A trim/test interface in a packaged integrated circuit device prevents high through-current between pins of the IC device and trim/test interface digital logic within the IC device using a floating-pin-tolerant always-on CMOS input buffer. The always-on buffer uses a coupling capacitor at its input to block signals at DC and a weak-latch feedback path to ensure that intermediate or floating inputs are provided through the buffer only at one of two digital levels (e.g., those provided by a ground pin GND and by a high supply voltage pin VDD). The described interfaces and methods provide for false-entry-free test mode activation for IC devices with a low pin count, where there are a limited number of pins to cover all test/trim functions, or in which only analog, no-connect, or failsafe pins are available for trim or test mode entry control or trim or test data input.

A data storage apparatus is provided to include a memory device including memory cells for storing data; and an interface circuit coupled as an interface between the host device and the memory device and configured to transmit a transmission signal to the host. The interface circuit includes a delay circuit configured to generate a delay code and is configured to generate an additional signal to be combined with the transmission signal based on the delay code.

Embodiments provide an input buffer circuit and a semiconductor memory. a compensation subcircuit is provided between an input terminal of the input buffer circuit and a first terminal of a load subcircuit, a current of an output terminal of the input buffer circuit is increased, and voltage variation of the input terminal can be transmitted to the output terminal in time, such that the output terminal can timely receive the voltage variation of the input terminal, thereby avoiding distortion of an output signal, solving a problem of signal attenuation for the input buffer circuit, improving sensitivity of the input buffer circuit, and preventing negative effects from being caused to transmission of commands inside a system.

An enable control circuit and a semiconductor memory are provided. The enable control circuit includes: a counting circuit, configured to: count past clock cycles, and determine a clock cycle count value; a selection circuit, configured to determine a target clock cycle count value according to a first config signal; and a control circuit, connected to the counting circuit and the selection circuit, and configured to: control an On Die Termination (ODT) path to be in an enabled state responsive to a level state of an ODT pin signal being inverted, and start the counting circuit; and control the ODT path to switch from the enabled state to a disabled state when the clock cycle count value reaches the target clock cycle count value.

A receiver includes the following: a signal receiving circuit, including a first MOS transistor and a second MOS transistor, where a gate of the first MOS transistor is configured to receive a reference signal and a gate of the second MOS transistor is configured to receive a data signal, and the signal receiving circuit is configured to output a comparison signal, the comparison signal being configured to represent a magnitude relationship between a voltage value of the reference signal and a voltage value of the data signal; and an adjusting circuit, including a third MOS transistor, where a source of the third MOS transistor is connected to a source of the first MOS transistor, a drain of the third MOS transistor is connected to a drain of the first MOS transistor, and a gate of the third MOS transistor is configured to receive an adjusting signal.

System boot time is decreased by performing Memory Receive enable (MRE) training and MDQ-MDQS Read Delay (MRD) training on a buffered Dual In-Line Memory Module (DIMM). MRE training configures the time at which a data buffer on the buffered DIMM enables its receivers to capture data read from DRAM integrated circuits on a MDQ/MDQS bus between the DRAM and the data buffer on the DIMM. After the MRE training has completed, the data buffer is configured to enable the data buffer receivers to receive data on the MDQ bus on the buffered DIMM during the preamble of the incoming MDQS burst from a read transaction in the DRAM. MRD training tunes the relationship between the MDQ/MDQS bus to ensure sufficient setup and hold eye margins for MDQ so that the data buffer optimally samples the data driven by the DRAM during reads of the DRAM.

A method and system provides for execution of calibration cycles from time to time during normal operation of the communication channel. A calibration cycle includes de-coupling the normal data source from the transmitter and supplying a calibration pattern in its place. The calibration pattern is received from the communication link using the receiver on the second component. A calibrated value of a parameter of the communication channel is determined in response to the received calibration pattern. The steps involved in calibration cycles can be reordered to account for utilization patterns of the communication channel. For bidirectional links, calibration cycles are executed which include the step of storing received calibration patterns on the second component, and retransmitting such calibration patterns back to the first component for use in adjusting parameters of the channel at first component.

Provided is data receiving circuit, data receiving system and memory device. The data receiving circuit includes: first amplification circuit, configured to receive data signal, first reference signal and second reference signal, perform first comparison on the data signal and the first reference signal in response to sampling clock signal and output first signal pair, and perform second comparison on the data signal and the second reference signal and output second signal pair; second amplification circuit, configured to receive enable signal and feedback signal, selectively receive the first signal pair or the second signal pair as input signal pair based on the feedback signal during period in which the enable signal is at first level, receive the first signal pair during period in which the enable signal is at second level, amplify voltage difference of the first signal pair, and output first output signal and second output signal.

Provided are a page buffer and a memory device including the same. A memory device includes: a memory cell array including a plurality of memory cells; and a page buffer circuit including page buffer units in a first horizontal direction, the page buffer units being connected to the memory cells via bit lines, and cache latches in the first horizontal direction, the cache latches corresponding to the page buffer units, wherein each of the page buffer units includes one or more pass transistors connected to a sensing node of each of the plurality of page buffer units, the sensing node electrically connected to a corresponding bit line. Each sensing node included in each of the page buffer units and the combined sensing node are electrically connected to each other through the pass transistors.

Disclosed herein is logic circuitry and techniques for operation that hardware to enable the construction of first-in-first-out (FIFO) buffers from latches while permitting stuck-at-1 fault testing for the enable pin of those latches, as well as testing the data path at individual points through the FIFO buffer.