A storage device includes a nonvolatile memory device; and a controller configured to, sequentially receive first read commands and a first write command, the first write command being associated with first write data, slice the first write command to generate a plurality of sub-commands, slice the first write data to generate a plurality of sub-data elements, and alternately transmit, to the nonvolatile memory device, at least one read command of the first read commands, and one sub-command of the plurality of sub-commands and one sub-data element of the plurality of sub-data elements.

A processing device in a memory system determines to send system state information associated with the memory device to a host system and identifies a subset of a plurality of event entries from a staging buffer based on one or more filtering factors, the plurality of event entries corresponding to events associated with the memory device. The processing device further sends the subset of the plurality of event entries as the system state information to the host system over a communication pipe having limited bandwidth.

A semiconductor chip capable of improving signal quality includes a host device, a first memory device which is spaced part from the host device and connected to the host device, a repeater module which is connected to the host device and the first memory device, and a second memory device which is spaced apart from the host device and connected to the repeater module. The first memory device receives a data signal from the host device and generates a recovery clock signal, using the data signal. The repeater module receives the recovery clock signal from the first memory device, receives a first input signal from the host device, and samples the first input signal on the basis of the recovery clock signal to generate a sampling signal. The second memory device receives the sampling signal.

Methods, systems, and apparatuses related to memory operation with on-die termination (ODT) are provided. A memory device may be configured to provide ODT at a first portion (e.g., rank) during multiple communications at a second portion (e.g., rank). For example, a memory device may receive a first command instructing a first portion to perform a first communication and instructing a second portion to enter an ODT mode. The device may perform, with the first portion, the first communication with a host while the second portion is in the ODT mode. The device may receive a second command instructing the first portion to perform a second communication, and the device may perform, with the first portion, the second communication while the second portion remains in the ODT mode. The second portion may persist in the ODT mode for an indicated number of communications, or until instructed to exit the ODT mode.

A data processing system includes a compute blade generating a write command to store data and a read command to read the data, and a memory blade. The compute blade has a memory that stores information about performance characteristics of each of a plurality of memories, and determines priority information through which eviction of a cache line is carried out based on the stored information.

The present disclosure provides page buffer circuits of 3D NAND devices. In some embodiments, the page buffer circuit comprises a first bit line segment sensing branch connected to a first bit line segment of a bit line, and a second bit line segment sensing branch connected to a second bit line segment of the bit line. The first bit line segment sensing branch and the second bit line segment sensing branch are parallel connected to a sensing node of the page buffer circuit. In some embodiments, the first bit line segment sensing branch comprises a first sense latch and a first bit line pre-charge path, and the second bit line segment sensing branch comprises a second sense latch and a second bit line pre-charge path.

The present disclosure provides techniques for using a multiple-port buffer to improve a transaction rate of a memory module. In an example, a memory module can include a circuit board having an external interface, first memory devices mounted to the circuit board, and a first multiple-port buffer circuit mounted to the circuit board. The first multiple-port buffer circuit can include a first port coupled to data lines of the external interface, the first port configured to operate at a first transaction rate, a second port coupled to data lines of a first plurality of the first memory devices, and a third port coupled to data lines of a second plurality of the first memory devices. The second and third ports can be configured to operate at a second transaction rate, wherein the second transaction rate is slower than the first transaction rate.

The present application provides a storage system including a data port. The data port includes a data output unit. The data output unit includes: a pull-up unit having a control terminal, a first terminal and a second terminal, a first input signal being inputted to the control terminal, the first terminal being electrically connected to a power supply, the second terminal being connected to an output terminal of the data output unit, and the pull-up unit being a first NMOS transistor; and a pull-down unit having a control terminal, a first terminal and a second terminal, a second input signal being inputted to the control terminal, the first terminal being electrically connected to a ground terminal, and the second terminal being connected to the output terminal of the data output unit.

This document describes apparatuses and techniques for write timing compensation. In various aspects, a write timing compensator of a memory controller can apply a delay to data signals transmitted to a memory circuit based on various operating parameters, which may include voltage or latency information. In some cases, the memory controller or memory circuit powers components of write timing compensation circuitry using a dynamic power rail that scales with an operating voltage of the memory circuit. By so doing, the write timing compensator or compensation circuits may improve signal integrity of data signals communicated between the memory controller and the memory circuit at different frequencies and voltages.

A data storage system includes a plurality of memory dies and interface circuitry, including a receiver configured to receive pulses of a read clock signal; an I/O contact pad coupled to the receiver via a signal path of an interface channel; and on-die-termination (ODT) circuitry coupled to the I/O contact pad and the receiver. The ODT circuitry includes a plurality of resistor pairs, each including a pull-up resistor selectively coupled to the signal path via a first switch, and a pull-down resistor selectively coupled to the signal path via a second switch; and ODT control circuitry configured to enable ODT at the interface circuitry by causing each of the switches to be closed during a first stage of the read operation, and disable ODT at the interface circuitry by causing each of the switches to be open during a final stage of the read operation.