A voltage differential sense amplifier circuit for a semiconductor memory circuit is disclosed. The voltage differential sense amplifier circuit includes a first and second pluralities of transistors. A first bias control circuit is included to bias the first plurality of transistors. The first bias control circuit is connected to body terminals of the first plurality of transistors for providing a temperature dependent first bias voltage to control threshold voltages of the first plurality of transistors. The temperature defendant first bias voltage is generated based on junction leakages at the body terminals of the first plurality of transistors. A second bias control circuit is included to bias the second plurality of transistors. The second bias control circuit is connected to body terminals of the second plurality of transistors for providing a temperature dependent second bias voltage to control threshold voltages of the second plurality of transistors. The temperature dependent second bias voltage is generated based on junction leakages at the body terminals of the second plurality of transistors.

A pseudo-cryogenic semiconductor device includes memory cells having a plurality of transistors; and a bulk bias voltage supply circuit configured to provide a bulk bias voltage to be applied to a bulk region of the memory cells. The bulk bias voltage supply circuit includes a first temperature sensing circuit configured to generate a first voltage adjustment signal by sensing a temperature in a range from about 70° K to about 173° K; and a bulk bias voltage selector configured to receive the first voltage adjustment signal, select one of a first bulk bias voltage and a second bulk bias voltage different from the first bulk bias voltage, and output the selected voltage as the bulk bias voltage.

This disclosure relates to apparatuses and a method for retaining a bias in a NAND string channel during source-side precharge. The apparatuses include a memory array and a die controller configured to mitigate formation of a potential gradient in the channel of the memory array NAND strings during a program storage operation. To this end, a plurality of source-side select gates is activated, then each of the plurality of source side dummy word line select gates is activated. Next, a NAND string channel is biased by biasing the source line coupled to the NAND string by the plurality of source-side select gates. Finally, the plurality of source-side select gates and the plurality of source side dummy word line select gates are discharged such that the channel maintains an electrical path to the source line.

A microelectronic circuit structure comprises a stack of bonded layers comprising a bottom layer and at least one upper layer. At least one of the upper layers comprises an oxide layer having a back surface and a front surface closer to the bottom layer than the back surface, and a plurality of FD-SOI transistors built on the front surface. At least a first back gate line and a second back gate line extend separate from each other above the back surface for independently providing a first back gate bias to a first group of transistors and a second back gate bias to a second different group of transistors.

This disclosure relates to apparatuses and a method for retaining a bias in a NAND string channel during source-side precharge. The apparatuses include a memory array and a die controller configured to mitigate formation of a potential gradient in the channel of the memory array NAND strings during a program storage operation. To this end, a plurality of source-side select gates is activated, then each of the plurality of source side dummy word line select gates is activated. Next, a NAND string channel is biased by biasing the source line coupled to the NAND string by the plurality of source-side select gates. Finally, the plurality of source-side select gates and the plurality of source side dummy word line select gates are discharged such that the channel maintains an electrical path to the source line.

A memory device includes a charge pump connected to a power supply voltage and including a plurality of stages to output an output voltage, a stage counter configured to output a count value that incrementally increases to a number of the stages, and a regulator configured to compare the output voltage with a reference output voltage of the charge pump that is generated using the incrementally increasing count value obtained by the stage counter, and to output a pump operation signal at a time when the reference output voltage becomes greater than or equal to the output voltage, wherein the charge pump operates in response to the pump operation signal.

A voltage differential sense amplifier circuit for a semiconductor memory circuit is disclosed. The voltage differential sense amplifier circuit includes a first and second pluralities of transistors. A first bias control circuit is included to bias the first plurality of transistors. The first bias control circuit is connected to body terminals of the first plurality of transistors for providing a temperature dependent first bias voltage to control threshold voltages of the first plurality of transistors. The temperature defendant first bias voltage is generated based on junction leakages at the body terminals of the first plurality of transistors. A second bias control circuit is included to bias the second plurality of transistors. The second bias control circuit is connected to body terminals of the second plurality of transistors for providing a temperature dependent second bias voltage to control threshold voltages of the second plurality of transistors. The temperature dependent second bias voltage is generated based on junction leakages at the body terminals of the second plurality of transistors.

A memory device includes a charge pump connected to a power supply voltage and including a plurality of stages to output an output voltage, a stage counter configured to output a count value that incrementally increases to a number of the stages, and a regulator configured to compare the output voltage with a reference output voltage of the charge pump that is generated using the incrementally increasing count value obtained by the stage counter, and to output a pump operation signal at a time when the reference output voltage becomes greater than or equal to the output voltage, wherein the charge pump operates in response to the pump operation signal.

Along with the miniaturization of the semiconductor memory device, the resistor and parasitic capacitance of the wires become large, which prevents the semiconductor memory device from being speeded up. In a semiconductor memory device having a semiconductor substrate having a main surface, a first memory cell row having a plurality of first memory cells arranged in parallel to a first direction in plan view on the main surface, a first word line connected to the plurality of first memory cells, a first word line driver for changing a potential of the first word line, and a control circuit for outputting a first predecode signal to the first word line driver via the first predecode line in response to a clock signal and an address signal, a repeater is inserted between the control circuit and the first word line driver.

A method and a circuit for adaptive regulation of body bias voltages controlling nmos and pmos transistors of an integrated circuit includes a digital circuit, a counter, a control unit and a charge pump. A first ring oscillator monitor measures a period duration of nmos transistors and a second ring oscillator monitor measures a period duration of pmos transistors. A first closed control loop adaptively regulates the performance c.sub.n of the body bias controlled nmos transistors of the digital circuit by comparing the measured period duration of nmos dominated first ring oscillator monitor to a period duration of a reference clock and a second closed control loop adaptively regulating the performance c.sub.p of the body bias controlled pmos transistors of the digital circuit by comparing the measured period duration of pmos dominated second ring oscillator monitor to the period duration of the reference clock.