G11C7/1057

SELECTIVE BIT LINE CLAMPING CONTROL FOR AN IN-MEMORY COMPUTE OPERATION WHERE SIMULTANEOUS ACCESS IS MADE TO PLURAL ROWS OF A STATIC RANDOM ACCESS MEMORY (SRAM)

A circuit includes a memory array with SRAM cells connected in rows by word lines and in columns by bit lines. A row controller circuit simultaneously actuates, through a word line driver circuit for each row, word lines in parallel for an in-memory compute operation. A column processing circuit processes analog voltages developed on the bit lines in response to the simultaneous actuation to generate a decision output for the in-memory compute operation. A bit line clamping circuit includes a sensing circuit that compares the analog voltages on a given pair of bit lines to a threshold voltage. A voltage clamp circuit is actuated in response to the comparison to preclude the analog voltages on the given pair of bit lines from decreasing below a clamping voltage level.

Operating method of host device and memory device and memory system

Provided are an operating method of a host device, an operating method of a memory device, and a memory system. The operating method of a host device includes transmitting a request command for performing an eye-opening monitor (EOM) operation to a memory device, transmitting a parameter for performing the EOM operation to the memory device, transmitting pattern data for performing the EOM operation to the memory device, and receiving a first response signal including a result of the EOM operation performed based on the parameter and the pattern data from the memory device.

Data output buffer and semiconductor apparatus including the same
11699467 · 2023-07-11 · ·

A data output buffer includes a first driver configured to drive a data input/output (I/O) pad according to an input signal and allow data drivability to be controlled according to an impedance calibration code and a second driver configured to perform a de-emphasis operation on the data I/O pad and allow de-emphasis drivability to be controlled according to the impedance calibration code.

Semiconductor memory device and memory system including the same

A semiconductor memory device includes a quadrature error correction circuit, a clock generation circuit and a data input/output (I/O) buffer. The quadrature error correction circuit performs a locking operation to generate a first corrected clock signal and a second corrected clock signal by adjusting a skew and a duty error of a first through fourth clock signals generated based on a data clock signal and performs a relocking operation to lock the second corrected clock signal to the first corrected clock signal in response to a relock signal. The clock generation circuit generates an output clock signal and a strobe signal based on the first corrected clock signal and the second corrected clock signal. The data I/O buffer generates a data signal by sampling data from a memory cell array based on the output clock signal and transmits the data signal and the strobe signal to a memory controller.

Apparatuses and methods for multi-level signaling with command over data functionality
11699477 · 2023-07-11 · ·

A semiconductor device may implement a command-over-data function on a multi-level signaling data bus architectures. The multi-level signaling data bus architecture may support a multi-level communication architecture that includes a plurality of channels each including conversion of M bitstreams to N multi-level signals, where M is greater than N. A bitstream includes a plurality of bits provided serially, with each bit of the bitstream provided over a period of time. The multi-level signaling data bus is adapted to transmit data using a first set of assigned states of the data bus, and to transmit commands using at least a second assigned state of the data bus.

High performance, non-volatile memory module

Memory controllers, devices, modules, systems and associated methods are disclosed. In one embodiment, a memory module includes a pin interface for coupling to a memory controller via a bus. The module includes at least two non-volatile memory devices, and a buffer disposed between the pin interface and the at least two non-volatile memory devices. The buffer receives non-volatile memory access commands from the memory controller that are interleaved with DRAM memory module access commands.

SEMICONDUCTOR MEMORY DEVICE AND MEMORY SYSTEM

According to an embodiment, a semiconductor memory device includes a first pin, a first receiving circuit, and a first terminating circuit. The first pin receives a first signal and a second signal having a smaller amplitude than the first signal. The first receiving circuit is connected to the first pin and outputs, based on a comparison between the first signal and a first voltage, a third signal. The first receiving circuit also outputs, based on a comparison between the second signal and a second voltage, a fourth signal having a smaller amplitude than the third signal. The first terminating circuit is connected to the first pin. The first terminating circuit is disabled if the first pin receives the first signal, and enabled if the first pin receives the second signal.

METHOD FOR ERROR CORRECTION CODING WITH MULTIPLE HASH GROUPINGS AND DEVICE FOR PERFORMING THE SAME
20230214296 · 2023-07-06 ·

Various aspects include methods and devices for implementing the methods for error checking a memory system. Aspects may include receiving, from a row buffer of a memory, access data corresponding to a column address of a memory access, in which the row buffer has data of an activation unit of the memory corresponding to a row address of the memory access, determining multiple error correction codes (ECCs) for the access data using the column address, and checking the access data for an error utilizing at least one of the multiple ECCs. In some aspects, the multiple ECCs may include a first ECC having data from an access unit of the memory corresponding with the column address, and at least one second ECC having data from the access unit and data from the activation unit other than from the access unit.

High speed signal adjustment circuit
11552626 · 2023-01-10 · ·

Disclosed herein is an apparatus that includes a data serializer including a plurality of first buffer circuits configured to receive a plurality of data, respectively, and a second buffer circuit configured to serialize the plurality of data provided from the plurality of first buffer circuits. At least one of the plurality of first buffer circuits and the second buffer circuit includes: a first circuit configured to drive a first signal node to one of first and second logic levels based on an input signal, the first circuit including a first adjustment circuit configured to adjust a driving capability of the first circuit when the first circuit drives the first signal node to the first logic level; and a second circuit configured to drive the first signal node to other of the first and second logic levels.

Elastic buffer in a memory sub-system for debugging information

A processing device in a memory system determines to send system state information associated with the memory device to a host system and identifies a subset of a plurality of event entries from a staging buffer based on one or more filtering factors, the plurality of event entries corresponding to events associated with the memory device. The processing device further sends the subset of the plurality of event entries as the system state information to the host system over a communication pipe having limited bandwidth.