A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of at least one material that is a thermally conductive plastic that combines to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.

A data storage array has a backplane at the base of an enclosure. A plurality of data storage drives are coupled to connectors of the backplane. A hot-swappable protocol expander module is coupled between the drives and the backplane through a top of the enclosure or to the backplane through a side of the enclosure.

Various aspects of the present disclosure are directed toward a disc drive actuator assembly including an e-block, a plurality of bearings, and one or more heat transfer components. The heat transfer component(s) operates to conductively draw heat from the plurality of bearings through the e-block, and convectively dissipate the heat into an atmosphere in contact therewith. The heat transfer component(s) mitigates temperature rise of the bearings during operation of a disc drive, thereby mitigating bearing lubricant outgassing from within the bearings.

A drive array is provided, including: a structure having a top panel, a base; and first and second side panels; the first and second side panels positioned on opposite sides of the array and defining a length of the array; and a plurality of fins arranged transversely to the length of the array, the fins further arranged in a plurality of rows, each of the rows transverse to the array; a plurality of projections extending upwardly from the base aligned with a plurality of projections extending downwardly from the top penal, positioned to fit and hold a hard drive; and a circuit board secured to the back of the structure to communicate with the hard drives positioned on the array.

A heat dissipation structure for an external apparatus is a heat dissipation structure for an external apparatus in an electronic apparatus including a housing section configured to removably house an external apparatus. The heat dissipation structure for an external apparatus includes a heat dissipation portion, which is removably attached to the external apparatus and which has thermal conductivity for transferring heat generated by the external apparatus to the housing section.

An apparatus includes a component bay having an operational height and an expanded height. The component bay is moveable between the operational height and the expanded height. A thermal element divides the component bay into one or more compartments, each compartment configured to receive a system component. The component bay at the operational height provides thermal contact between the received system component and the thermal element.

An information handling system includes a hard disk drive, a handle in physical communication with the hard disk drive, and a first flexible heat sink component. The first flexible heat sink component includes a first surface contact portion, a first main portion, and a first plurality of fins. The first surface contact portion is in physical communication with the hard disk drive. The first main portion is in physical communication with the handle. The first fins extend away from the first main portion. The first fins flex downward toward the hard disk drive when the first fins are placed in physical communication with a cover of a storage sled, and the first fins fit within a space between the cover and the hard disk.

A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of at least one material that is a thermally conductive plastic that combines to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.

Various aspects of the present disclosure are directed toward a disc drive actuator assembly including an e-block, a plurality of bearings, and one or more heat transfer components. The heat transfer component(s) operates to conductively draw heat from the plurality of bearings through the e-block, and convectively dissipate the heat into an atmosphere in contact therewith. The heat transfer component(s) mitigates temperature rise of the bearings during operation of a disc drive, thereby mitigating bearing lubricant outgassing from within the bearings.

Embodiments of apparatuses, systems and methods related to Solid State Drive (SSD) cooling in dense storage are described. An embodiment of an apparatus may include a housing. The apparatus may also include a first set of peripheral heatsink fins disposed parallel to a first axis of the housing. Additionally, the apparatus may include a second set of peripheral heatsink fins disposed parallel to a second axis of the housing. Also, the apparatus may include a set of heatsink members disposed adjacent the first set of peripheral heatsink fins and the second set of peripheral heatsink fins, the set of heat sink members configured to align with at least one of the first set of peripheral heatsink fins and the second set of peripheral heatsink fins.