G11C11/221

SENSING COMPONENT WITH A COMMON NODE
20230206979 · 2023-06-29 ·

Methods, systems, and devices for sensing component with a common node are described. A set of sense circuits of a memory device may include a shared differential amplifier having a first branch for each sense circuit and a shared second branch, as well as a shared common node. A respective latch of each sense amplifier may be initialized to a second logic state, and the common node may undergo a voltage ramp to determine the state stored in the memory cell. If the memory cell stores the first logic state, the sense amplifier may couple with the common node to draw the current and switch the state of the latch to the first logic state. Alternatively, if the memory cell stores the second logic state the current may not be drawn and the state of the latch may not switch.

Drive strength calibration for multi-level signaling

Methods, systems, and devices for drive strength calibration for multi-level signaling are described. A driver may be configured to have an initial drive strength and to drive an output pin of a transmitting device toward an intermediate voltage level of a multi-level modulation scheme, where the output pin is coupled with a receiving device via a channel. The receiving device may generate, and the transmitting device may receive, a feedback signal indicating a relationship between the resulting voltage of the channel and an value for the intermediate voltage level. The transmitting device may determine and configure the driver to use an adjusted drive strength for the intermediate voltage level based on the feedback signal. The driver may be calibrated (e.g., independently) for each intermediate voltage level of the multi-level modulation scheme. Further, the driver may be calibrated for the associated channel.

Memory management for charge leakage in a memory device
11688449 · 2023-06-27 · ·

Methods, systems, and devices for memory management associated with charge leakage in a memory device are described. A memory device may identify a charge leakage associated with one or more memory cells or access lines, and may determine whether to invert a logic state stored by a memory cell or a set of memory cells to improve the likelihood that the memory cells are read properly in the presence of charge leakage. In some examples, the memory device may also store an indication that the complement of the detected logic state was written, such as a bit flip indication, which may correspond to one memory cell or a set of memory cells.

Digit line management for a memory array
11688448 · 2023-06-27 · ·

Methods, systems, and devices for digit line management for a memory array are described. A memory array may include a plate that is common to a plurality of memory cells. Each memory cell associated with the common plate may be coupled with a respective digit line. One or more memory cells common to the plate may be accessed by concurrently selecting the plate and each digit line associated with the plate. Concurrent selection of all digit lines associated with the plate may be supported by shield lines between the selected digit lines. Additionally or alternatively, selection of all digit lines associated with the plate may be supported by improved sensing schemes and related amplifier configurations.

Memory cell, memory cell arrangement, and methods thereof
11688447 · 2023-06-27 · ·

According to various aspects, a memory cell is provided, the memory cell may include a field-effect transistor; a first control node and a second control node, a first capacitor structure including a first electrode connected to the first control node, a second electrode connected to a gate region of the field-effect transistor, and a remanent-polarizable region disposed between the first electrode and the second electrode of the first capacitor structure; and a second capacitor structure including a first electrode connected to the second control node, a second electrode connected to the gate region of the field-effect transistor. In some aspects, the first capacitor structure may have a first capacitance and the second capacitor structure may have a second capacitance different from the first capacitance.

Using ferroelectric field-effect transistors (FeFETs) as capacitive processing units for in-memory computing

An electronic circuit includes a plurality of word lines; a plurality of bit lines intersecting said plurality of word lines at a plurality of grid points; and a plurality of in-memory processing cells located at said plurality of grid points. Each of said in-memory processing cells includes a first switch having a first terminal coupled to a corresponding one of said word lines and a second terminal; a second switch having a first terminal coupled to said second terminal of said first switch and a second terminal coupled to a corresponding one of said bit lines; and a non-volatile tunable capacitor having one electrode coupled to said second terminal of said first switch and said first terminal of said switch, and having another electrode coupled to ground.

PLATE DEFECT MITIGATION TECHNIQUES
20170365360 · 2017-12-21 ·

Methods, systems, techniques, and devices for operating a ferroelectric memory cell or cells are described. Groups of cells may be operated in different ways depending, for example, on a relationship between cell plates of the group of cells. Cells may be selected in pairs in order to accommodate an electric current relationship, such as a short, between cells that make up the pair. Cells may be arranged in cell plate groups, and a pair of cells may include a first cell plate from one cell plate group and a second cell plate from the same cell plate group or from another, adjacent cell plate group. So a pair of cell plates may include cell plates from different cell plate groups. The first and second cell plates may be selected as a pair or a group based at least in part on the electric current relationship between the cell plates.

Detecting Location within a Network

Systems and methods for detecting the presence of a body in a network without fiducial elements, using signal absorption, and signal forward and reflected backscatter of radio frequency (RF) waves caused by the presence of a biological mass in a communications network.

SIGNAL PATH BIASING IN A MEMORY SYSTEM

Methods, systems, and devices for signal path biasing in an electronic system (e.g., a memory system) are described. In one example, a memory device, a host device, or both may be configured to bias a signal path, between an idle state and an information transfer or between an information transfer and an idle state, to an intermediate or mid-bias voltage level, which may reduce signal interference associated with such transitions. In various examples, the described biasing to a voltage, such as a mid-bias voltage, may be associated with an access command or other command for information to be communicated between devices of the electronic system, such as a command for information to be communicated between a memory device and a host device.

Dynamic reference voltage determination

Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A first value may be written to a first memory cell and a second value may be written to a second memory cell. Each value may have a corresponding voltage when the memory cells are discharged onto their respective digit lines. The voltage on each digit line after a read operation may be temporarily stored at a node in electronic communication with the respective digit line. A conductive path may be established between the nodes so that charge sharing occurs between the nodes. The voltage resulting from the charge sharing may be used to adjust a reference voltage that is used by other components.