The present disclosure relates to electronic devices that include a composition that generates a gaseous oxidizing agent component within the interior gas space of the electronic device. The present disclosure also relates to electronic devices that include a container that includes a gaseous oxidizing agent component in a manner that the gaseous oxidizing component can transfer from the container to the interior gas space of the electronic device. The present disclosure also involves related methods.

The present disclosure relates to electronic devices that include a composition that actively generates a gaseous oxidizing agent component within the interior gas space of the electronic device. The present disclosure also relates to electronic devices that include a container that includes a gaseous oxidizing agent component in a manner that the gaseous oxidizing component can transfer from the container to the interior gas space of the electronic device. The present disclosure also involves related methods.

A base unit includes a support to support a motor, a bottom plate, and a wall. The bottom plate extends radially outward from the support. The wall extends upward from an outer periphery of the bottom plate, and includes a rectangular opening in planar view. Surfaces of the bottom plate and the wall include a cover surface covered with an electrodeposition coating film and an exposed surface in which a material of the base unit is exposed from the electrodeposition coating film. At least an upper end surface of the wall and a partial region of an inside wall surface of the wall continuous with the upper end surface are each the exposed surface.

According to one embodiment, a disk device includes a housing including a base including a sidewall, and a first cover on a surface of the sidewall, and a discoidal recording medium in the housing. The first cover includes a first surface, a second surface on an opposite side to the first surface, and a side portion. The second surface includes a packing on a peripheral portion thereof. The side portion includes a burr on the second surface side and the packing is aligned to the burr.

An electrical feed-through, such as a PCB connector, involves at least one positioning protrusion protruding from a main body, and may further include multiple positioning protrusions protruding in respective directions from the main body. A data storage device employing such a feed-through includes an enclosure base with which the feed-through is coupled. The base includes an annular recessed surface surrounding an aperture that is encompassed by the feed-through and is at a first level, and at least one recessed positioning surface at a higher level than the first level, and extending in a direction away from the annular recessed surface. The positioning protrusion of the electrical feed-through contacts the recessed positioning surface of the base, such that the position of the feed-through is constrained by the recessed positioning surface.

The present disclosure relates to using solid state deposition to selectively and strategically manage one or more properties of one or more portions of a data storage device. Material deposited via solid-state deposition can be used to prepare a surface for subsequent treatment (e.g., welding), to join two or more substrates together, and/or to seal one or more joints or surfaces to control, e.g., the humidity in the interior of a data storage device. The present disclosure also involves related data storage devices.

A hard disc drive includes a base deck, a cover welded to the base deck, and a voice coil motor. The voice coil motor includes a first voice coil motor assembly and a second voice coil motor assembly. Either one or both of the first and second voice coil motor assemblies can be welded to the base deck.

Approaches to patching a leaky hermetically-sealed device include the use of a laminate rework patch that includes an adhesive tape layer, an aluminum sheet layer, and an outer cover layer, and whereby a viscous adhesive is injected or otherwise applied between the patch and the device leak location, over a layer of primer material, to fill the leak and stop the leakage of gas from inside the device. The thickness of the viscous adhesive, and thus the curing time and temperature of the viscous adhesive, can be managed by way of the thickness of the adhesive tape layer.

The present disclosure relates to using solid state deposition to selectively and strategically manage one or more properties of one or more portions of a data storage device. Material deposited via solid-state deposition can be used to prepare a surface for subsequent treatment (e.g., welding), to join two or more substrates together, and/or to seal one or more joints or surfaces to control, e.g., the humidity in the interior of a data storage device. The present disclosure also involves related data storage devices.

A spindle motor includes a base plate in which a through hole is formed, a stator core that is provided inside the base plate and is wound with a coil, and a circuit board that is provided outside the base plate and to which a conducting wire of the coil drawn out to outside through the through hole is connected, wherein the through hole includes an inner opening that opens inward of the base plate, an outer opening that opens outward of the base plate, and an intermediate portion having a cylindrical shape that is provided between the inner opening and the outer opening, an enlarged opening is formed to be connected to the outer opening, the enlarged opening is offset to extend toward a side where the circuit board is not present, and the through hole is sealed with a sealing material.