The wired circuit board includes a conductive layer having a terminal; a gold plated layer provided on the surface of the terminal; and a solder layer provided on the surface of the gold plated layer and provided so that the terminal and the electronic component can be electrically connected. The solder layer is made of a solder composition containing Sn, Bi, Cu and/or Ni, and the thickness T.sub.solder of the solder layer relative to the thickness T.sub.Au of the gold plated layer is 16 or more.

A hard disk drive suspension includes a suspension tail configured to electrically connect to a read-write transducer at a distal end and extending in a proximal direction toward a tapered tip at a proximal end, where the tapered tip comprises a decreasing taper that narrows in the proximal direction. Hence, structural overlap among adjacent suspension tails in misalignment scenarios and consequent marginalized electrical connections between the suspension tail and a corresponding flexible printed circuit are inhibited. The most proximal electrical pads of the suspension tail may be configured with a different aspect ratio, or in a fewer number of lines, from other adjacent electrical pads, thereby fitting within the narrowest portion of the tapered tip.

A trace gimbal is described herein. In some embodiments, the trace gimbal includes outer struts including a front outrigger at a distal end of the trace gimbal and a rear outrigger at a proximal end of the trace gimbal. The front outrigger includes a distal front outrigger and a proximal front outrigger, and the rear outrigger includes a distal rear outrigger and a proximal rear outrigger. The trace gimbal further includes a middle strut extending in a width direction of the trace gimbal and adjoining the proximal front outrigger to the rear outrigger, and an inner strut connecting the middle strut to a slider tongue. The inner strut and the middle strut adjoin the outer gimbal struts to the slider tongue.

Devices including a suspension pad shape and layout that avoids shorts caused by solder bridging during coupling of leads thereto. One embodiment includes a plurality of slider pads and a plurality of suspension pads being generally aligned with the slider pads. A conductive material electrically couples each of the suspension pads to the slider pad aligned therewith. At least one of the suspension pads is characterized as follows. The suspension pad has a proximal edge positioned closest to the associated slider pad, a distal edge positioned opposite the proximal edge, and side edges extending between the proximal and distal edges. At least a portion of the suspension pad tapers toward the proximal edge.

A suspension board with circuit includes a first terminal and a second terminal disposed at spaced intervals to each other, a piezoelectric element disposed between the first terminal and the second terminal so as to be electrically connected to the first terminal and the second terminal, a facing portion facing the piezoelectric element at the second terminal-side relative to the center between the first terminal and the second terminal, and a compensation portion compensating a degree of inclination of the piezoelectric element produced at the time of contact of the facing portion with the piezoelectric element at the first terminal-side relative to the center between the first terminal and the second terminal.

To control the resonance generated in the head assembly and improve property on the head location controlling. A head assembly includes: a slider having a head element; a slider supporting plate for holding the slider; a load beam for holding the slider supporting plate; a support projection which is arranged on the front end part of the load beam and on which the slider supporting plate is supported rotatably; a drive unit that rotates the slider supporting plate around the support projection; a dynamic vibration absorber arranged on the slider supporting plate, wherein the dynamic vibration absorber is disposed closer to the rear end side of the load beam than the support projection and has vibration freedom in the rotating direction of the slide supporting plate.

The present invention provides a method of surely detecting a crack in piezoelectric elements regardless of size of the crack. The method includes applying voltage to a first piezoelectric element of a pair of piezoelectric elements to cause deformation in the first piezoelectric element, forcibly deforming a second piezoelectric element of the pair of the piezoelectric elements to generate voltage from the second piezoelectric element according to the deformation of the first piezoelectric element, finding a transfer function of the pair of the piezoelectric elements based on values of the applied voltage and the generated voltage, and detecting presence or absence of a crack in the pair of the piezoelectric elements based on an objective value obtained from the found transfer function.

This thin film magnetic head includes: a magnetic pole including an end surface exposed on an air bearing surface; and a heating element including a first branch and a second branch and configured to heat a vicinity of the magnetic pole. The first branch and the second branch each expand along a stacking surface and are coupled in parallel to each other. The stacking surface intersects the air bearing surface.

Aspects of the present disclosure provide a heat assisted magnetic recording HAMR media structure and methods for reducing the Curie temperature distribution to improve the signal-to-noise characteristics of HAMR media. A magnetic recording medium includes a substrate, a heat sink layer on the substrate, and a magnetic recording layer on the heat sink layer. The magnetic recording layer includes a plurality of magnetic recording grains configured for recording and comprising a first magnetic alloy. The magnetic recording layer further includes a plurality of segregants disposed to isolate the plurality of magnetic recording grains and comprising a second magnetic alloy. A Curie temperature of the second magnetic alloy is higher than a Curie temperature of the first magnetic alloy.

A suspension for a disk device comprises a load beam, a flexure and a damper member. The flexure overlaps the load beam, and comprises a tongue on which a slider is mounted and an outrigger connected to the tongue. The damper member is attached to the load beam. The outrigger comprises an arm opposing the load beam, and a folded portion extending from the arm and folded back in a thickness direction of the arm. Further, the folded portion is attached to the damper member.