G11C11/165

STT-MRAM failed address bypass circuit and STT-MRAM device including same

A spin transfer torque magnetic random access memory (STT-MRAM) device according to the present embodiment comprises: an STT-MRAM memory array which includes a data storage unit for storing data, a defect area address storage unit for storing an address of a defect area, and a spare area for storing data of a failed area; and a bypass determination unit which includes a volatile information storage element for storing the address of the defect area, stored in the defect area address storage unit and provided thereto, and when memory array access occurs, compares an access address with the address of the defect area stored in the volatile information storage element and causes the memory array access to bypass to the spare area.

Magnetic device and manufacturing method of magnetic device

According to one embodiment, a magnetic device includes a magnetoresistive effect element including a first ferromagnet, a conductor, and an oxide provided between the first ferromagnet and the conductor, the oxide including a first oxide of a rare-earth element and a second oxide of an element of which a covalent radius is smaller than a covalent radius of the rare-earth element.

Initialization process for magnetic random access memory (MRAM) production

An initialization process is disclosed for a perpendicular magnetic tunnel junction (p-MTJ) wherein the switching error rate is reduced from a typical range of 30-100 ppm to less than 10 ppm. In one embodiment, an in-plane magnetic field is applied after a final anneal step is performed during memory device fabrication such that all magnetizations in the free layer, and AP1 and AP2 pinned layers are temporarily aligned in-plane. After the applied field is removed, interfacial perpendicular magnetic anisotropy (PMA) at a tunnel barrier/AP1 interface induces a single AP1 magnetic domain with a magnetization in a first vertical direction. Interfacial PMA at a FL/tunnel barrier interface affords a single FL domain with magnetization in the first direction or opposite thereto. AP2 magnetization is opposite to the first direction as a result of antiferromagnetic coupling with the AP1 layer. Alternatively, a perpendicular-to-plane magnetic field may be applied for initialization.

Spin current magnetization rotational element, magnetoresistance effect element, and magnetic memory
10854258 · 2020-12-01 · ·

Provided is a spin current magnetization rotational element including: a first ferromagnetic metal layer for a magnetization direction to be changed; and a spin-orbit torque wiring. The spin-orbit torque wiring has a structure in which a spin conduction layer and an interfacial spin generation layer are alternately laminated in the first direction, the number of a plurality of the interfacial spin generation layers is two or greater, and in the spin-orbit torque wiring, one of the plurality of interfacial spin generation layers is closest to the first ferromagnetic metal layer.

Adjustable current selectors
10854260 · 2020-12-01 · ·

The various implementations described herein include methods, devices, and systems for performing operations on memory devices. In one aspect, a memory device a magnetic memory component and a current selector component coupled to the magnetic memory component. The current selector component includes a first transistor having a first gate with a corresponding first threshold voltage. The first transistor comprises a charge storage layer configured to selectively store charge so as to adjust a current through the first transistor. The memory device further includes control circuitry configured to determine a bit error rate of the magnetic memory component and adjust a charge stored in the charge storage layer based on the determined bit error rate.

Single-poly non-volatile memory cell and operating method thereof
10797064 · 2020-10-06 · ·

A non-volatile memory cell includes a floating-gate transistor, a select transistor, and a coupling structure. The floating-gate transistor is deposited in a P-well and includes a gate terminal coupled to a floating gate which is a first polysilicon layer, a drain terminal coupled to a bit line, and a source terminal coupled to a first node. The select transistor is deposited in the P-well and includes a gate terminal coupled to a select gate which is coupled to a word line, a drain terminal coupled to the first node, and a source terminal coupled to the source line. The floating-gate transistor and the select transistor are N-type transistors. The coupling structure is formed by extending the first polysilicon layer to overlap a control gate, in which the control gate is a P-type doped region in an N-well and the control gate is coupled to a control line.

SEMICONDUCTOR CIRCUIT
20240014810 · 2024-01-11 ·

A semiconductor circuit according to an embodiment of the present disclosure includes a nonvolatile latch circuit that stores k-bit data, and m-bit error correction data for the k-bit data.

MULTI-LEVEL MEMRISTOR ELEMENTS

There is described a two-terminal multi-level memristor element synthesised from binary memristors, which is configured to implement a variable resistance based on unary or binary code words. There is further described a circuit such as a synapse circuit implemented using a multi-level memristor element.

Memory device having source contacts located at intersections of linear portions of a common source, electronic systems, and associated methods
10727271 · 2020-07-28 · ·

Memory devices include an array of memory cells including magnetic tunnel junction regions. The array of memory cells includes access lines extending in a first direction and data lines extending in a second direction transverse to the first direction. A common source includes first linear portions and second linear portions extending at an acute angle to each of the first direction and the second direction. Electronic systems include such a memory device operably coupled to a processor, to which at least one input device and at least one output device is operably coupled. Methods of forming such an array of memory cells including a common source.

Random bit cell with memory units

A random bit cell includes a random bit cell. The random bit cell includes a volatile memory unit, a first non-volatile memory unit, a second non-volatile memory unit, a first select transistor, and a second select transistor. The first non-volatile memory unit is coupled to a first data terminal of the volatile memory unit, and the second non-volatile memory unit is coupled to a second data terminal of the volatile memory unit. The first select transistor has a first terminal coupled to the first data terminal of the volatile memory unit, a second terminal coupled to a first bit line, and a control terminal coupled to a word line. The second select transistor has a first terminal coupled to the second data terminal of the volatile memory unit, a second terminal coupled to a second bit line, and a control terminal coupled to a word line.