A nonvolatile memory device according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; a first magnetic material layer and a second magnetic material layer provided between the first electrode and the second electrode; an insulator layer provided between the first magnetic material layer and the second magnetic material layer; and an oxidized magnetic material film provided around the first magnetic material layer.

A nonvolatile memory device according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; a first magnetic material layer and a second magnetic material layer provided between the first electrode and the second electrode; an insulator layer provided between the first magnetic material layer and the second magnetic material layer; and an oxidized magnetic material film provided around the first magnetic material layer.

A method for crystalized silicon structures from amorphous structures in a magnetic memory array, wherein the temperature needed to crystalize the amorphous silicon is lower than the temperature budget of the memory element so as to avoid damage to the memory element. An amorphous silicon is deposited, followed by a layer of Ti or Co. An annealing process is then performed which causes the Ti or Co to form TiSi.sub.2 or CoSi.sub.2 and also causes the underlying amorphous silicon to crystallize.

A magnetic memory cell includes a substrate, a transistor, a first dielectric layer disposed on the substrate, a landing pad in the first dielectric layer, a second dielectric layer covering the first dielectric layer and the landing pad, a memory stack in the second dielectric layer, and a source line in the first dielectric layer. The first dielectric layer covers the transistor. The landing pad is situated in a first horizontal plane and is coupled to a drain region of the transistor. The memory stack has a bottom electrode connected to the landing pad and a top electrode electrically connected to a bit line. The source line is situated in a second horizontal plane and is connected to a source region of the transistor. The second horizontal plane and the first horizontal plane are not coplanar.

A spin-orbit-torque magnetization rotational element includes: a first ferromagnetic layer; and a spin-orbit torque wiring in which a first surface faces the first ferromagnetic layer and a long axis extends in a first direction when viewed in plan view from a lamination direction of the first ferromagnetic layer, wherein the first surface spreads along a reference plane orthogonal to the lamination direction of the first ferromagnetic layer, the spin-orbit torque wiring contains a first virtual cross-section which passes through a first end of the first ferromagnetic layer in the first direction and is orthogonal to the first direction and a second virtual cross-section which passes through a second end of the first ferromagnetic layer in the first direction and is orthogonal to the first direction, and an area of the first virtual cross-section is different from an area of the second virtual cross-section.

A magnetic memory cell includes a substrate, a transistor, a first dielectric layer disposed on the substrate, a landing pad in the first dielectric layer, a second dielectric layer covering the first dielectric layer and the landing pad, a memory stack in the second dielectric layer, and a source line in the first dielectric layer. The first dielectric layer covers the transistor. The landing pad is situated in a first horizontal plane and is coupled to a drain region of the transistor. The memory stack has a bottom electrode connected to the landing pad and a top electrode electrically connected to a bit line. The source line is situated in a second horizontal plane and is connected to a source region of the transistor. The second horizontal plane and the first horizontal plane are not coplanar.

A storage element includes a layer structure including a storage layer having a direction of magnetization which changes according to information, a magnetization fixed layer having a fixed direction of magnetization, and an intermediate layer disposed therebetween, which intermediate layer contains a nonmagnetic material. The magnetization fixed layer has at least two ferromagnetic layers having a direction of magnetization tilted from a direction perpendicular to a film surface, which are laminated and magnetically coupled interposing a coupling layer therebetween. This configuration may effectively prevent divergence of magnetization reversal time due to directions of magnetization of the storage layer and the magnetization fixed layer being substantially parallel or antiparallel, reduce write errors, and enable writing operation in a short time.

A storage element includes a layer structure including a storage layer having a direction of magnetization which changes according to information, a magnetization fixed layer having a fixed direction of magnetization, and an intermediate layer disposed therebetween, which intermediate layer contains a nonmagnetic material. The magnetization fixed layer has at least two ferromagnetic layers having a direction of magnetization tilted from a direction perpendicular to a film surface, which are laminated and magnetically coupled interposing a coupling layer therebetween. This configuration may effectively prevent divergence of magnetization reversal time due to directions of magnetization of the storage layer and the magnetization fixed layer being substantially parallel or antiparallel, reduce write errors, and enable writing operation in a short time.

Disclosed is a three-dimensional magnetic device based on a spin Hall effect which includes an internal electrode, at least one magnetic junction and at least one external electrode. The internal electrode, the at least one magnetic junction and the at least one external electrode have columnar structures. Each of the at least one magnetic junction comprises a magnetic free layer, a magnetic reference layer and a non-magnetic spacing layer between magnetic free layer and magnetic reference layer. The magnetic free layer is in contact with internal electrode, and the magnetic reference layer in each of the at least one magnetic junction is in contact with a corresponding one of the at least one external electrode. The three-dimensional magnetic device may be stacked in a normal direction of the bottom surface of the internal electrode. Magnetization reversal of three-dimensional magnetic device may be realized by a combination of a spin-orbit torque and a spin transfer torque. The magnetic device has advantages of reduced heating, improved reliability and stability, high storage density while ensuring thermal stability.

An integrated circuit includes a magneto resistive RAM (MRAM) array having a plurality of MRAM cells, and a set of at least one Hall sensor circuit, each of the set including a Hall sensor to detect a magnetic field. The integrated circuit also includes magnetic processing circuitry for receiving at least one indication from the set of at least one Hall sensor circuit. The magnetic processing circuitry including an output to provide an indication of a possible magnetic field threat to the MRAM array based on the at least one indication from the set.