Various embodiments concern a dual stage actuation flexure. The dual stage actuation flexure comprises a flexure having a gimbal. The gimbal comprising a pair of spring arms, a tongue between the spring arms, and a pair of linkages respectively connecting the pair of spring arms to the tongue. The dual stage actuation flexure further comprises a pair of motors mounted on the gimbal and a pair of stiffeners respectively mounted on the motors. The dual stage actuation flexure further comprises a slider mounting. Electrical activation of the motors bends the pair of linkages to move the slider mounting about a tracking axis while the stiffeners limit the degree of bending of the motors during the electrical activation.

A PZT microactuator such as for a hard disk drive has a restraining layer bonded on its side that is opposite the side on which the PZT is mounted. The restraining layer comprises a stiff and resilient material such as stainless steel. The restraining layer can cover most or all of the top of the PZT, with an electrical connection being made to the PZT where it is not covered by the restraining layer. The restraining layer reduces bending of the PZT as mounted and hence increases effective stroke length, or reverses the sign of the bending which increases the effective stroke length of the PZT even further. The restraining layer can be one or more active layers of PZT material that act in the opposite direction as the main PZT layer. The restraining layer(s) may be thinner than the main PZT layer.

A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The lower piezoelectric-material protective-film and the upper piezoelectric-material protective-film are formed respectively in the lower side of the lower electrode film and the upper side of the upper electrode film, of the laminated structure part, so as to sandwich the laminated structure part.

A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The lower piezoelectric-material protective-film and the upper piezoelectric-material protective-film are formed respectively in the lower side of the lower electrode film and the upper side of the upper electrode film, of the laminated structure part, so as to sandwich the laminated structure part.

A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface.

A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface. The lower piezoelectric-material protective-film, and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo, by Ion beam deposition.

A method of manufacturing a piezoelectric microactuator having a wrap-around electrode includes forming a piezoelectric element having a large central electrode on a top face, and having a wrap-around electrode that includes the bottom face, two opposing ends of the device, and two opposing end portions of the top face. The device is then cut through the middle, separating the device into two separate piezoelectric microactuators each having a wrap-around electrode.

A flexure includes a metal base, a circuit member, and an actuator. The circuit member includes a base insulating layer, a conductor layer, and a cover insulating layer. The conductor layer includes a second pad, and a reference hole, which is an example of a portion to be protected, in a tongue portion. A second end portion of the actuator is fixed to the second pad via an adhesive. The circuit member includes a wall portion. The wall portion is formed between the second pad and the reference hole. A height of the wall portion is greater than a height of the second pad.

A gimbal having a base portion and a tongue joined together by a neck portion. The base portion includes a first proximal edge facing away from the tongue. A circuit is mounted on the gimbal and includes a portion mounted to the base portion having a circuit extension region that extends beyond the first proximal edge. The circuit extension region includes a second proximal edge facing away from the tongue. A slider may be mounted on the tongue and electrically connected to the circuit. First and second PZT actuators are mounted to the head gimbal assembly and electrically connected to the circuit. The circuit extension region has a circuit extension region width W of at least 0.1 mm as measured in a direction extending away from the tongue relative to a furthest extending portion of the first proximal edge and a furthest extending portion of the second proximal edge.

According to one embodiment, a disk device includes two magnetic disks opposing each other at intervals of 1.2 to 1.5 mm, and at least two suspension assemblies movable respectively between the two magnetic disks. Each of the suspension assemblies includes a base plate, a load beam extending from the base plate, a tab extending from a distal end of the load beam, a wiring member on the load beam and the base plate, including a gimbal portion, and a magnetic head on the gimbal portion, abutting on a dimple of the load beam via the gimbal portion. The ratio of a distance from a bendable location of the load beam to a center of the dimple with respect to a distance from the center of the dimple to a tip of the tab is 2.8 to 3.8.