with a vision guided welding platform. The welding platform comprises a welding tool, and a camera for guiding the movement of the welding tool from a start point to an end point. The method includes the steps of adjusting a focal length of the camera such that a focal plane of the camera is located on a surface of the workpiece and obtaining a surface image of the workpiece. The method further includes the steps of determining a current focal length of the camera, determining a corrected pixel length of a pixel in the surface image and determining the number of pixels between the start point and the end point of each movement of the welding tool. Using the corrected pixel length, a distance between the start and end points is determined and the welding tool is guided to move therebetween.

A method for inspecting a joint of an assembly, in particular an assembly of a motor vehicle, consisting of two components joined together by a joining process, includes the method steps of: orienting an inspection device with respect to at least one region of the joint to be tested, imaging an actual image of the joint to be tested on a display device; and displaying joint information relating to the joint to be tested of the assembly via the display device.

A bonding apparatus and method for correcting movement amount of bonding head are provided. The bonding apparatus performs: mark correction of imaging a reference mark using a position detection camera at every prescribed timing and correcting the amount of movement of a bonding head on the basis of the amount of positional deviation between the position of the imaged reference mark and a reference position of the position detection camera; and actual position correction of detecting the actual bonding position of a semiconductor element after bonding using the position detection camera at every timing when the cumulative value of the amounts of correction of the mark correction from the previous actual position correction exceeds a prescribed first threshold and correcting the amount of movement of the bonding head on the basis of the amount of positional deviation between the detected actual bonding position and a target bonding position.