Apparatuses and methods for writing and storing parameter codes for operating parameters, and selecting between the parameter codes to set an operating condition for a memory are disclosed. An example apparatus includes a first mode register and a second mode register. The first mode register is configured to store first and second parameter codes for a same operating parameter. The second mode register is configured to store a parameter code for a control parameter to select between the first and second parameter codes to set a current operating condition for the operating parameter. An example method includes storing in a first register a first parameter code for an operating parameter used to set a first memory operating condition, and further includes storing in a second register a second parameter code for the operating parameter used to set a second memory operating condition.

A memory device includes an array of 2T1C DRAM cells and a memory controller. The DRAM cells are arranged as a plurality of rows and columns of DRAM cells. The memory controller is internal to the memory device and is coupled to the array of DRAM cells. The memory controller is capable of receiving commands input to the memory device and is responsive to the received commands to control row-major access and column-major access to the array of DRAM cells. In one embodiment, each transistor of a memory cell includes a terminal directly coupled to a storage node of the capacitor. In another embodiment, a first transistor of a memory cell includes a terminal directly coupled to a storage node of the capacitor, and a second transistor of the 2T1C memory cell includes a gate terminal directly coupled to the storage node of the capacitor.

A storage device includes a memory device including a plurality of memory dies; and a memory controller for addressing a memory die among the plurality of memory dies by using an address latch enable (ALE) signal and a command latch enable (CLE) signal, which are input during predetermined N cycles, where N is a natural number, and controlling the memory device such that the one memory die performs a memory operation. The memory controller may address the memory die by addressing a channel among a plurality of channels respectively connected to a plurality of package groups by using a chip enable (CE) signal.

A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.

A memory is provided that includes a write multiplexer, which multiplexes among a plurality of bit line columns. The multiplexer includes a positive boost circuit that applies a positive boost to a voltage at the gates of transistors to strengthen an on state of those transistors. The positive boosting may be in addition to, or instead of, negative boosting at a write driver circuit.

A memory device includes: a memory bank including a plurality of memory cells; and a memory interface circuit configured to store data in the plurality of memory cells based on a command/address signal and a data signal, wherein the memory interface circuit includes: first, second, third and fourth pads configured to receive first, second, third and fourth clock signals, respectively; a first buffer circuit configured to sample the command/address signal in response to an activation time of the first and third clock signals which have opposite phases from each other; and a second buffer circuit configured to sample the data signal in response to the activation time of the first clock signal, an activation time of the second clock signal, the activation time of the third clock signal and an activation time of the fourth clock signal.

A data receiving circuit includes: a first amplification module configured to receive a data signal and a reference signal, compare the data signal and the reference signal in response to a first sampling clock signal, and output a first voltage signal and a second voltage signal; a decision feedback control module configured to generate a second sampling clock signal in response to the enable signal; a decision feedback equalization module configured to, when the enable signal is in a first level value interval, perform decision feedback equalization in response to the second sampling clock signal and stop performing the decision feedback equalization when the enable signal is in a second level value interval; and a second amplification module configured to process the first voltage signal and the second voltage signal and output the first output signal and the second output signal.

Fuses can store different delay states to cause execution of a command to be staggered for different memory dies of a memory package. Fuse arrays can be included in the memory package and programmed to cause execution of a command to be delayed by different amounts for different dies. The fuse arrays can be fabricated and then programmed to cause different delays for different dies.

Methods for improving timing in memory devices are disclosed. A method may include sampling a command signal according to a clock signal to obtain standard-timing commands. The method may also include sampling the command signal according to an adjusted clock signal to obtain time-adjusted commands. The method may also include comparing the standard-timing commands and the time-adjusted commands. The method may also include determining an improved timing for the clock signal based on the comparison of the standard-timing commands and the time-adjusted commands. The method may also include adjusting the clock signal based on the improved timing. Associated systems and methods are also disclosed.

A command decoder circuit, a memory, and an electronic device are provided. The circuit includes a first decoder unit, configured to perform decoding for a first command signal based on a dynamic clock signal; a second decoder unit, configured to perform decoding for a second command signal based on the dynamic clock signal; and the clock gate, configured to generate the dynamic clock signal after a chip select signal of the first decoder unit indicates that decoding to be started for the first command signal and before the second decoder unit has performed decoding for the second command signal, and cut off the dynamic clock signal before the chip select signal of the first decoder unit indicates that the decoding to be started for the first command signal or after the second decoder unit has performed decoding for the second command signal.