Apparatus and method for managing data in a non-volatile memory (NVM) having an array of ferroelectric memory cells (FMEs). A data set received from an external client device is programmed to a group of the FMEs at a target location in the NVM using a selected profile. The selected profile provides different program characteristics, such as applied voltage magnitude and pulse duration, to achieve desired levels of power used during the program operation, endurance of the data set, and latency effects associated with a subsequent read operation to retrieve the data set. The profile may be selected from among a plurality of profiles for different operational conditions. The ferroelectric NVM may form a portion of a solid-state drive (SSD) storage device. Different types of FMEs may be utilized including ferroelectric tunneling junctions (FTJs), ferroelectric random access memory (FeRAM), and ferroelectric field effect transistors (FeFETs).

A three-dimensional memory device includes a vertical repetition of multiple instances of a unit layer stack, memory openings vertically extending through the vertical repetition, and memory opening fill structures located within the memory openings. Each of the memory opening fill structures contains a respective vertical stack of memory elements. The unit layer stack includes, from bottom to top or from top to bottom, a cavity-free insulating layer that is free of any cavity therein, a first-type electrically conductive layer, a cavity-containing insulating layer including an encapsulated cavity therein, and a second-type electrically conductive layer.

A ferroelectric field-effect transistor (FeFET) configured as a multi-bit storage device, the FeFET including: a semiconductor substrate that has a source region in the semiconductor substrate, and a drain region in the semiconductor substrate; a gate stack over the semiconductor substrate, with the source region and the drain region extending to opposite sides of the gate stack, the gate stack including a ferroelectric layer over the semiconductor substrate, and a gate region over the ferroelectric layer. The transistor also includes first and second ends of the ferroelectric layer which are proximal correspondingly to the source and drain regions. The ferroelectric layer includes dipoles. A first set of dipoles at the first end of the ferroelectric layer has a first polarization. A second set of dipoles at the second end of the ferroelectric layer has a second polarization, the second polarization being substantially opposite of the first polarization.

The present disclosure provides a memory device, which includes a plurality of electrically bipolar variable memory devices and a storage transistor. The electrically bipolar variable memory devices are electrically connected to a plurality of word lines respectively, the storage transistor is electrically connected to the electrically bipolar variable memory devices, where one end of each of the electrically bipolar variable memory devices is electrically connected to a corresponding one of the word lines, and another end of each of the electrically bipolar variable memory devices is electrically connected to the gate of the storage transistor.

A non-volatile memory (NVM) is formed of memory cells each having multiple ferroelectric memory elements (FMEs). Each FME stores data in relation to an electrical polarity of a recording layer formed of ferroelectric or anti-ferroelectric material. Each multi-FME memory cell is coupled to a set of external control lines activated by a control circuit in a selected order to perform program and/or read operations upon the FMEs. The FMEs may share a nominally identical construction or may have different constructions. Data are programmed and written responsive to the respective program/read responses of the FMEs. Constructions can include ferroelectric tunneling junctions (FTJs), ferroelectric random access memory (FeRAM), and ferroelectric field effect transistors (FeFETs). The NVM may form a portion of a data storage device, such as a solid-state drive (SSD).

A domain switching device includes a channel region, a source region and a drain region connected to the channel region, a gate electrode isolated from contact with the channel region, an anti-ferroelectric layer between the channel region and the gate electrode, a conductive layer between the gate electrode and the anti-ferroelectric layer to contact the anti-ferroelectric layer, and a barrier layer between the anti-ferroelectric layer and the channel region.

The present disclosure relates to a memory device based on a ferroelectric capacitor, which includes a control unit for writing data into a memory cell or reading data from the memory cell and a plurality of memory cells arranged in an array; each memory cell includes an external interface, a first switch, a transistor, a first capacitor and a second capacitor, wherein at least one of the first capacitor and the second capacitor is a ferroelectric capacitor; the first switch has a first port connected with a first word line, a second port connected with a bit line, and a third port connected with one end of the first capacitor; and the transistor has a gate electrode connected with another end of the first capacitor and one end of the second capacitor, a source electrode connected with a first read terminal, and a drain electrode connected with a second read terminal, wherein another end of the second capacitor is connected with a second word line. According to the present disclosure, a polarized state of the ferroelectric capacitor in the memory cell is held or changed based on hysteresis characteristics of the ferroelectric capacitor, and the control unit is used to write data into or read data from the memory cell, which can implement non-destructive reading of data and longer endurance of a write operation.

Methods, systems, and devices for operating a memory device are described. One method includes caching data of a memory cell at a sense amplifier of a row buffer upon performing a first read of the memory cell; determining to perform at least a second read of the memory cell after performing the first read of the memory cell; and reading the data of the memory cell from the sense amplifier for at least the second read of the memory cell.

An illustrative embodiment disclosed herein is an apparatus including a non-volatile memory cell and multi-bit input circuitry that simultaneously receives a plurality of bits, receives a supply voltage, converts the plurality of bits and the supply voltage into a multiply voltage, and applies the multiply voltage to the non-volatile memory cell. The non-volatile memory cell may pass a memory cell current in response to the multiply voltage. A magnitude of the multiply voltage may represent a multiplier. The memory cell current may represent a product of the multiplier and a multiplicand stored in the non-volatile memory cell.

The present disclosure provides a semiconductor structure and a method for forming a semiconductor structure. The method for forming a semiconductor structure includes forming a semiconductor stack over a substrate, wherein the semiconductor stack includes a plurality of first semiconductor layers and a plurality of second semiconductor layers alternatively stacked, patterning the semiconductor stack to form a first fin and a second fin adjacent to the first fin, and removing the second semiconductor layers to obtain a first group of nanosheets over the first fin and a second group of nanosheets over the second fin, wherein a lateral spacing between one of the nanosheets in the first group and a corresponding nanosheet in the second group is smaller than a vertical spacing between each of the nanosheets in the first group.