Provided is a semiconductor device capable of reducing its area, operating at a high speed, or reducing its power consumption. A circuit 50 is used as a memory circuit with a function of performing an arithmetic operation. One of a circuit 80 and a circuit 90 has a region overlapping with at least part of the other of the circuit 80 and the circuit 90. Accordingly, the circuit 50 can perform the arithmetic operation that is essentially performed in the circuit 60; thus, a burden of the arithmetic operation on the circuit 60 can be reduced. Moreover, the number of times of data transmission and reception between the circuits 50 and 60 can be reduced. Furthermore, the circuit 50 functioning as a memory circuit can have a function of performing an arithmetic operation while the increase in the area of the circuit 50 is suppressed.

Provided is a semiconductor device capable of reducing its area, operating at a high speed, or reducing its power consumption. A circuit 50 is used as a memory circuit with a function of performing an arithmetic operation. One of a circuit 80 and a circuit 90 has a region overlapping with at least part of the other of the circuit 80 and the circuit 90. Accordingly, the circuit 50 can perform the arithmetic operation that is essentially performed in the circuit 60; thus, a burden of the arithmetic operation on the circuit 60 can be reduced. Moreover, the number of times of data transmission and reception between the circuits 50 and 60 can be reduced. Furthermore, the circuit 50 functioning as a memory circuit can have a function of performing an arithmetic operation while the increase in the area of the circuit 50 is suppressed.

An electronic device and a semiconductor package structure are provided. The electronic device includes a plurality of semiconductor dies stacked vertically over each other and a power supply system. The plurality of semiconductor dies are stacked over the power supply system, and the power supply system includes: a voltage generating circuit configured to generate at least one voltage; and a die enabling circuit configured to generate a die enable signal according to the at least one voltage. The at least one voltage is provided to the plurality of semiconductor dies through a power interconnecting structure, and the die enable signal is configured to enable synchronous input of the at least one voltage to the plurality of semiconductor dies.

Techniques are provided for writing a high-level state to a memory cell capable of storing three or more logic states. After a sense operation performed by a first sense component and a second sense component, a digit line may be isolated from the first sense component and the second sense component. The high-level state may be stored in the memory cell, then a second state may be stored in the memory cell, in which the second state may be a mid-level state or a low-level state. The second state may be stored based on a write-back component identifying that the second state was stored in the memory cell before the write back procedure.

A semiconductor memory device includes a memory core that performs reading and writing of data, data delivery and training blocks that are connected between first pads and the memory core, and at least one data delivery, clock generation and training block that is connected between at least one second pad and the memory core. In a first training operation, the data delivery and training blocks output first training data, received through the first pads, through the first pads as second training data. In a second training operation, at least one of the data delivery and training blocks outputs third training data, received through the at least one second pad, through at least one of the first pads as fourth training data. The second training data and the fourth training data are output in synchronization with read data strobe signals output through the at least one second pad.

A first power-supply voltage is applied to I/O cells, an I/O cell connected to a clock terminal is initially set to a threshold of a second voltage signaling, an I/O cell connected to a command terminal and I/O cells connected to data terminals are initially set as an input, and when a clock control unit detects receipt of one clock pulse and a signal voltage control unit detects a host using the second voltage signaling, a signal voltage control unit drives the I/O cell of a first data terminal high level after a second power-supply voltage is applied to I/O cells and the threshold of a second voltage signaling is set to I/O cells of the clock, command and data terminals.

A semiconductor device includes a memory cell array including a plurality of memory cells coupled between a multiplicity of word lines and one or more bit lines; and an operation circuit configured to perform a multiplication and accumulation (MAC) operation with one or more first multi-bit data provided from the one or more bit lines and one or more second multi-bit data, wherein a plurality of memory cells coupled to a bit line store a plurality of bits included in a corresponding one of the one or more first multi-bit data, and wherein the memory cell array sequentially provides the plurality of bits included in the corresponding first multi-bit data to the operation circuit.

A semiconductor device includes a memory cell array including a plurality of memory cells coupled between a multiplicity of word lines and one or more bit lines; and an operation circuit configured to perform a multiplication and accumulation (MAC) operation with one or more first multi-bit data provided from the one or more bit lines and one or more second multi-bit data, wherein a plurality of memory cells coupled to a bit line store a plurality of bits included in a corresponding one of the one or more first multi-bit data, and wherein the memory cell array sequentially provides the plurality of bits included in the corresponding first multi-bit data to the operation circuit.

An example memory sub-system includes: a plurality bank groups, wherein each bank group comprises a plurality of memory banks; a plurality of row buffers, wherein two or more row buffers of the plurality of row buffers are associated with each bank group; and a processing logic communicatively coupled to the plurality of bank groups and the plurality of row buffers, the processing logic to perform operations comprising: receiving, from a host, a command identifying a row buffer of the plurality of row buffers; and perform an operation with respect to the identified row buffer.

Computing-in-memory utilizes memory as weight for multiply-and-accumulate (MAC) operations. Input data multiplies weights to produce output data during the operation. Method of data conversion from input data, memory element to output data is described to enhance the computing efficiency.