A storage element includes a layer structure including a storage layer having a direction of magnetization which changes according to information, a magnetization fixed layer having a fixed direction of magnetization, and an intermediate layer disposed therebetween, which intermediate layer contains a nonmagnetic material. The magnetization fixed layer has at least two ferromagnetic layers having a direction of magnetization tilted from a direction perpendicular to a film surface, which are laminated and magnetically coupled interposing a coupling layer therebetween. This configuration may effectively prevent divergence of magnetization reversal time due to directions of magnetization of the storage layer and the magnetization fixed layer being substantially parallel or antiparallel, reduce write errors, and enable writing operation in a short time.

A method of applying a write current to a magnetic tunnel junction device minimizes sub-threshold leakage. NMOS- and PMOS-follower circuits are used in applying the write current, and bias signals for the follower circuits are isolated from global bias signals before the write current is applied.

Memory cells and methods of forming thereof are disclosed. The memory cell includes a substrate and first and second select transistors. The first select transistor serves as a write selector and the second select transistor serves as a read selector. The gate of first select transistor is coupled to a write wordline (WL_w) and the gate of the second select transistor is coupled to a read/write wordline (WL_r/w). The source regions of the first and second select transistors are coupled to a source line (SL). A body well is disposed in the substrate. The body well serves as a body of the first and second select transistors. A back bias is applied to the body of the select transistors. A storage element which includes a magnetic tunnel junction (MTJ) element is coupled with a bitline (BL) and the first and the second select transistors.

A magnetoresistive random-access memory (MRAM) device is disclosed. The device described herein has a thermal stability enhancement layer over the free layer of a magnetic tunnel junction. The thermal stability enhancement layer improves the thermal stability of the free layer, increases the magnetic moment of the free layer, while also not causing the magnetic direction of the free layer to become in plan. The thermal stability enhancement layer can be comprised of a layer of CoFeB ferromagnetic material.

Embodiments herein provide film stacks that include a buffer layer; a synthetic ferrimagnet (SyF) coupling layer; and a capping layer, wherein the capping layer comprises one or more layers, and wherein the capping layer, the buffer layer, the SyF coupling layer, or a combination thereof, is not fabricated from Ru.

Embodiments herein provide film stacks that include a buffer layer; a synthetic ferrimagnet (SyF) coupling layer; and a capping layer, wherein the capping layer comprises one or more layers, and wherein the capping layer, the buffer layer, the SyF coupling layer, or a combination thereof, is not fabricated from Ru.

Methods, systems, and devices for differential amplifier schemes for sensing memory cells are described. In one example, an apparatus may include a memory cell, a differential amplifier having a first input node, a second input node, and an output node that is coupled with the first input node via a first capacitor, and a second capacitor coupled with the first input node. The apparatus may include a controller configured to cause the apparatus to bias the first capacitor, couple the memory cell with the first input node, and generate, at the output node, a sense signal based at least in part on biasing the first capacitor and coupling the memory cell with the first input node. The apparatus may also include a sense component configured to determine a logic state stored by the memory cell based at least in part on the sense signal.

Methods, systems, and devices for differential amplifier schemes for sensing memory cells are described. In one example, an apparatus may include a memory cell, a differential amplifier having a first input node, a second input node, and an output node that is coupled with the first input node via a first capacitor, and a second capacitor coupled with the first input node. The apparatus may include a controller configured to cause the apparatus to bias the first capacitor, couple the memory cell with the first input node, and generate, at the output node, a sense signal based at least in part on biasing the first capacitor and coupling the memory cell with the first input node. The apparatus may also include a sense component configured to determine a logic state stored by the memory cell based at least in part on the sense signal.

The magnetic memory element (100) includes: a conductive layer that includes a heavy metal layer (10) containing a 5d transition metal; a first ferromagnetic layer (20) that is adjacent to the conductive layer and contains a ferromagnetic layer having a reversible magnetization; a barrier layer (30) that is adjacent to the first ferromagnetic layer (20) and includes an insulating material; a reference layer (40) that is adjacent to the barrier layer (30) and has at least one second ferromagnetic layer (41) having a fixed magnetization direction; a cap layer (50) that is adjacent to the reference layer (40) and includes a conductive material; a first terminal (T1) that is capable of introducing a current into one end of the heavy metal layer (10) in the longitudinal direction; a second terminal (T2) that is capable of introducing a current into the other end of the heavy metal layer (10) in the longitudinal direction; and a third terminal (T3) that is capable of introducing a current into the cap layer (50).

This technology provides a method for fabricating an electronic device. A method for fabricating an electronic device including a variable resistance element, which includes a free layer having a variable magnetization direction; a pinned layer having a first non-variable magnetization direction, and including first ferromagnetic materials and a first spacer layer interposed between adjacent two first ferromagnetic materials among the first ferromagnetic materials; a tunnel barrier layer interposed between the free layer and the pinned layer; a magnetic correction layer having a second magnetization direction which is anti-parallel to the first magnetization direction; and a third spacer layer interposed between the magnetic correction layer and the pinned layer, and providing an anti-ferromagnetic exchange coupling between the magnetic correction layer and the pinned layer.