Described is a packaging technology to improve performance of an AI processing system. An IC package is provided which comprises: a substrate; a first die on the substrate, and a second die stacked over the first die. The first die includes memory and the second die includes computational logic. The first die comprises a ferroelectric RAM (FeRAM) having bit-cells. Each bit-cell comprises an access transistor and a capacitor including ferroelectric material. The access transistor is coupled to the ferroelectric material. The FeRAM can be FeDRAM or FeSRAM. The memory of the first die may store input data and weight factors. The computational logic of the second die is coupled to the memory of the first die. The second die is an inference die that applies fixed weights for a trained model to an input data to generate an output. In one example, the second die is a training die that enables learning of the weights.

Described is a low power, high-density a 1T-1C (one transistor and one capacitor) memory bit-cell, wherein the capacitor comprises a pillar structure having ferroelectric material (perovskite, improper ferroelectric, or hexagonal ferroelectric) and conductive oxides as electrodes. In various embodiments, one layer of the conductive oxide electrode wraps around the pillar capacitor, and forms the outer electrode of the pillar capacitor. The core of the pillar capacitor can take various forms.

Methods, systems, and devices for reset verification in a memory system are described. In some examples, a memory device may perform a reset operation and set a mode register to a first value based on performing the reset operation. The first value may be associated with a successful execution of the reset command. The memory device may transmit an indication to a host device based on determining the first value. The host device may determine from the received indication or from the first value stored in the mode register that the first value is associated with the successful execution of the reset command. Thus, the memory device, or the host device, or both may be configured to verify whether the reset operation is successful.

Various aspects relate to a memory cell arrangement including: a memory cell including a field-effect transistor structure and a spontaneous-polarizable memory layer; and a control circuit configured to cause a writing of the memory cell by a writing operation, the writing operation including: carrying out a writing sequence including: supplying a write signal set to the memory cell to provide a write voltage drop to bring a threshold voltage of the memory cell into a target range by polarizing the memory layer, and, subsequently, supplying a post-conditioning signal set to the memory cell to provide a post-conditioning voltage drop having opposite polarity with respect to the write voltage drop to change the threshold voltage by partially depolarizing the memory layer; and checking whether the threshold voltage is in the target range, and repeating the writing sequence in the case that the threshold voltage is not in the target range.

Methods, systems, and devices for signal development caching in a memory device are described. In one example, a memory device in accordance with the described techniques may include a memory array, a sense amplifier array, and a signal development cache configured to store signals (e.g., cache signals, signal states) associated with logic states (e.g., memory states) that may be stored at the memory array (e.g., according to various read or write operations). In various examples, accessing the memory device may include accessing information from the signal development cache, or the memory array, or both, based on various mappings or operations of the memory device.

Disclosed are a semiconductor device and a semiconductor memory device including the same. A semiconductor device may include a first electrode, a second electrode on the first electrode, a ferroelectric layer between the first electrode and the second electrode, an anti-ferroelectric layer in contact with the ferroelectric layer, and an insertion layer spaced apart from the ferroelectric layer and in contact with the anti-ferroelectric layer.

A capacitor device and a semiconductor device including the capacitor device are provided. The capacitor device includes first and second electrodes spaced apart from each other, and a dielectric layer provided between the first electrode and the second electrode. The dielectric layer includes a dielectric material in which ferroelectrics and antiferroelectrics are mixed with each other.

Methods, systems, and devices for delay adjustment circuits are described. Amplifiers (e.g., differential amplifiers) may act like variable capacitors (e.g., due to the Miller-effect) to control delays of signals between buffer (e.g., re-driver) stages. The gains of the amplifiers may be adjusted by adjusting the currents through the amplifiers, which may change the apparent capacitances seen by the signal line (due to the Miller-effect). The capacitance of each amplifier may be the intrinsic capacitance of input transistors that make up the amplifier, or may be a discrete capacitor. In some examples, two differential stages may be inserted on a four-phase clocking system (e.g., one on 0 and 180 phases, the other on 90 and 270 phases), and may be controlled differentially to control phase-to-phase delay.

Methods, systems, and devices for system and method for reading and writing memory management data through a non-volatile cell based register are described. A memory device may include a set of latch units addressable via a set of row lines and a set of column lines. Each latch unit may include a sense amplifier coupled with a first line and a first non-volatile capacitor coupled with the first line and a second line, where the first capacitor is configured to store a charge representing one or more bits. Additionally, each latch unit may include a second capacitor coupled with the first line and a third line, where the second capacitor is configured to amplify a voltage at the first line based on the charge stored in the first capacitor.

A memory device includes a bit line group having a first bit line and a second bit line. The bit line group includes a first segment, a second segment, and a twist segment conductively connected to the first segment and the second segment. The first segment includes a first portion of the first bit line and a first portion of the second bit line. The second segment includes a second portion of the first bit line and a second portion of the second bit line. The twist segment includes a third portion of the first bit line and a third portion of the second bit line. The first and second portions of the first bit line and the second bit line each extends in a first lateral direction. The third portion of the first bit line is conductively connected to the first and second portions of the first bit line.