A semiconductor memory device includes a plurality of data latch circuits that are used for input and output of data between a sense amplifier circuit and an input/output circuit, and a data bus that is connected to the plurality of data latch circuits. Each of the data latch circuits includes an inverter circuit that temporarily stores data input and output between the sense amplifier circuit and the input/output circuit, and at least three MOS transistors between the inverter circuit and the data bus. The at least three MOS transistors may be multiple N-channel type MOS transistors and at least one P-channel type MOS transistor connected in parallel between the inverter circuit and the data bus, or at least one N-channel type MOS transistor and multiple P-channel type MOS transistors connected in parallel between the inverter circuit and the data bus.

Various implementations described herein are directed to a method. The method may receive an address to access data stored in memory. The method may enable a data access pipeline to perform memory access operations so as to access the data stored in the memory based on the address. The method may dynamically adjust the data access pipeline during the memory access operations so as to output the data based on the address.

A semiconductor memory device includes a memory core that performs reading and writing of data, data delivery and training blocks that are connected between first pads and the memory core, and at least one data delivery, clock generation and training block that is connected between at least one second pad and the memory core. In a first training operation, the data delivery and training blocks output first training data, received through the first pads, through the first pads as second training data. In a second training operation, at least one of the data delivery and training blocks outputs third training data, received through the at least one second pad, through at least one of the first pads as fourth training data. The second training data and the fourth training data are output in synchronization with read data strobe signals output through the at least one second pad.

A low power sequential circuit (e.g., latch) uses a non-linear polar capacitor to retain charge with fewer transistors than traditional CMOS sequential circuits. In one example, a sequential circuit includes pass-gates and inverters, but without a feedback mechanism or memory element. In another example, a sequential uses load capacitors (e.g., capacitors coupled to a storage node and a reference supply). The load capacitors are implemented using ferroelectric material, paraelectric material, or linear dielectric. In one example, a sequential uses minority, majority, or threshold gates with ferroelectric or paraelectric capacitors. In one example, a sequential circuit uses minority, majority, or threshold gates configured as NAND gates.

A write masked latch bit cell of an SRAM includes a write mask circuit that is responsive to assertion of a first write mask signal to cause a value of a write data node to be a first value and is responsive to assertion of a second write mask signal to cause the value of the write data node to have a second value. A pass gate supplies the data on the write data node to an internal node of the bit cell responsive to write word line signals being asserted. A keeper circuit maintains the value of the first node independently of values of the write word line signals while the first write mask signal and the second write mask signal are deasserted.

For a non-volatile memory that uses hard bit and soft bit data in error correction operations, to reduce the amount of soft bit data that needs to be transferred from a memory to the controller and improve memory system performance, the soft bit data can be compressed before transfer. After the soft bit data is read and stored into the internal data latches associated with the sense amplifiers, it is compressed within these internal data latches. The compressed soft bit data can then be transferred to the transfer data latches of a cache buffer, where the compressed soft bit data can be consolidated and transferred out over an input-output interface. Within the input-output interface, the compressed data can be reshuffled to put into logical user data order if needed.

A semiconductor device includes: a memory cell array including a plurality of memory cells; a data input/output circuit suitable for outputting data provided from the memory cell array in response to a couple of data output control signals; and a data output control circuit suitable for generating a couple of latch read enable signals and a couple of data output control timing signals based on a couple of complementary read enable signals, an internal enable signal and warming-up cycle information indicating different warming-up cycles, and outputting, according to the couple of data output control timing signals, the couple of data output control signals using the couple of latch read enable signals, one or more pulses of each of which are masked according to the warming-up cycle information.

A memory device includes a memory cell array, a page buffer circuit, and a counting circuit. The page buffer circuit includes a first and second page buffer columns connected to the memory cell array. The first page buffer column includes a first page buffer unit and the second page buffer column includes a second page buffer unit in a first stage. The first page buffer unit performs a first sensing operation in response to a first sensing signal, and the second page buffer unit performs a second sensing operation in response to a second sensing signal. The counting circuit counts a first number of memory cells included in a first threshold voltage region from a result of the first sensing operation, and counts a second number of memory cells included in a second threshold voltage region from a result of the second sensing operation.

System on chips, memory circuits, and method for data access, the memory circuits including a memory cell array and an input/output (I/O) connection interface coupled to the memory cell array, wherein the I/O connection interface is configured for coupling to an external signal line to directly receive a transistor-level operation signal from an external memory controller for accessing data in the memory cell array.

A memory module includes a substrate, plural memory devices, and a buffer. The plural memory devices are organized into at least one rank, each memory device having plural banks. The buffer includes a primary interface for communicating with a memory controller and a secondary interface coupled to the plural memory devices. For each bank of each rank of memory devices, the buffer includes data buffer circuitry and address buffer circuitry. The data buffer circuitry includes first storage to store write data transferred during a bank cycle interval (tRR). The address buffer circuitry includes second storage to store address information corresponding to the data stored in the first storage.