According to one embodiment, a suspension assembly includes a support plate, a wiring member on the support plate, and a magnetic head mounted on the wiring member. The magnetic head includes a head slider and connection pads provided at an outflow end of the head slider and electrically connected to the wiring lines. The wiring member includes a head installation region in which the magnetic head is mounted, and an etching region which is at least partly located in the head installation region and is opposed to an end portion close to the inflow end of the head slider with a gap.

A flexure of a suspension for a disk drive includes a metal base and a wiring portion provided along the metal base and including a base insulation layer, a conductor layer overlaid on the base insulation layer, and a cover insulation layer overlaid on the conductor layer. The flexure includes a first area on which an electronic component is mounted and a second area aligned alongside the first area, and the first area includes a thin-walled portion which overlaps the electronic component and having a thickness less than a thickness of the second area.

According to one embodiment, a suspension assembly includes a support plate, a head supported by the support plate, and a wiring member on the support plate. The wiring member includes a distal-end portion electrically connected to the head, a connection end portion extending outside the support plate. The connection end portion includes a cover layer with an opening having a length, thirteen or more connection terminals opposed to the opening, arranged at intervals in a length direction of the opening and connected to wires, respectively, and a base layer superposed on the cover layer and the connection terminals and having first openings opposed to part of each of the connection terminals and second openings opposed to a space between adjacent connection terminals.

A method of manufacturing a piezoelectric microactuator having a wrap-around electrode includes forming a piezoelectric element having a large central electrode on a top face, and having a wrap-around electrode that includes the bottom face, two opposing ends of the device, and two opposing end portions of the top face. The device is then cut through the middle, separating the device into two separate piezoelectric microactuators each having a wrap-around electrode.

According to one embodiment, a disk device includes a magnetic disk, a magnetic head, a flexure, a piezoelectric element, a first bonding material, a second bonding material, and a protrusion. The flexure includes a first outer surface, a first pad, and a second pad. The first pad and the second pad are on the first outer surface. The piezoelectric element includes a second outer surface, a first electrode, and a second outer surface. The first electrode and the second electrode are on the second outer surface. The first bonding material, which is conductive, bonds the first pad and the first electrode. The second bonding material, which is conductive, bonds the second pad and the second electrode. The protrusion is provided on the flexure, is located at least partially between the first bonding material and the second bonding material, and protrudes from the first outer surface.

A method of manufacturing a piezoelectric microactuator having a wrap-around electrode includes forming a piezoelectric element having a large central electrode on a top face, and having a wrap-around electrode that includes the bottom face, two opposing ends of the device, and two opposing end portions of the top face. The device is then cut through the middle, separating the device into two separate piezoelectric microactuators each having a wrap-around electrode.

According to one embodiment, a suspension assembly includes a support plate including a distal end and a proximal end portion, a wiring member including a gimbal portion and provided on the support plate, and a magnetic head mounted on the gimbal portion. The gimbal portion includes a first end portion located on a side of the proximal end portion with respect to the magnetic head and welded to the support plate, a second end located on a side of the distal end portion with respect to the magnetic head and welded to the support plate, a tongue portion on which the magnetic head is mounted, located between the first end portion and the second end portion, and supported so as to be displaceable relative to the support plate, and a limiter opposing the tongue portion with a gap.

A hard disk drive flexure assembly includes a base layer, a conductive layer, a plurality of electrical pads over the conductive layer, and a sidewall layer including sidewalls on each side of and extending higher than a corresponding electrical pad. Pre-solder bumps are formed between the sidewalls and over each pad. Use of sidewalls prevents the pre-solder bumps from undesirably bridging to an adjacent electrical pad and forming a short circuit, which might otherwise cause head-gimbal assembly (HGA) manufacturing failures and consequent increased cost. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.

A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.

A hard disk drive head slider housing a read-write transducer includes a plurality of electrical connection pads, where each electrical pad includes an interconnection portion configured for electrically connecting to an interconnected component, such as a lead suspension, a probe contact portion configured for electrical testing the head slider, and at least one slit positioned between the interconnection portion and the probe contact portion, thereby physically distinguishing and separating the two portions of a multiple-portion pad to inhibit undesirable solder flow to the wider probe contact portion on the slider side of each pad. A more controlled solder joint is provided, while the probe contact portion can remain relatively wide for probe contact and the interconnection portion can remain relatively narrow to reduce solder bridges among the pads.