A memory device according to the present invention comprises: a memory cell array in which memory cells are connected to wordlines and bitlines in a matrix form; and a control circuit for programming the memory cells or controlling a read operation, according to a start address, a burst length, a latency length, and a program or read command which are transmitted from a host, wherein the control circuit may comprise: a pulse generation unit for generating register pulses and counter pulses in synchronization with an operation clock; and a counter that sets the start address in synchronization with the register pulses, counts the number of counter pulses corresponding to the sum of the latency length and the burst length, and increases an address from the start address to the sum of the start address and the burst length.

A memory device according to the present invention comprises: a memory cell array in which memory cells are connected to wordlines and bitlines in a matrix form; and a control circuit for programming the memory cells or controlling a read operation, according to a start address, a burst length, a latency length, and a program or read command which are transmitted from a host, wherein the control circuit may comprise: a pulse generation unit for generating register pulses and counter pulses in synchronization with an operation clock; and a counter that sets the start address in synchronization with the register pulses, counts the number of counter pulses corresponding to the sum of the latency length and the burst length, and increases an address from the start address to the sum of the start address and the burst length.

Various implementations described herein are directed to device having a memory array that operates with an applied core voltage. The device includes a power gating switch that receives a core supply voltage and provides the applied core voltage to the memory array. The device includes a biasing stage that selectively activates the power gating switch based on sensing a changing voltage level of the applied core voltage.

Various implementations described herein are directed to device having a memory array that operates with an applied core voltage. The device includes a power gating switch that receives a core supply voltage and provides the applied core voltage to the memory array. The device includes a biasing stage that selectively activates the power gating switch based on sensing a changing voltage level of the applied core voltage.

A non-volatile memory device includes a plurality of memory cells arranged in a matrix, a plurality of word lines extended in a row direction, and a plurality of bit lines extended in a column direction. Each of the memory cells is coupled to one of the word lines and one of the bit lines. The memory device further includes a word-line control circuit coupled to and configured to control the word lines, a first bit-line control circuit configured to control the bit lines and sense the memory cells in a digital mode, and a second bit-line control circuit configured to bias the bit lines and sense the memory cells in an analog mode. The first bit-line control circuit is coupled to a first end of each of the bit lines. The second bit-line control circuit is coupled to a second end of each of the bit lines.

A non-volatile memory device includes a plurality of memory cells arranged in a matrix, a plurality of word lines extended in a row direction, and a plurality of bit lines extended in a column direction. Each of the memory cells is coupled to one of the word lines and one of the bit lines. The memory device further includes a word-line control circuit coupled to and configured to control the word lines, a first bit-line control circuit configured to control the bit lines and sense the memory cells in a digital mode, and a second bit-line control circuit configured to bias the bit lines and sense the memory cells in an analog mode. The first bit-line control circuit is coupled to a first end of each of the bit lines. The second bit-line control circuit is coupled to a second end of each of the bit lines.

Various implementations described herein are directed to device having a memory array that operates with an applied core voltage. The device includes a power gating switch that receives a core supply voltage and provides the applied core voltage to the memory array. The device includes a biasing stage that selectively activates the power gating switch based on sensing a changing voltage level of the applied core voltage.

Various implementations described herein are directed to device having a memory array that operates with an applied core voltage. The device includes a power gating switch that receives a core supply voltage and provides the applied core voltage to the memory array. The device includes a biasing stage that selectively activates the power gating switch based on sensing a changing voltage level of the applied core voltage.

A semiconductor package includes first through third memory chips. The first memory chip is arranged on a package substrate, the second memory chip is arranged on the first memory chip, and the third memory chip is arranged between the first memory chip and the second memory chip. Each of the first through third memory chips includes a memory cell array storing data, stress detectors, a stress index generator, and a control circuit. The stress detectors are formed and distributed in a substrate, and detect stacking stress in response to an external voltage to output a plurality of sensing currents. The stress index generator converts the plurality of sensing currents into stress index codes. The control circuit adjusts a value of a feature parameter associated with an operating voltage of a corresponding memory chip, based on at least a portion of the stress index codes.

A method for determining a memory window of at least one resistive random access memory cell, the resistive random access memory cell including a high resistance state and a low resistance state, the passage of the resistive random access memory from an initial state among the high resistance state or the low resistance state to another state then the return to the initial state forming a cycle, the method including: measuring the values of the resistances of the high resistance and low resistance states at a given cycle j, j being an integer; determining the memory window to use during the n cycles following the given cycle j, n being an integer, the memory window being calculated by taking into account at least the resistances of the high resistance and low resistance states at the cycle j.