G11C11/221

CONFIGURABLE INPUT FOR AN AMPLIFIER
20230215487 · 2023-07-06 ·

Methods, systems, and devices for configurable input for an amplifier are described. In some examples, a circuit may be configured to operate based on a signal having a first voltage profile or a second voltage profile. For example, the first voltage profile may be associated with a range of voltages that are based on a temperature of an associated memory chip, and the second voltage profile may be associated with a voltage (or voltages) that are not associated with the temperature of the memory chip. The circuit may include one or more transistors and switches that are activated based on the voltage profile and a switch receiving a particular control signal. In some instances, the control signal may be received based on a value stored to one or more non-volatile memory elements.

Domain-based access in a memory device

Methods, systems, and devices related to domain-based access in a memory device are described. In one example, a memory device in accordance with the described techniques may include a memory array, a sense amplifier array, and a signal development cache configured to store signals (e.g., cache signals, signal states) associated with logic states (e.g., memory states) that may be stored at the memory array (e.g., according to various read or write operations). The memory array may be organized according to domains, which may refer to various configurations or collections of access lines, and selections thereof, of different portions of the memory array. In various examples, a memory device may determine a plurality of domains for a received access command, or an order for accessing a plurality of domains for a received access command, or combinations thereof, based on an availability of the signal development cache.

Erasure decoding for a memory device

Methods, systems, and devices for erasure decoding for a memory device are described. In accordance with the described techniques, a memory device may be configured to identify conditions associated with an erasure, a possible erasure, or an otherwise indeterminate logic state (e.g., of a memory cell, of an information position of a codeword). Such an identification may be used to enhance aspects of error handling operations, including those that may be performed at the memory device or a host device (e.g., error handling operations performed at a memory controller external to the memory device). For example, error handling operations may be performed using speculative codewords, where information positions associated with an indeterminate or unassigned logic state are assigned with a respective assumed logic state, which may extend a capability of error detection or error correction compared to handling errors with unknown positions.

Write scheme for multi-element gain ferroelectric memory bit-cell with plate-line parallel to word-line to minimize write disturb effects

A memory is provided which comprises a capacitor including non-linear polar material. The capacitor may have a first terminal coupled to a node (e.g., a storage node) and a second terminal coupled to a plate-line. The capacitors can be a planar capacitor or non-planar capacitor (also known as pillar capacitor). The memory includes a transistor coupled to the node and a bit-line, wherein the transistor is controllable by a word-line, wherein the plate-line is parallel to the bit-line. The memory includes a refresh circuitry to refresh charge on the capacitor periodically or at a predetermined time. The refresh circuit can utilize one or more of the endurance mechanisms. When the plate-line is parallel to the bit-line, a specific read and write scheme may be used to reduce the disturb voltage for unselected bit-cells. A different scheme is used when the plate-line is parallel to the word-line.

Common mode compensation for non-linear polar material based 1T1C memory bit-cell

To compensate switching of a dielectric component of a non-linear polar material based capacitor, an explicit dielectric capacitor is added to a memory bit-cell and controlled by a signal opposite to the signal driven on a plate-line.

Power-efficient generation of voltage
11545208 · 2023-01-03 · ·

Methods, systems, and devices for power-efficient generation of voltage are described. A driver circuit in a memory device may produce a voltage on an output node for other components in the memory device to use. To produce the voltage, the driver circuit may use a first voltage supply to charge the output node to a first threshold voltage level. The driver may then use a second voltage source to charge the output node to a second threshold voltage level that is different than (e.g., higher than) the first threshold voltage level.

Differential amplifier sensing schemes for non-switching state compensation in a memory device
11545206 · 2023-01-03 · ·

Methods, systems, and devices for differential amplifier schemes for non-switching state compensation are described. During a read operation, a first node of a memory cell may be coupled with an input of differential amplifier while a second node of the memory cell may be biased with a first voltage (e.g., to apply a first read voltage across the memory cell). The second node of the memory cell may subsequently be biased with a second voltage (e.g., to apply a second read voltage across the memory cell), which may support the differential amplifier operating in a manner that compensates for a non-switching state of the memory cell. By compensating for a non-switching state of a memory cell during read operations, read margins may be increased.

Charge separation for memory sensing

The present disclosure includes apparatuses, methods, and systems for charge separation for memory sensing. An embodiment includes applying a sensing voltage to a memory cell, and determining a data state of the memory cell based, at least in part, on a comparison of an amount of charge discharged by the memory cell while the sensing voltage is being applied to the memory cell before a particular reference time and an amount of charge discharged by the memory cell while the sensing voltage is being applied to the memory cell after the particular reference time.

Negative-capacitance ferroelectric transistor assisted resistive memory programming

A memory device is provided that includes at least one resistive memory cell, a negative capacitance field effect transistor (NC-FET) serving as a voltage amplifier, and a switch enable circuit connecting NC-FET to the memory cell. The NC-FET includes a regular FET having a metal gate terminal and a ferroelectric capacitor. The NC-FET gate terminal forms one plate of the ferroelectric (FE) capacitor. The ferroelectric capacitor includes a ferroelectric dielectric material deposited between a formed upper gate conductive contact and he metal gate terminal. To provide further flexibility, a metal layer can be deposited before the deposition of the ferroelectric material to form a MIM-like FE capacitor so that the capacitance of FE capacitance can be independently tuned by choosing the right height (H), width (W), and length (L) to achieve desired matching between |C.sub.FE| and C.sub.ox where C.sub.ox is the gate oxide capacitance and C.sub.FE is the ferroelectric capacitance.

DELAY ADJUSTMENT CIRCUITS
20220407505 · 2022-12-22 ·

Methods, systems, and devices for delay adjustment circuits are described. Amplifiers (e.g., differential amplifiers) may act like variable capacitors (e.g., due to the Miller-effect) to control delays of signals between buffer (e.g., re-driver) stages. The gains of the amplifiers may be adjusted by adjusting the currents through the amplifiers, which may change the apparent capacitances seen by the signal line (due to the Miller-effect). The capacitance of each amplifier may be the intrinsic capacitance of input transistors that make up the amplifier, or may be a discrete capacitor. In some examples, two differential stages may be inserted on a four-phase clocking system (e.g., one on 0 and 180 phases, the other on 90 and 270 phases), and may be controlled differentially to control phase-to-phase delay.