According to one embodiment, a memory system includes: a first package including a first memory chip configured to store data, and a first chip containing a first circuit configured to control an On Die Termination (ODT) operation based on a first signal which is a control signal for reading of data stored in the first memory chip; a second package including a second memory chip configured to store data, and a second chip containing a second circuit configured to control the ODT operation based on the first signal, the first signal also being a control signal for reading of data stored in the second memory chip; and a controller configured to transmit the first signal to the first chip and the second chip.

In a modular memory system, a memory control component, first and second memory sockets and data buffer components are all mounted to the printed circuit board. The first and second memory sockets have electrical contacts to electrically engage counterpart electrical contacts of memory modules to be inserted therein, and each of the data buffer components includes a primary data interface electrically coupled to the memory control component, and first and second secondary data interfaces electrically coupled to subsets of the electrical contacts within the first and second memory sockets, respectively.

A semiconductor memory device includes a quadrature error correction circuit, a clock generation circuit and a data input/output (I/O) buffer. The quadrature error correction circuit performs a locking operation to generate a first corrected clock signal and a second corrected clock signal by adjusting a skew and a duty error of a first through fourth clock signals generated based on a data clock signal and performs a relocking operation to lock the second corrected clock signal to the first corrected clock signal in response to a relock signal. The clock generation circuit generates an output clock signal and a strobe signal based on the first corrected clock signal and the second corrected clock signal. The data I/O buffer generates a data signal by sampling data from a memory cell array based on the output clock signal and transmits the data signal and the strobe signal to a memory controller.

A device may include a ZQ calibration circuit. The ZQ calibration circuit may include a first register configured to store a first impedance code generated responsive to a ZQ calibration command. The ZQ calibration circuit may also include a second register configured to store a shift value. Further, the ZQ calibration code may include a compute block configured to generate a second impedance code based on the first impedance code and the shift value. Systems and related methods of operation are also described.

Apparatuses and methods for calibrating adjustable impedances of a semiconductor device are disclosed in the present application. An example apparatus includes a register configured to store impedance calibration information and further includes programmable termination resistances having a programmable impedance. The example apparatus further includes an impedance calibration circuit configured to perform a calibration operation to determine calibration parameters for setting the programmable impedance of the programmable termination resistances. The impedance calibration circuit is further configured to program the impedance calibration information in the register related to the calibration operation.

Technology is disclosed herein for per pin internal reference voltage generation for data receivers in non-volatile memory systems. A receiving circuit may have an on-die voltage generator that has inputs to receive a separate voltage magnitude select signal for each data receiver on the receiving circuit. The on-die voltage generator provides a separate reference voltage for each data receiver. This allows the reference voltage for each data receiver to be calibrated separately. A separate reference voltage for each data receiver compensates for variations between data paths, and provides for a wider data valid window than if the same reference voltage were used for all data receivers. Generating the different reference voltages on-die can potentially require a large area, as well as consume considerable power and/or current. A voltage divider and multiplexers may provide the different reference voltages, which saves space and is power and current efficient.

A data input buffer includes a plurality of buffer units configured to receive a first impedance calibration code and a second impedance calibration code, wherein each of the plurality of buffer units outputs an offset detected with a first input terminal and a second input terminal thereof short-circuited, as write data, and wherein a buffer unit corresponding to a current value of the first impedance calibration code among the plurality of buffer units is configured to correct the offset according to the second impedance calibration code.

A memory device includes a memory cell array, a page buffer circuit, and a counting circuit. The page buffer circuit includes a first and second page buffer columns connected to the memory cell array. The first page buffer column includes a first page buffer unit and the second page buffer column includes a second page buffer unit in a first stage. The first page buffer unit performs a first sensing operation in response to a first sensing signal, and the second page buffer unit performs a second sensing operation in response to a second sensing signal. The counting circuit counts a first number of memory cells included in a first threshold voltage region from a result of the first sensing operation, and counts a second number of memory cells included in a second threshold voltage region from a result of the second sensing operation.

A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.

The present disclosure provides techniques for using a multiple-port buffer to improve a transaction rate of a memory module. In an example, a memory module can include a circuit board having an external interface, first memory devices mounted to the circuit board, and a first multiple-port buffer circuit mounted to the circuit board. The first multiple-port buffer circuit can include a first port coupled to data lines of the external interface, the first port configured to operate at a first transaction rate, a second port coupled to data lines of a first plurality of the first memory devices, and a third port coupled to data lines of a second plurality of the first memory devices. The second and third ports can be configured to operate at a second transaction rate, wherein the second transaction rate is slower than the first transaction rate.